TY - JOUR AU - Poppe, András TI - Simulation of LED Based Luminaires by Using Multi-Domain Compact Models of LEDs and Compact Thermal Models of their Thermal Environment JF - MICROELECTRONICS RELIABILITY J2 - MICROELECTRON RELIAB VL - 72 PY - 2017 IS - 5 SP - 65 EP - 74 PG - 10 SN - 0026-2714 DO - 10.1016/j.microrel.2017.03.039 UR - https://m2.mtmt.hu/api/publication/3207001 ID - 3207001 AB - Fast and accurate prediction of hot lumens of LEDs installed in luminaires is an important step in the design of robust and reliable products. A possible approach to this is to create a multi-domain circuit model of a complete LED chip + package + luminaire system that can be simulated by any Spice-like circuit simulator with electro-thermal capabilities. Many LED chip and LED package models and modeling techniques have been published recently, but compact thermal modeling of luminaires as multi heat-source system was not yet dealt with in the literature. This paper aims to fill this gap be describing a systematic approach for system (luminaire) level analysis aimed at solving the combined thermal, electrical and light output simulation problem consistently by describing a method for creating a compact thermal model of LED luminaries with an approach borrowed from the layout based electro-thermal simulation of analog ICs. The applicability of the described method is demonstrated with a real life example, including the validation of the results with thermal measurements. LA - English DB - MTMT ER - TY - CHAP AU - Nikolay, Vakrilov AU - Anna, Stoynova AU - Nadezhda, Kafadarova ED - J, Nikolic ED - H, Wohlrabe TI - Application of CFD modeling to solve problems in thermal design of LED applications in the initial project phase T2 - 2017 40th IEEE International Spring Seminar on Electronics Technology PB - Institute of Electrical and Electronics Engineers (IEEE) CY - Piscataway (NJ) SN - 9781538605820 PY - 2017 SP - 1 EP - 4 PG - 4 DO - 10.1109/ISSE.2017.8000902 UR - https://m2.mtmt.hu/api/publication/26785208 ID - 26785208 LA - English DB - MTMT ER - TY - CHAP AU - Poppe, András AU - Hegedüs, János AU - Szalai, Albin AU - Robin, Bornoff AU - James, Dyson ED - R, Mohammed ED - V, Mulay ED - J, Galloway TI - Creating multi-port thermal network models of LED luminaires for application in system level multi-domain simulation using Spice-like solvers T2 - Proceedings of the 32nd IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'16) PB - Institute of Electrical and Electronics Engineers (IEEE) CY - San Jose (CA), California SN - 9781509023363 PY - 2016 SP - 44 EP - 49 PG - 6 DO - 10.1109/SEMI-THERM.2016.7458444 UR - https://m2.mtmt.hu/api/publication/2995166 ID - 2995166 AB - The multi-domain operation of LEDs characterized by the tight coupling between their electrical, thermal and optical properties manifests not only on chip and package level, but has to be tracked on LED products of higher integration level such as LED modules or LED luminaires. At present the system level numerical analysis of such integrated LED products is typically performed by the different design teams dealing with the electrical, thermal and optical design separately. One reason of this practice is the lack of a unified modeling approach in which the right models are used for the chip, package, module and luminaire (system) level. Spice-like LED models can address this issue. The present paper describes how thermal network models of luminaires can be created in an automated way to allow system level multi-domain simulations of complete LED luminaires. LA - English DB - MTMT ER - TY - CHAP AU - Byron, Blackmore TI - Automatic Calibration Of Detailed IC Package Models T2 - Proceedings of the 32nd IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'16) PB - Institute of Electrical and Electronics Engineers (IEEE) SN - 9781509023363 PY - 2016 SP - 105 EP - 113 PG - 9 DO - 10.1109/SEMI-THERM.2016.7458454 UR - https://m2.mtmt.hu/api/publication/25511158 ID - 25511158 LA - English DB - MTMT ER - TY - JOUR AU - Mah, Jian Wen AU - Lee, Boon Kiat AU - Devarajan, Mutharasu TI - Thermal Impedance Measurement on Different Chip Arrangements for Various Multichip LEDs Application JF - IEEE TRANSACTIONS ON ELECTRON DEVICES J2 - IEEE T ELECTRON DEV VL - 62 PY - 2015 IS - 9 SP - 2906 EP - 2912 PG - 7 SN - 0018-9383 DO - 10.1109/TED.2015.2451215 UR - https://m2.mtmt.hu/api/publication/25412397 ID - 25412397 AB - The effect of thermal impedance of three chip arrangements in a multichip light-emitting diode (LED) package has been discussed with each chip attached to a heat sink with thermal interface material. Each orientation represents different existing lighting applications such as T8 tube, MR 16 down light, and spotlight. In this paper, the emitter and sensor current are constantly maintained. One LED of each orientation is driven, while other LEDs are sensed until all LEDs are driven with the emission current of all the orientations. Comparisons are made between the thermal impedance matrix pairs of each LED arrangement to illustrate the difference in the thermal dissipation. Thermal impedance curves show the fluctuation in the thermal flow