TY  - JOUR
AU  - Swan, IR
AU  - Bryant, AT
AU  - Mawby, PA
TI  - Fast 3D thermal simulation of power module packaging
JF  - INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS
J2  - INT J NUMER MODEL EL
VL  - 25
PY  - 2012
IS  - 4
SP  - 378
EP  - 399
PG  - 22
SN  - 0894-3370
DO  - 10.1002/jnm.841
UR  - https://m2.mtmt.hu/api/publication/26507310
ID  - 26507310
N1  - Megjegyzés-23892552
An alternative approach to accurate thermal simulation of device packaging is the Fourier 
series solution [5,26–32]. This is an analytic method of solving the heat equation on the 
basis of the concept of computing solutions as sums of the infinite series. 
...
Unlike in [5,27–30], it must also co-simulate with the converter simulator to allow long 
mission profiles to be simulated.
LA  - English
DB  - MTMT
ER  - 

TY  - JOUR
AU  - S A, Wartenberg
AU  - G, Zhao
AU  - Q H, Liu
TI  - Electrical and thermal cosimulation of GaAs interconnects
JF  - IEEE TRANSACTIONS ON ADVANCED PACKAGING
J2  - IEEE T ADV PACKAGING
VL  - 30
PY  - 2007
IS  - 4
SP  - 758
EP  - 762
PG  - 5
SN  - 1521-3323
DO  - 10.1109/TADVP.2007.901651
UR  - https://m2.mtmt.hu/api/publication/23932483
ID  - 23932483
N1  - Megjegyzés-23892400
doi:10.1109/TADVP.2007.901651
LA  - English
DB  - MTMT
ER  - 

TY  - JOUR
AU  - L, Codecasa
AU  - D D'Amore, null
AU  - P, Maffezzoni
TI  - Compact modeling of electrical devices for electrothermal analysis
JF  - IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS
J2  - IEEE T CIRCUITS-I
VL  - 50
PY  - 2003
IS  - 4
SP  - 465
EP  - 476
PG  - 12
SN  - 1549-8328
DO  - 10.1109/TCSI.2003.811422
UR  - https://m2.mtmt.hu/api/publication/23932482
ID  - 23932482
LA  - English
DB  - MTMT
ER  - 

TY  - CHAP
AU  - Kerecsen Istvánné Rencz, Márta
AU  - Székely, Vladimir
AU  - Poppe, András
ED  - Wehn, N
ED  - Verkest, D
TI  - A fast algorithm for the layout based electro-thermal simulation
T2  - Proceedings of the Design, Automation and Test in Europe Conference and Exhibition (DATE'03)
PB  - IEEE Computer Society Press
CY  - Los Alamitos (CA)
SN  - 0769518702
PY  - 2003
SP  - 1032
EP  - 1037
PG  - 6
DO  - 10.1109/DATE.2003.1253740
UR  - https://m2.mtmt.hu/api/publication/2613617
ID  - 2613617
AB  - A new algorithm has been developed for the layout based direct electro-thermal simulation of integrated circuits. The advantage of the direct electro-thermal simulation over simulator coupling is, that very fast changes can also be considered, the drawback is that the thermal nodes are added to the number of nodes of the network to be simulated. The novelties of our method are the modeling and the solution of the thermal structure. This paper presents the algorithm of the time constant spectrum based FOSTER chain matrix thermal modeling, and the new algorithm of the coupled electro-thermal solution, where parts of the network, which represent the thermal behavior, are not computed in all steps of the iteration. This speeded up algorithm works both in the time-, and in the frequency domain. A simulation example demonstrates a typical application: the prediction of how the layout arrangement and the packaging of an analogue integrated circuit influence the electrical parameters.
LA  - English
DB  - MTMT
ER  - 

TY  - CHAP
AU  - Kerecsen Istvánné Rencz, Márta
AU  - Székely, Vladimir
AU  - Poppe, András
AU  - B, Courtois
ED  - Bergman, K
ED  - Courtois, B
ED  - Karam, JM
ED  - Korvink, J
ED  - Markus, K
ED  - Michel, B
TI  - Electro-thermal simulation of MEMS elements
T2  - Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'03)
PB  - IEEE
CY  - New York, New York
SN  - 078037066X
PY  - 2003
SP  - 15
EP  - 20
PG  - 6
DO  - 10.1109/DTIP.2003.1287001
UR  - https://m2.mtmt.hu/api/publication/2613621
ID  - 2613621
LA  - English
DB  - MTMT
ER  - 

TY  - GEN
AU  - PULTRONICS, Inc
TI  - TED software tools for thermal evaluation of integrated circuits. White Paper Version 2.1
TS  - White Paper Version 2.1
PY  - 2003
PG  - 29
UR  - https://m2.mtmt.hu/api/publication/25401610
ID  - 25401610
LA  - English
DB  - MTMT
ER  - 

