TY  - JOUR
AU  - Poppe, András
TI  - Simulation of LED Based Luminaires by Using Multi-Domain Compact Models of LEDs and Compact Thermal Models of their Thermal Environment
JF  - MICROELECTRONICS RELIABILITY
J2  - MICROELECTRON RELIAB
VL  - 72
PY  - 2017
IS  - 5
SP  - 65
EP  - 74
PG  - 10
SN  - 0026-2714
DO  - 10.1016/j.microrel.2017.03.039
UR  - https://m2.mtmt.hu/api/publication/3207001
ID  - 3207001
AB  - Fast and accurate prediction of hot lumens of LEDs installed 
in luminaires is an important step in the design of robust 
and reliable products. A possible approach to this is to 
create a multi-domain circuit model of a complete LED chip + 
package + luminaire system that can be simulated by any 
Spice-like circuit simulator with electro-thermal 
capabilities. Many LED chip and LED package models and 
modeling techniques have been published recently, but compact 
thermal modeling of luminaires as multi heat-source system 
was not yet dealt with in the literature. This paper aims to 
fill this gap be describing a systematic approach for system 
(luminaire) level analysis aimed at solving the combined 
thermal, electrical and light output simulation problem 
consistently by describing a method for creating a compact 
thermal model of LED luminaries with an approach borrowed 
from the layout based electro-thermal simulation of analog 
ICs. The applicability of the described method is 
demonstrated with a real life example, including the 
validation of the results with thermal measurements.
LA  - English
DB  - MTMT
ER  - 

TY  - CHAP
AU  - Nikolay, Vakrilov
AU  - Anna, Stoynova
AU  - Nadezhda, Kafadarova
ED  - J, Nikolic
ED  - H, Wohlrabe
TI  - Application of CFD modeling to solve problems in thermal design of LED applications in the initial project phase
T2  - 2017 40th IEEE International Spring Seminar on Electronics Technology
PB  - Institute of Electrical and Electronics Engineers (IEEE)
CY  - Piscataway (NJ)
SN  - 9781538605820
PY  - 2017
SP  - 1
EP  - 4
PG  - 4
DO  - 10.1109/ISSE.2017.8000902
UR  - https://m2.mtmt.hu/api/publication/26785208
ID  - 26785208
LA  - English
DB  - MTMT
ER  - 

TY  - CHAP
AU  - Poppe, András
AU  - Hegedüs, János
AU  - Szalai, Albin
AU  - Robin, Bornoff
AU  - James, Dyson
ED  - R, Mohammed
ED  - V, Mulay
ED  - J, Galloway
TI  - Creating multi-port thermal network models of LED luminaires for application in system level multi-domain simulation using Spice-like solvers
T2  - Proceedings of the 32nd IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'16)
PB  - Institute of Electrical and Electronics Engineers (IEEE)
CY  - San Jose (CA), California
SN  - 9781509023363
PY  - 2016
SP  - 44
EP  - 49
PG  - 6
DO  - 10.1109/SEMI-THERM.2016.7458444
UR  - https://m2.mtmt.hu/api/publication/2995166
ID  - 2995166
AB  - The multi-domain operation of LEDs characterized by the tight 
coupling between their electrical, thermal and optical 
properties manifests not only on chip and package level, but 
has to be tracked on LED products of higher integration level 
such as LED modules or LED luminaires. At present the system 
level numerical analysis of such integrated LED products is 
typically performed by the different design teams dealing 
with the electrical, thermal and optical design separately. 
One reason of this practice is the lack of a unified modeling 
approach in which the right models are used for the chip, 
package, module and luminaire (system) level. Spice-like LED 
models can address this issue. The present paper describes 
how thermal network models of luminaires can be created in an 
automated way to allow system level multi-domain simulations 
of complete LED luminaires.
LA  - English
DB  - MTMT
ER  - 

TY  - CHAP
AU  - Byron, Blackmore
TI  - Automatic Calibration Of Detailed IC Package Models
T2  - Proceedings of the 32nd IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'16)
PB  - Institute of Electrical and Electronics Engineers (IEEE)
SN  - 9781509023363
PY  - 2016
SP  - 105
EP  - 113
PG  - 9
DO  - 10.1109/SEMI-THERM.2016.7458454
UR  - https://m2.mtmt.hu/api/publication/25511158
ID  - 25511158
LA  - English
DB  - MTMT
ER  - 

TY  - JOUR
AU  - Mah, Jian Wen
AU  - Lee, Boon Kiat
AU  - Devarajan, Mutharasu
TI  - Thermal Impedance Measurement on Different Chip Arrangements for Various Multichip LEDs Application
JF  - IEEE TRANSACTIONS ON ELECTRON DEVICES
J2  - IEEE T ELECTRON DEV
VL  - 62
PY  - 2015
IS  - 9
SP  - 2906
EP  - 2912
PG  - 7
SN  - 0018-9383
DO  - 10.1109/TED.2015.2451215
UR  - https://m2.mtmt.hu/api/publication/25412397
ID  - 25412397
AB  - The effect of thermal impedance of three chip arrangements in a multichip light-emitting diode (LED) package has been discussed with each chip attached to a heat sink with thermal interface material. Each orientation represents different existing lighting applications such as T8 tube, MR 16 down light, and spotlight. In this paper, the emitter and sensor current are constantly maintained. One LED of each orientation is driven, while other LEDs are sensed until all LEDs are driven with the emission current of all the orientations. Comparisons are made between the thermal impedance matrix pairs of each LED arrangement to illustrate the difference in the thermal dissipation. Thermal impedance curves show the fluctuation in the thermal flow inside the package, implying the reciprocal behavior of each orientation. This paper further explains the reciprocal behavior of the chips and the importance of the orientation based on junction temperature. Moreover, the principle of linear superposition is implemented to estimate the junction temperature matrix. The theoretical and the experimental results are compared using thermal transient tester. Among three orientations, the square-shaped LED arrangement shows an average junction temperature of 116 degrees C within the package while exerting the highest change of junction temperature of 4 degrees C, comparing with the linear superposition method.
LA  - English
DB  - MTMT
ER  - 

