1.
Rencz, Márta ✉ ; Farkas, Gábor ; Sárkány, Zoltán ; Vass-Várnai, András
The Use of Thermal Transient Testing
In: Rencz, Marta ✉; Farkas, Gábor; Poppe, András (eds.) Theory and Practice of Thermal Transient Testing of Electronic Components
Cham, Switzerland : Springer (2022) pp. 319-352. Paper: Chapter 7 , 34 p.
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2.
Farkas, Gábor ✉ ; Poppe, András ; Sárkány, Zoltán ; Vass-Várnai, András
Thermal Transient Measurements on Various Electronic Components
In: Rencz, Marta ✉; Farkas, Gábor; Poppe, András (eds.) Theory and Practice of Thermal Transient Testing of Electronic Components
Cham, Switzerland : Springer (2022) pp. 209-318. Paper: Chapter 6 , 110 p.
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Publication:33589441 Published Core Citing Chapter in Book (Chapter ) Scientific
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3.
Wong, Voon Hon ; Vass-Varnai, Andras ; Caruso, Antonio ; Cho, Young Joon ; Lee, Yong Seoung ; Lee, Kwon Hyung
Rapid Assessment of Semiconductor Thermal Quality
In: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
(2021) pp. 1-6. , 6 p.
DOI WoS Other URL
Publication:32765962 Validated Core Citing Chapter in Book (Conference paper ) Scientific
Conference paper (Chapter in Book) | Scientific[32765962] [Validated]
4.
Wong, Voon Hon ; Vass-Varnai, Andras ; Caruso, Antonio ; Hara, Tomoaki ; Hsu, Alvin ; Wang, Gang
Detection Of Die Attach Defects Through Rapid Thermal Transient Tests
In: 2021 International Conference on Electronics Packaging (ICEP)
(2021) pp. 117-118. , 2 p.
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Publication:32765939 Published Core Citing Chapter in Book (Conference paper ) Scientific
Citing papers: 2 | Independent citation: 0 | Self citation: 2 | Unknown citation: 0 | Number of citations in WoS: 2 | WoS/Scopus assigned: 2 | Number of citations with DOI: 2
Conference paper (Chapter in Book) | Scientific[32765939] [Approved]
All citations+mentions: 2, External citations: 0, Self citations: 2, Unhandled citations: 0
5.
András, Poppe ; András, Vass-Várnai ; Zoltán, Sárkány ; Márta, Rencz ; Gusztáv, Hantos ; Gábor, Farkas
Suggestions for Extending the Scope of the Transient Dual Interface Method
In: Vadim, Tsoi; Lorenzo, Codecasa; Bernhard, Wunderle (eds.) Proceedings of the 27th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'21 online)
Piscataway (NJ), United States of America : Institute of Electrical and Electronics Engineers (2021) pp. 23-30. , 8 p.
DOI IEEE Xplore WoS Scopus
Publication:32236544 Validated Core Citing Chapter in Book (Conference paper ) Scientific
Citing papers: 4 | Independent citation: 4 | Self citation: 0 | Unknown citation: 0 | Number of citations in WoS: 4 | Number of citations in Scopus: 4 | WoS/Scopus assigned: 4 | Number of citations with DOI: 4
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6.
Vass-Varnai, A. ; Cho, Y.J. ; Farkas, G. ; Rencz, M.
An Alternative Method to Accurately Determine the Thermal Resistance of SiC MOSFET Structures with Discrete Diodes
In: IPEC, - ECCE Asia; Sangyō, Ōyō Bumon; IEEE, Power Electronics Society; IEEE, Industry Applications Society (eds.) 2018 INTERNATIONAL POWER ELECTRONICS CONFERENCE (IPEC-NIIGATA 2018 -ECCE ASIA)
Piscataway (NJ), United States of America : Institute of Electrical and Electronics Engineers (2018) pp. 137-141. Paper: 8507995 , 5 p.
DOI WoS Scopus
Publication:31322686 Published Core Citing Chapter in Book (Conference paper ) Scientific
Citing papers: 2 | Independent citation: 1 | Self citation: 1 | Unknown citation: 0 | Number of citations in WoS: 2 | Number of citations in Scopus: 1 | WoS/Scopus assigned: 2 | Number of citations with DOI: 1
Conference paper (Chapter in Book) | Scientific[31322686] [Approved]
All citations+mentions: 2, External citations: 1, Self citations: 1, Unhandled citations: 0
7.
Vass-Várnai, András
New Methods for the Investigation of Modern Electronics Packaging Materials Using Thermal Transient Measurements 92 p.
Budapesti Műszaki és Gazdaságtudományi Egyetem, Villamosmérnöki Tudományok Doktori Iskola, Kerecsen Istvánné Rencz Márta Dissertation submission year: 2017, Accepted: 2017 Published/defended: 2017
ODT védés Teljes dokumentum Handle
Publication:3412157 Checked Core Citing Thesis (PhD ) Scientific
PhD (Thesis) | Scientific[3412157] [Checked]
8.
Fang, Yake ; Wang, Gang ; Xiaodan, Chen ; Wong, Voon Hon ; Xing, Fu ; Vass-Varnai, Andras
Detailed analysis of IC packages using thermal transient testing and CFD modelling for communication device applications
In: András, Poppe (eds.) 2016 22nd International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'16)
New York City, United States of America : Institute of Electrical and Electronics Engineers (2016) 349 p. pp. 164-168. , 5 p.
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All citations+mentions: 1, External citations: 1, Self citations: 0, Unhandled citations: 0
9.
Attila, Szel ; Zoltan, Sarkany ; Marton, Bein ; Robin, Bornoff ; Andras, Vass-Varnai ; Marta, Rencz
Lifetime estimation of power electronics modules considering the target application
In: Paul, Wesling (eds.) Proceedings of the 31st IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'15)
New York City, United States of America : IEEE (2015) pp. 332-335. , 4 p.
DOI WoS Scopus
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Conference paper (Chapter in Book) | Scientific[2911949] [Validated]
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10.
Attila, Szel ; Zoltan, Sarkany ; Marton, Bein ; Robin, Bornoff ; Andras, Vass-Varnai ; Marta, Rencz
Mission profile driven component design for adjusting product lifetime on system level
In: IEEE (eds.) Proceedings of International Conference on Electronics Packaging
New York City, United States of America : IEEE (2015) pp. 385-389. , 5 p.
DOI WoS Scopus
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2024-05-07 23:30