TY  - CHAP
AU  - Kerecsen Istvánné Rencz, Márta
AU  - Székely, Vladimir
AU  - Poppe, András
AU  - Courtois, B
ED  - Laudon, M
ED  - Romanowicz, B
TI  - Algorithmic and Modeling Aspects in the Electro-thermal Simulation of Thermally Operated Microsystems
T2  - Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show (NANOTECH'03)
PB  - National Nanotechnology Infrastructure Network
CY  - Cambridge
SN  - 0972842217
PY  - 2003
SP  - 476
EP  - 479
PG  - 4
UR  - https://m2.mtmt.hu/api/publication/2607072
ID  - 2607072
AB  - A new algorithm has been developed for the layout based electro-thermal simulation of integrated circuits and MEMS, using simultaneous iteration. The general advantage of this method over simulator coupling is that, in contrast with the case of simulator coupling, very fast changes can also be considered. The usual drawback is however, that the thermal nodes have to be added to the nodes of the electrical network, rendering usually huge networks to be simulated. The novelties of our method are the modeling and the solution of the thermal structure that results in fastened calculations. The novelty of the modeling is that the thermal impedances are represented with the discretised thermal time-constant spectrum. The novelty of the solution algorithm is that in our method pre-computed solutions are used for the representation of the linear thermal sub-network, effectively reducing the number of thermal nodes that are participating in the iteration. This fastened algorithm works both in the time-, and in the frequency domain. The paper will shortly summarize the algorithm of the time constant spectrum based thermal modeling and the new algorithm of the electro-thermal co-simulation. In order to verify the correctness of the simulated electrical and thermal values, the simulated results will be compared with the measured results of a realised electro-thermal converter.
LA  - English
DB  - MTMT
ER  - 

TY  - JOUR
AU  - Batty, W
AU  - Christoffersen, CE
AU  - Panks, AJ
AU  - David, S
AU  - Snowden, CM
AU  - Steer, MB
TI  - Electrothremal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3D systems
JF  - IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
J2  - IEEE T COMPON PACK T
VL  - 24
PY  - 2001
IS  - 4
SP  - 566
EP  - 590
PG  - 25
SN  - 1521-3331
DO  - 10.1109/6144.974944
UR  - https://m2.mtmt.hu/api/publication/24029418
ID  - 24029418
N1  - :doi 10.1109/6144.974944
LA  - English
DB  - MTMT
ER  - 

TY  - CHAP
AU  - Batty, W
AU  - Christoffersen, CE
AU  - David, S
AU  - Panks, AJ
AU  - Johnson, RG
AU  - Snowden, CM
AU  - Steer, MB
ED  - IEEE, null
TI  - Fully physical time-dependent compact thermal modelling of complex non linear 3-dimensional systems for device and circuit level electro-thermal CAD
T2  - Proceedings of the 17th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'01)
PB  - IEEE Press
CY  - New York, New York
SN  - 0780366492
T3  - Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium, ISSN 1065-2221
PY  - 2001
SP  - 71
EP  - 84
PG  - 14
DO  - 10.1109/STHERM.2001.915149
UR  - https://m2.mtmt.hu/api/publication/24029549
ID  - 24029549
LA  - English
DB  - MTMT
ER  - 

TY  - JOUR
AU  - Franke, T.
AU  - Froehler, U.
TI  - Thermal modeling of semiconductor packages
JF  - MICROELECTRONICS JOURNAL
J2  - MICROELECTRON J
VL  - 32
PY  - 2001
IS  - 10-11
SP  - 809
EP  - 816
PG  - 8
SN  - 0026-2692
DO  - 10.1016/S0026-2692(01)00067-2
UR  - https://m2.mtmt.hu/api/publication/23932485
ID  - 23932485
N1  - Source: PublEx
LA  - English
DB  - MTMT
ER  - 

TY  - JOUR
AU  - Kerecsen Istvánné Rencz, Márta
AU  - Székely, Vladimir
TI  - Dynamic Thermal Multiport Modeling of IC Packages
JF  - IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
J2  - IEEE T COMPON PACK T
VL  - 24
PY  - 2001
IS  - 4
SP  - 596
EP  - 604
PG  - 9
SN  - 1521-3331
DO  - 10.1109/6144.974946
UR  - https://m2.mtmt.hu/api/publication/2607000
ID  - 2607000
AB  - The dynamic thermal behavior of electronic subsystems is characterized by their dynamic compact models. These models have to be similar to the steady state models in describing the fact that the heat is usually leaving on different locations (ports), necessitating multiport description of the thermal behavior. In our paper we present a method suitable for direct generation of multiport dynamic compact thermal models from a series of thermal transient simulations or measurements. The generated RC electrical equivalent circuit model, exercised with a network simulator program provided the same transient functions as the measured ones for various boundary conditions, proving the accuracy of the method.
LA  - English
DB  - MTMT
ER  - 

TY  - CHAP
AU  - Franke, T.
AU  - Froehler, U.
ED  - B, Courtois
TI  - Thermal modeling of semiconductor packages
T2  - Proceedings of the 6th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'00)
PB  - TIMA Laboratory
CY  - Budapest
SN  - 2913329519
PY  - 2000
SP  - 193
EP  - 198
PG  - 6
UR  - https://m2.mtmt.hu/api/publication/23932487
ID  - 23932487
LA  - English
DB  - MTMT
ER  - 

TY  - CHAP
AU  - T, Franke
ED  - Anon, null
TI  - Thermal modeling of multichip assemblies
T2  - Proceedings of the 18th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'99)
PB  - TIMA Laboratory
CY  - Grenoble
SN  - 2913329322
PY  - 1999
SP  - 107
EP  - 110
PG  - 4
UR  - https://m2.mtmt.hu/api/publication/23932486
ID  - 23932486
N1  - Source: PublEx
LA  - English
DB  - MTMT
ER  -