TY  - CHAP
AU  - Vass-Várnai, András
AU  - Sárkány, Zoltán
AU  - Attila, Szel
AU  - Kerecsen Istvánné Rencz, Márta
TI  - Simulation Based Method to Eliminate the Effect of Electrical Transients from Thermal Transient Measurements
T2  - International Conference on Electronics Packaging, ICEP 2014
PB  - Institute of Electrical and Electronics Engineers (IEEE)
CY  - Toyama
CY  - New York, New York
SN  - 9784904090107
T3  - International Conference on Electronics Packaging (ICEP)
PY  - 2014
SP  - 591
EP  - 595
PG  - 5
DO  - 10.1109/ICEP.2014.6826748
UR  - https://m2.mtmt.hu/api/publication/2699447
ID  - 2699447
LA  - English
DB  - MTMT
ER  - 

TY  - CHAP
AU  - Vass-Várnai, András
AU  - Laky, Sándor
AU  - Sárkány, Zoltán
AU  - Csaba, Barna
AU  - Kerecsen Istvánné Rencz, Márta
ED  - Wesling, P
ED  - Erickson, K
TI  - Issues of finding a proper golden-reference sample for TIM tester calibration
T2  - 29th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'13)
PB  - IEEE Press
CY  - New York, New York
SN  - 9781467364287
T3  - Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium, ISSN 1065-2221
PY  - 2013
SP  - 200
EP  - 205
PG  - 6
DO  - 10.1109/SEMI-THERM.2013.6526829
UR  - https://m2.mtmt.hu/api/publication/2696519
ID  - 2696519
N1  - Befoglaló mű WoS és MTMT megnevezése nem azonos. Az MTMT-ben 1998 óta standardizált konferenciamegnevezéssel lett a befoglaló mű rögzítve.
LA  - English
DB  - MTMT
ER  - 

TY  - CHAP
AU  - Ching, CP
AU  - Devarajan, M
ED  - Ibrahim, NB
ED  - AbdShukor, R
ED  - Rahman, IA
ED  - Ibarahim, Z
ED  - Yap, CC
TI  - Factors that Influence Thermal Transient Measurement of High Power Infrared Emitter
T2  - AIP Conference Proceedings
PB  - American Institute of Physics (AIP)
CY  - Melville (NY)
SN  - 0735411530
T3  - AIP Conference Proceedings, ISSN 0094-243X
PY  - 2013
SP  - 87
EP  - 92
PG  - 6
DO  - 10.1063/1.4803574
UR  - https://m2.mtmt.hu/api/publication/23892704
ID  - 23892704
LA  - English
DB  - MTMT
ER  - 

TY  - CONF
AU  - Vass-Várnai, András
AU  - Robin, Bornoff
AU  - Ress, Sándor László
AU  - Sárkány, Zoltán
AU  - Hodossy, Sándor
AU  - Kerecsen Istvánné Rencz, Márta
TI  - Accurate thermal characterization of power semiconductor packages by thermal simulation and measurements
T2  - Collection of Papers Presented at the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'11)
C1  - Grenoble
PY  - 2011
SP  - 324
EP  - 329
PG  - 6
UR  - https://m2.mtmt.hu/api/publication/2675954
ID  - 2675954
AB  - In this paper the possibility of generating a compact thermal
model based on thermal transient measurements is discussed and
evaluated. A case study of a power diode in a cylindrical-shaped
copper package is shown. The detailed model of the package is
built and simulated in a CFD based thermal simulator software.
The measurement results are compared to the results of the
simulations and after some model refinement we found good
agreement. The compact model of the package is also identified
based on the structure functions generated from the real
measurement. The case-node is determined using the standard
dual-interface method. The resulting compact model has proven
to be a perfect representation of the real package as the 
structure
functions generated based on measurements and corresponding
simulation results match perfectly.
LA  - English
DB  - MTMT
ER  - 

TY  - CHAP
AU  - Vass-Várnai, András
AU  - Robin, Bornoff
AU  - Sárkány, Zoltán
AU  - Ress, Sándor László
AU  - Kerecsen Istvánné Rencz, Márta
ED  - IEEE, null
TI  - Measurement Based Compact Thermal Model Creation - Accurate Approach to Neglect Inaccurate TIM Conductivity Data
T2  - Proceedings of the 13th Electronics Packaging Technology Conference (EPCT 2011)
PB  - IEEE Press
CY  - New York, New York
SN  - 9781457719813
PY  - 2011
SP  - 67
EP  - 72
PG  - 6
DO  - 10.1109/EPTC.2011.6184388
UR  - https://m2.mtmt.hu/api/publication/2675838
ID  - 2675838
AB  - In this paper two possible ways are investigated to create accurate thermal models without having validated information on the thermal properties of the applied thermal interface materials. One way is the calibration of a detailed numerical thermal model based on the physical information which can be derived from experimental structure functions. In the paper we show a complete calibration procedure using a TO-220 package as an example.
Another approach is the generation of dynamic compact models based on real measurements. In order to apply this approach one has to identify the junction-to-case thermal resistance of the tested package using the JEDEC JESD 51-14 standard.
LA  - English
DB  - MTMT
ER  -