inside the package, implying the reciprocal behavior of each orientation. This paper further explains the reciprocal behavior of the chips and the importance of the orientation based on junction temperature. Moreover, the principle of linear superposition is implemented to estimate the junction temperature matrix. The theoretical and the experimental results are compared using thermal transient tester. Among three orientations, the square-shaped LED arrangement shows an average junction temperature of 116 degrees C within the package while exerting the highest change of junction temperature of 4 degrees C, comparing with the linear superposition method. LA - English DB - MTMT ER - TY - CHAP AU - Vass-Várnai, András AU - Sárkány, Zoltán AU - Attila, Szel AU - Kerecsen Istvánné Rencz, Márta TI - Simulation Based Method to Eliminate the Effect of Electrical Transients from Thermal Transient Measurements T2 - International Conference on Electronics Packaging, ICEP 2014 PB - Institute of Electrical and Electronics Engineers (IEEE) CY - Toyama CY - New York, New York SN - 9784904090107 T3 - International Conference on Electronics Packaging (ICEP) PY - 2014 SP - 591 EP - 595 PG - 5 DO - 10.1109/ICEP.2014.6826748 UR - https://m2.mtmt.hu/api/publication/2699447 ID - 2699447 LA - English DB - MTMT ER - TY - CHAP AU - Vass-Várnai, András AU - Laky, Sándor AU - Sárkány, Zoltán AU - Csaba, Barna AU - Kerecsen Istvánné Rencz, Márta ED - Wesling, P ED - Erickson, K TI - Issues of finding a proper golden-reference sample for TIM tester calibration T2 - 29th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'13) PB - IEEE Press CY - New York, New York SN - 9781467364287 T3 - Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium, ISSN 1065-2221 PY - 2013 SP - 200 EP - 205 PG - 6 DO - 10.1109/SEMI-THERM.2013.6526829 UR - https://m2.mtmt.hu/api/publication/2696519 ID - 2696519 N1 - Befoglaló mű WoS és MTMT megnevezése nem azonos. Az MTMT-ben 1998 óta standardizált konferenciamegnevezéssel lett a befoglaló mű rögzítve. LA - English DB - MTMT ER - TY - CHAP AU - Ching, CP AU - Devarajan, M ED - Ibrahim, NB ED - AbdShukor, R ED - Rahman, IA ED - Ibarahim, Z ED - Yap, CC TI - Factors that Influence Thermal Transient Measurement of High Power Infrared Emitter T2 - AIP Conference Proceedings PB - American Institute of Physics (AIP) CY - Melville (NY) SN - 0735411530 T3 - AIP Conference Proceedings, ISSN 0094-243X PY - 2013 SP - 87 EP - 92 PG - 6 DO - 10.1063/1.4803574 UR - https://m2.mtmt.hu/api/publication/23892704 ID - 23892704 LA - English DB - MTMT ER - TY - CONF AU - Vass-Várnai, András AU - Robin, Bornoff AU - Ress, Sándor László AU - Sárkány, Zoltán AU - Hodossy, Sándor AU - Kerecsen Istvánné Rencz, Márta TI - Accurate thermal characterization of power semiconductor packages by thermal simulation and measurements T2 - Collection of Papers Presented at the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'11) C1 - Grenoble PY - 2011 SP - 324 EP - 329 PG - 6 UR - https://m2.mtmt.hu/api/publication/2675954 ID - 2675954 AB - In this paper the possibility of generating a compact thermal model based on thermal transient measurements is discussed and evaluated. A case study of a power diode in a cylindrical-shaped copper package is shown. The detailed model of the package is built and simulated in a CFD based thermal simulator software. The measurement results are compared to the results of the simulations and after some model refinement we found good agreement. The compact model of the package is also identified based on the structure functions generated from the real measurement. The case-node is determined using the standard dual-interface method. The resulting compact model has proven to be a perfect representation of the real package as the structure functions generated based on measurements and corresponding simulation results match perfectly. LA - English DB - MTMT ER - TY - CHAP AU - Vass-Várnai, András AU - Robin, Bornoff AU - Sárkány, Zoltán AU - Ress, Sándor László AU - Kerecsen Istvánné Rencz, Márta ED - IEEE, null TI - Measurement Based Compact Thermal Model Creation - Accurate Approach to Neglect Inaccurate TIM Conductivity Data T2 - Proceedings of the 13th Electronics Packaging Technology Conference (EPCT 2011) PB - IEEE Press CY - New York, New York SN - 9781457719813 PY - 2011 SP - 67 EP - 72 PG - 6 DO - 10.1109/EPTC.2011.6184388 UR - https://m2.mtmt.hu/api/publication/2675838 ID - 2675838 AB - In this paper two possible ways are investigated to create accurate thermal models without having validated information on the thermal properties of the applied thermal interface materials. One way is the calibration of a detailed numerical thermal model based on the physical information which can be derived from experimental structure functions. In the paper we show a complete calibration procedure using a TO-220 package as an example. Another approach is the generation of dynamic compact models based on real measurements. In order to apply this approach one has to identify the junction-to-case thermal resistance of the tested package using the JEDEC JESD 51-14 standard. LA - English DB - MTMT ER -