@article{MTMT:26507310,
	title = {Fast 3D thermal simulation of power module packaging},
	url = {https://m2.mtmt.hu/api/publication/26507310},
	author = {Swan, IR and Bryant, AT and Mawby, PA},
	doi = {10.1002/jnm.841},
	journal-iso = {INT J NUMER MODEL EL},
	journal = {INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS},
	volume = {25},
	unique-id = {26507310},
	issn = {0894-3370},
	year = {2012},
	eissn = {1099-1204},
	pages = {378-399}
}

@article{MTMT:23932483,
	title = {Electrical and thermal cosimulation of GaAs interconnects},
	url = {https://m2.mtmt.hu/api/publication/23932483},
	author = {S A, Wartenberg and G, Zhao and Q H, Liu},
	doi = {10.1109/TADVP.2007.901651},
	journal-iso = {IEEE T ADV PACKAGING},
	journal = {IEEE TRANSACTIONS ON ADVANCED PACKAGING},
	volume = {30},
	unique-id = {23932483},
	issn = {1521-3323},
	year = {2007},
	pages = {758-762}
}

@article{MTMT:23932482,
	title = {Compact modeling of electrical devices for electrothermal analysis},
	url = {https://m2.mtmt.hu/api/publication/23932482},
	author = {L, Codecasa and D D'Amore and P, Maffezzoni},
	doi = {10.1109/TCSI.2003.811422},
	journal-iso = {IEEE T CIRCUITS-I},
	journal = {IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS},
	volume = {50},
	unique-id = {23932482},
	issn = {1549-8328},
	year = {2003},
	eissn = {1558-0806},
	pages = {465-476}
}

@inproceedings{MTMT:2613617,
	title = {A fast algorithm for the layout based electro-thermal simulation},
	url = {https://m2.mtmt.hu/api/publication/2613617},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir and Poppe, András},
	booktitle = {Proceedings of the Design, Automation and Test in Europe Conference and Exhibition (DATE'03)},
	doi = {10.1109/DATE.2003.1253740},
	unique-id = {2613617},
	abstract = {A new algorithm has been developed for the layout based direct electro-thermal simulation of integrated circuits. The advantage of the direct electro-thermal simulation over simulator coupling is, that very fast changes can also be considered, the drawback is that the thermal nodes are added to the number of nodes of the network to be simulated. The novelties of our method are the modeling and the solution of the thermal structure. This paper presents the algorithm of the time constant spectrum based FOSTER chain matrix thermal modeling, and the new algorithm of the coupled electro-thermal solution, where parts of the network, which represent the thermal behavior, are not computed in all steps of the iteration. This speeded up algorithm works both in the time-, and in the frequency domain. A simulation example demonstrates a typical application: the prediction of how the layout arrangement and the packaging of an analogue integrated circuit influence the electrical parameters.},
	year = {2003},
	pages = {1032-1037},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@inproceedings{MTMT:2613621,
	title = {Electro-thermal simulation of MEMS elements},
	url = {https://m2.mtmt.hu/api/publication/2613621},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir and Poppe, András and B, Courtois},
	booktitle = {Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'03)},
	doi = {10.1109/DTIP.2003.1287001},
	unique-id = {2613621},
	year = {2003},
	pages = {15-20},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@misc{MTMT:25401610,
	title = {TED software tools for thermal evaluation of integrated circuits. White Paper Version 2.1},
	url = {https://m2.mtmt.hu/api/publication/25401610},
	author = {PULTRONICS, Inc},
	unique-id = {25401610},
	year = {2003}
}

@inproceedings{MTMT:2607072,
	title = {Algorithmic and Modeling Aspects in the Electro-thermal Simulation of Thermally Operated Microsystems},
	url = {https://m2.mtmt.hu/api/publication/2607072},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir and Poppe, András and Courtois, B},
	booktitle = {Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show (NANOTECH'03)},
	unique-id = {2607072},
	abstract = {A new algorithm has been developed for the layout based electro-thermal simulation of integrated circuits and MEMS, using simultaneous iteration. The general advantage of this method over simulator coupling is that, in contrast with the case of simulator coupling, very fast changes can also be considered. The usual drawback is however, that the thermal nodes have to be added to the nodes of the electrical network, rendering usually huge networks to be simulated. The novelties of our method are the modeling and the solution of the thermal structure that results in fastened calculations. The novelty of the modeling is that the thermal impedances are represented with the discretised thermal time-constant spectrum. The novelty of the solution algorithm is that in our method pre-computed solutions are used for the representation of the linear thermal sub-network, effectively reducing the number of thermal nodes that are participating in the iteration. This fastened algorithm works both in the time-, and in the frequency domain. The paper will shortly summarize the algorithm of the time constant spectrum based thermal modeling and the new algorithm of the electro-thermal co-simulation. In order to verify the correctness of the simulated electrical and thermal values, the simulated results will be compared with the measured results of a realised electro-thermal converter.},
	keywords = {MEMS simulation; Electro-thermal simulation; Compact thermal modeling},
	year = {2003},
	pages = {476-479},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:24029418,
	title = {Electrothremal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3D systems},
	url = {https://m2.mtmt.hu/api/publication/24029418},
	author = {Batty, W and Christoffersen, CE and Panks, AJ and David, S and Snowden, CM and Steer, MB},
	doi = {10.1109/6144.974944},
	journal-iso = {IEEE T COMPON PACK T},
	journal = {IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES},
	volume = {24},
	unique-id = {24029418},
	issn = {1521-3331},
	year = {2001},
	pages = {566-590}
}

@inproceedings{MTMT:24029549,
	title = {Fully physical time-dependent compact thermal modelling of complex non linear 3-dimensional systems for device and circuit level electro-thermal CAD},
	url = {https://m2.mtmt.hu/api/publication/24029549},
	author = {Batty, W and Christoffersen, CE and David, S and Panks, AJ and Johnson, RG and Snowden, CM and Steer, MB},
	booktitle = {Proceedings of the 17th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'01)},
	doi = {10.1109/STHERM.2001.915149},
	unique-id = {24029549},
	year = {2001},
	pages = {71-84}
}

@article{MTMT:23932485,
	title = {Thermal modeling of semiconductor packages},
	url = {https://m2.mtmt.hu/api/publication/23932485},
	author = {Franke, T. and Froehler, U.},
	doi = {10.1016/S0026-2692(01)00067-2},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {32},
	unique-id = {23932485},
	issn = {0026-2692},
	year = {2001},
	eissn = {0959-8324},
	pages = {809-816}
}

@article{MTMT:2607000,
	title = {Dynamic Thermal Multiport Modeling of IC Packages},
	url = {https://m2.mtmt.hu/api/publication/2607000},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir},
	doi = {10.1109/6144.974946},
	journal-iso = {IEEE T COMPON PACK T},
	journal = {IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES},
	volume = {24},
	unique-id = {2607000},
	issn = {1521-3331},
	abstract = {The dynamic thermal behavior of electronic subsystems is characterized by their dynamic compact models. These models have to be similar to the steady state models in describing the fact that the heat is usually leaving on different locations (ports), necessitating multiport description of the thermal behavior. In our paper we present a method suitable for direct generation of multiport dynamic compact thermal models from a series of thermal transient simulations or measurements. The generated RC electrical equivalent circuit model, exercised with a network simulator program provided the same transient functions as the measured ones for various boundary conditions, proving the accuracy of the method.},
	year = {2001},
	pages = {596-604},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@inproceedings{MTMT:23932487,
	title = {Thermal modeling of semiconductor packages},
	url = {https://m2.mtmt.hu/api/publication/23932487},
	author = {Franke, T. and Froehler, U.},
	booktitle = {Proceedings of the 6th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'00)},
	unique-id = {23932487},
	year = {2000},
	pages = {193-198}
}

@inproceedings{MTMT:23932486,
	title = {Thermal modeling of multichip assemblies},
	url = {https://m2.mtmt.hu/api/publication/23932486},
	author = {T, Franke},
	booktitle = {Proceedings of the 18th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'99)},
	unique-id = {23932486},
	year = {1999},
	pages = {107-110}
}