TY - JOUR AU - Cosmin-Sorin, Plesa AU - Marius, Neag AU - Cristian, Boianceanu AU - Andrei, Negoita TI - Design methodology for over-temperature and over-current protection of an LDO voltage regulator by using electro-thermal simulations JF - MICROELECTRONICS RELIABILITY J2 - MICROELECTRON RELIAB VL - 509 PY - 2017 SP - 509 EP - 516 PG - 8 SN - 0026-2714 DO - 10.1016/j.microrel.2017.03.028 UR - https://m2.mtmt.hu/api/publication/26786424 ID - 26786424 LA - English DB - MTMT ER - TY - CHAP AU - Németh, Márton AU - Pálovics, Péter AU - Poppe, András ED - anon, null TI - Transfer function order reducing method for successive network reduction in complex frequency space T2 - Proceedings of the 18th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE'17) PB - IEEE CY - Dresden SN - 9781509043439 PY - 2017 PG - 7 DO - 10.1109/EuroSimE.2017.7926265 UR - https://m2.mtmt.hu/api/publication/3212553 ID - 3212553 AB - In this paper we present a direct computational method for calculating thermal transfer impedances between two separate locations of a given physical structure aimed at the implementation into a field-solver based on the SUNRED (SUccessive Node REDuction) algorithm. The paper describes a further reduction method in complex frequency space based on Hankel singular values. We tested the method on a typical MCPCB assembled LED structure in 2D. With that model we were able to compare the results from analytical calculations and from that approximations. The results show that the approximation method is very accurate, the calculated error were below 2 %. LA - English DB - MTMT ER - TY - JOUR AU - Iannuzzo, Francesco TI - SHORT-CIRCUIT ROBUSTNESS ASSESSMENT IN POWER ELECTRONIC MODULES FOR MEGAWATT APPLICATIONS JF - FACTA UNIVERSITATIS SERIES: ELECTRONICS AND ENERGETICS J2 - FACTA UNIV SER ELECTRON ENERGET VL - 29 PY - 2016 IS - 1 SP - 35 EP - 47 PG - 13 SN - 0353-3670 DO - 10.2298/FUEE1601035I UR - https://m2.mtmt.hu/api/publication/26225706 ID - 26225706 LA - English DB - MTMT ER - TY - JOUR AU - Poppe, András TI - Multi-domain compact modeling of LEDs: an overview of models and experimental data JF - MICROELECTRONICS JOURNAL J2 - MICROELECTRON J VL - 46 PY - 2015 IS - 12 A SP - 1138 EP - 1151 PG - 14 SN - 0026-2692 DO - 10.1016/j.mejo.2015.09.013 UR - https://m2.mtmt.hu/api/publication/2946363 ID - 2946363 N1 - Megjegyzés-25412367 Megjegyzés-26507359 PN A AB - Operating parameters of power LEDs are strongly coupled and are mutually dependent. There have been lots of attempts to provide different kinds of multi-domain LED models with different complexity. This paper gives an overview of recently published models and suggests a practical approach in which the forward current is split into two parts in a straightforward manner. One current component is derived from the LED’s measured radiant flux directly, the other component is calculated as the difference of the net forward current and the previously mentioned current component associated with light emission. Parameters of the proposed model can be identified from isothermal LED characteristics measured in industry standard LED test setups using textbook techniques. Temperature dependence of the model parameters is discussed in detail; including comparison of different models for the temperature dependence of the saturation current in Shockley’s diode equation. LA - English DB - MTMT ER - TY - JOUR AU - Garci, Maroua AU - Kammerer, Jean-Baptiste AU - Hebrard, Luc TI - Towards electro-thermo-mechanical simulation of integrated circuits in standard CAD environment JF - MICROELECTRONICS JOURNAL J2 - MICROELECTRON J VL - 46 PY - 2015 IS - 12 SP - 1121 EP - 1128 PG - 8 SN - 0026-2692 DO - 10.1016/j.mejo.2015.09.006 UR - https://m2.mtmt.hu/api/publication/25570744 ID - 25570744 LA - English DB - MTMT ER - TY - CHAP AU - Poppe, András AU - Szalai, Albin ED - Paul, Wesling ED - Kathe, Erickson TI - Practical aspects of implementation of a multi-domain LED model T2 - Thirtieth Annual SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM PB - IEEE CY - New York, New York SN - 9781479943746 PY - 2014 SP - 153 EP - 158 PG - 6 DO - 10.1109/SEMI-THERM.2014.6892232 UR - https://m2.mtmt.hu/api/publication/2698143 ID - 2698143 N1 - Befoglaló mű WoS és MTMT megnevezése nem azonos. Az MTMT-ben 1998 óta standardizált konferenciamegnevezéssel lett a befoglaló mű rögzítve. AB - Based on prior paper on multi-domain modeling of LEDs this paper provides an overview of the implementation issues of such model. On one hand the option of simplifying SPICE like macro models by using a commercial, fully coupled electro-thermal simulator is shown. On the other hand implementation details of an LED model are shown in which the current components responsible for heat dissipation and light emission are described separately. Using the current component responsible for light emission the radiant flux of the LED can be calculated directly. As a novelty in LED multid-domain modeling, using the “efficacy of radiation of the light source” is proposed for modeling the emitted luminous flux. The applicability of this quantity is demonstrated by an example. LA - English DB - MTMT ER - TY - THES AU - Timár, András TI - Logi-termikus szimuláció sztenderd tervező rendszerekben PB - Budapesti Műszaki és Gazdaságtudományi Egyetem PY - 2013 UR - https://m2.mtmt.hu/api/publication/2944137 ID - 2944137 N1 - Megjegyzés-25283808 Budapesti M˝uszaki és Gazdaságtudományi Egyetem Villamosmérnöki és Informatikai Kar Elektronikus Eszközök Tanszéke Megjegyzés-25283815 Budapesti Műszaki és Gazdaságtudományi Egyetem Villamosmérnöki és Informatikai Kar Elektronikus Eszközök Tanszéke LA - Hungarian DB - MTMT ER - TY - JOUR AU - Priyadarshi, S AU - Harris, TR AU - Melamed, S AU - Otero, C AU - Kriplani, NM AU - Christoffersen, CE AU - Manohar, R AU - Dooley, SR AU - Davis, WR AU - Franzon, PD AU - Steer, MB TI - Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels JF - IET CIRCUITS DEVICES & SYSTEMS J2 - IET CIRC DEVICE SYST VL - 6 PY - 2012 IS - 1 SP - 35 EP - 44 PG - 10 SN - 1751-858X DO - 10.1049/iet-cds.2011.0061 UR - https://m2.mtmt.hu/api/publication/26507298 ID - 26507298 LA - English DB - MTMT ER - TY - CHAP AU - Szalai, Albin AU - Czirkos, Zoltán AU - Székely, Vladimir ED - International, Workshop on Thermal Investigations of ICs and Microstructures TI - A quasi-SPICE electro-thermal simulator T2 - 18th THERMINIC International Workshop on Thermal Investigations of ICs and Systems PB - EDA Publishing Association CY - Grenoble SN - 9781467318822 PY - 2012 SP - 190 EP - 195 PG - 6 UR - https://m2.mtmt.hu/api/publication/2688135 ID - 2688135 N1 - Befoglaló mű WoS és MTMT megnevezése nem azonos. Az MTMT-ben 1995 óta standardizált konferenciamegnevezéssel lett a befoglaló mű rögzítve. AB - Integrated circuits exhibit coupled electro-thermal phenomena. The circuit elements dissipate heat, which propagates in the chip, rising the temperature of all circuit elements. Since the operation of the latter is temperature dependent, their dissipation will also change. This change results in the variation of the element voltages and currents, causing further changes in the dissipation, etc. Therefore we are facing a pair of couplings: an electronic → thermal one and a thermal → electronic one, meaning that all integrated circuits constitute essentially a mutually coupled electronic and thermal system. In this paper a detailed discussion of the electro- thermal phenomena is presented regarding the practical implementation. The final implementation is a SPICE compatible electro-thermal solver (qSPICE), which implements some of the major industry standard models with extended coupled thermal capabilities. The accuracy of qSPICE is demonstrated on multiple examples. LA - English DB - MTMT ER - TY - CHAP AU - Timár, András AU - Kerecsen Istvánné Rencz, Márta ED - IEEE, null TI - Studying the influence of chip temperatures on timing integrity T2 - Proceedings of the 12th IEEE Latin-American Test Workshop (LATW'11) PB - IEEE Press CY - New York, New York SN - 9781457714894 PY - 2011 PG - 5 DO - 10.1109/LATW.2011.5985920 UR - https://m2.mtmt.hu/api/publication/2662891 ID - 2662891 AB - Thermal (side-)effects can detrimentally influence operation of integrated circuits. The increase of temperature changes the devices’ characteristics and may result in timing integrity issues. In extreme cases the increased delays can foil correct operation of the circuit. This paper presents a methodology as well as a tool to address timing integrity errors caused by thermal effects. The methodology presented shows how the thermal distribution map on the IC surface can be used to calculate device delay changes during logic simulation. A software tool called CellTherm developed in the Department of Electron Devices, BME, Hungary is also briefly presented in this paper. With the help of the software, logic simulations of digital integrated circuits can be back-annotated with temperaturedependent delays during the running simulation. LA - English DB - MTMT ER - TY - CHAP AU - Krencker, J -C AU - Kammerer, J -B AU - Hervé, Y AU - Hébrard, L ED - Bernard, Courtois ED - Marta, Rencz TI - 3D electro-thermal simulations of analog ICs carried out with standard CAD tools and verilog-A T2 - Proceedings of the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'11) PB - EDA Publishing Association CY - Grenoble SN - 9781457707780 PY - 2011 SP - 19 EP - 22 PG - 4 UR - https://m2.mtmt.hu/api/publication/23893013 ID - 23893013 LA - English DB - MTMT ER - TY - CHAP AU - A, Calimera AU - A, Macii AU - E, Macii AU - S, Rinaudo AU - M, Poncino ED - Bernard, Courtois ED - Kerecsen Istvánné Rencz, Márta TI - THERMINATOR: Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future T2 - Proceedings of the 16th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'10) PB - IEEE CY - Barcelona SN - 9782355000126 PY - 2010 SP - 171 EP - 176 PG - 6 UR - https://m2.mtmt.hu/api/publication/23892268 ID - 23892268 LA - English DB - MTMT ER - TY - CHAP AU - Timár, András AU - Bognár, György AU - Poppe, András AU - Kerecsen Istvánné Rencz, Márta ED - Bernard, Courtois ED - Kerecsen Istvánné Rencz, Márta TI - Electro-thermal co-simulation of ICs with runtime back-annotation capability T2 - Proceedings of the 16th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'10) PB - IEEE CY - Barcelona SN - 9782355000126 PY - 2010 SP - 183 EP - 188 PG - 6 UR - https://m2.mtmt.hu/api/publication/2655080 ID - 2655080 AB - This paper presents a novel approach to logical and thermal co-simulation of ASIC circuits. Numerous electrothermal simulator implementations are present nowadays, but these simulators approach the electro-thermal simulation domain by co-simulating electronic and thermal effects at a low structural level. This approach has the advantage of being very accurate but at the expense of simulation time. In this paper we provide an alternative way to simulate standard cell ASIC circuits electrically and thermally in a concurrent process in real-time, in RTL level. Our approach takes standard cells of the digital design as basic building blocks and calculates a thermal distribution map on the surface of the virtual chip. The temperature map is calculated from the cells’ power characteristics and the switching activity of the regularly working circuit. We call the presented approach logi-thermal simulation. An implementation of the method is also presented in this paper: a new simulation software, LogiTherm is under heavy development in the Department of Electron Devices at BME, Hungary. LA - English DB - MTMT ER - TY - CHAP AU - J, Ch Krencker AU - J B, Kammerer AU - Y, Hervé AU - L, Hébrard ED - Bernard, Courtois ED - Kerecsen Istvánné Rencz, Márta TI - Direct Electro-Thermal Simulation of Integrated Circuits using Standard CAD Tools T2 - Proceedings of the 16th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'10) PB - IEEE CY - Barcelona SN - 9782355000126 PY - 2010 SP - 61 EP - 64 PG - 4 UR - https://m2.mtmt.hu/api/publication/23892209 ID - 23892209 LA - English DB - MTMT ER - TY - CHAP AU - Timár, András AU - Poppe, András AU - Kerecsen Istvánné Rencz, Márta ED - Napieralski, Andrzej TI - A Novel Approach of Logi-thermal Simulation Methodology and Implementation for ASIC Designs T2 - Proceedings of the 17th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES '10) PB - IEEE Press CY - Piscataway (NJ) SN - 9788392875635 PY - 2010 SP - 351 EP - 356 PG - 6 UR - https://m2.mtmt.hu/api/publication/2662675 ID - 2662675 LA - English DB - MTMT ER - TY - CHAP AU - Poppe, András AU - Horváth, György Gábor AU - Nagy, Gergely AU - Kerecsen Istvánné Rencz, Márta AU - Székely, Vladimir ED - Wesling, P ED - Erickson, K TI - Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits T2 - Proceedings of the 24th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'08) PB - IEEE CY - New York, New York SN - 9781424421237 PY - 2008 SP - 68 EP - 76 PG - 9 DO - 10.1109/STHERM.2008.4509369 UR - https://m2.mtmt.hu/api/publication/2613659 ID - 2613659 LA - English DB - MTMT ER - TY - JOUR AU - Etessam-Yazdani, K AU - Asheghi, M AU - Hamann, H F TI - Investigation of the Impact of Power Granularity on Chip Thermal Modeling Using White Noise Analysis JF - IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES J2 - IEEE T COMPON PACK T VL - 31 PY - 2008 IS - 1 SP - 211 EP - 215 PG - 5 SN - 1521-3331 DO - 10.1109/TCAPT.2008.916859 UR - https://m2.mtmt.hu/api/publication/23892202 ID - 23892202 N1 - doi:10.1109/TCAPT.2008.916859 Megjegyzés-23892528 doi:10.1109/TCAPT.2008.916859 Megjegyzés-23932598 doi:10.1109/TCAPT.2008.916859 LA - English DB - MTMT ER - TY - CHAP AU - Renaud, GILLON AU - Patricia, JORIS AU - Herman, OPRINS AU - Bart, VANDEVELDE AU - Adi, SRINIVASAN AU - Rajit, CHANDRA ED - IEEE, null TI - Practical chip-centric electro-thermal simulations T2 - Proceedings of the 14th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'08) PB - EDA Publishing Association CY - Grenoble SN - 9782355000089 PY - 2008 SP - 220 EP - 223 PG - 4 DO - 10.1109/THERMINIC.2008.4669912 UR - https://m2.mtmt.hu/api/publication/23892267 ID - 23892267 LA - English DB - MTMT ER - TY - CHAP AU - Poppe, András AU - Farkas, Gábor AU - Székely, Vladimir AU - Horváth, György Gábor AU - Kerecsen Istvánné Rencz, Márta ED - Wesling, P ED - Erickson, K TI - Multi-domain simulation and measurement of power LED-s and power LED assemblies T2 - Proceedings of the 22nd IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'06) PB - IEEE CY - New York, New York SN - 9781424401536 PY - 2006 SP - 191 EP - 198 PG - 8 DO - 10.1109/STHERM.2006.1625227 UR - https://m2.mtmt.hu/api/publication/2613643 ID - 2613643 LA - English DB - MTMT ER - TY - JOUR AU - Pedram, M AU - Nazarian, S TI - Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods JF - PROCEEDINGS OF THE IEEE J2 - P IEEE VL - 94 PY - 2006 IS - 8 SP - 1487 EP - 1501 PG - 15 SN - 0018-9219 DO - 10.1109/JPROC.2006.879797 UR - https://m2.mtmt.hu/api/publication/23892249 ID - 23892249 N1 - Megjegyzés-23892169 doi:10.1109/JPROC.2006.879797 LA - English DB - MTMT ER - TY - CHAP AU - M, Kuuse AU - M., Loikkanen AU - Bognár, György TI - Theoretical investigation of thermal feedback effects in low power circuits T2 - Proceedings of the 11th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'05) PB - TIMA Laboratory CY - Grenoble SN - 2916187014 PY - 2005 SP - 55 EP - 58 PG - 4 UR - https://m2.mtmt.hu/api/publication/2622102 ID - 2622102 LA - English DB - MTMT ER - TY - JOUR AU - Walkey, DJ AU - Smy, TJ AU - Celo, D AU - MacElwee, TW AU - Maliepaard, MC TI - Compact, netlist-based representation of thermal transient coupling using controlled sources JF - IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS J2 - IEEE T COMPUT AID D VL - 23 PY - 2004 IS - 11 SP - 1593 EP - 1596 PG - 4 SN - 0278-0070 DO - 10.1109/TCAD.2004.836722 UR - https://m2.mtmt.hu/api/publication/23892581 ID - 23892581 N1 - doi:10.1109/TCAD.2004.836722 LA - English DB - MTMT ER - TY - JOUR AU - Wang, N AU - Zhang, S AU - Zhou, R TI - Electromigration reliability diagnosis and clock signal integrity analysis using electrothermal simulations JF - QINGHUA DAXUE XUEBAO/JOURNAL OF TSINGHUA UNIVERSITY J2 - J TSINGHUA UNIV VL - 44 PY - 2004 IS - 7 SP - 984 EP - 987 SN - 1000-0054 UR - https://m2.mtmt.hu/api/publication/23892255 ID - 23892255 LA - English DB - MTMT ER - TY - JOUR AU - L, Codecasa AU - D D'Amore, null AU - P, Maffezzoni TI - Compact modeling of electrical devices for electrothermal analysis JF - IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS J2 - IEEE T CIRCUITS-I VL - 50 PY - 2003 IS - 4 SP - 465 EP - 476 PG - 12 SN - 1549-8328 DO - 10.1109/TCSI.2003.811422 UR - https://m2.mtmt.hu/api/publication/23932482 ID - 23932482 LA - English DB - MTMT ER - TY - CHAP AU - Kerecsen Istvánné Rencz, Márta AU - Székely, Vladimir AU - Poppe, András ED - Wehn, N ED - Verkest, D TI - A fast algorithm for the layout based electro-thermal simulation T2 - Proceedings of the Design, Automation and Test in Europe Conference and Exhibition (DATE'03) PB - IEEE Computer Society Press CY - Los Alamitos (CA) SN - 0769518702 PY - 2003 SP - 1032 EP - 1037 PG - 6 DO - 10.1109/DATE.2003.1253740 UR - https://m2.mtmt.hu/api/publication/2613617 ID - 2613617 AB - A new algorithm has been developed for the layout based direct electro-thermal simulation of integrated circuits. The advantage of the direct electro-thermal simulation over simulator coupling is, that very fast changes can also be considered, the drawback is that the thermal nodes are added to the number of nodes of the network to be simulated. The novelties of our method are the modeling and the solution of the thermal structure. This paper presents the algorithm of the time constant spectrum based FOSTER chain matrix thermal modeling, and the new algorithm of the coupled electro-thermal solution, where parts of the network, which represent the thermal behavior, are not computed in all steps of the iteration. This speeded up algorithm works both in the time-, and in the frequency domain. A simulation example demonstrates a typical application: the prediction of how the layout arrangement and the packaging of an analogue integrated circuit influence the electrical parameters. LA - English DB - MTMT ER - TY - CHAP AU - Kerecsen Istvánné Rencz, Márta AU - Székely, Vladimir AU - Poppe, András AU - K, Torki AU - B, Courtois ED - IEEE, null TI - Electro-thermal simulation for the prediction of chip operation within the package T2 - Proceedings of the 19th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'03) PB - IEEE Press CY - New York, New York SN - 0780377931 T3 - Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium, ISSN 1065-2221 PY - 2003 SP - 168 EP - 175 PG - 8 DO - 10.1109/STHERM.2003.1194357 UR - https://m2.mtmt.hu/api/publication/2613619 ID - 2613619 LA - English DB - MTMT ER - TY - GEN AU - PULTRONICS, Inc TI - TED software tools for thermal evaluation of integrated circuits. White Paper Version 2.1 TS - White Paper Version 2.1 PY - 2003 PG - 29 UR - https://m2.mtmt.hu/api/publication/25401610 ID - 25401610 LA - English DB - MTMT ER - TY - JOUR AU - Codecasa, L AU - D, Amore D AU - Maffezzoni, P TI - Modeling the thermal response of semiconductor devices through equivalent electrical networks JF - IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I - FUNDAMENTAL THEORY AND APPLICATIONS J2 - IEEE T CIRC SYST FUND VL - 49 PY - 2002 IS - 8 SP - 1187 EP - 1197 PG - 11 SN - 1057-7122 DO - 10.1109/TCSI.2002.801279 UR - https://m2.mtmt.hu/api/publication/24029484 ID - 24029484 N1 - Megjegyzés-23892251 Source: PublEx doi:10.1109/TCSI.2002.801279 LA - English DB - MTMT ER - TY - JOUR AU - Codecasa, L AU - D, Amore D AU - Maffezzoni, P TI - Thermal networks for electro-thermal analysis of power devices JF - MICROELECTRONICS JOURNAL J2 - MICROELECTRON J VL - 32 PY - 2001 IS - 10-11 SP - 817 EP - 822 PG - 6 SN - 0026-2692 DO - 10.1016/S0026-2692(01)00068-4 UR - https://m2.mtmt.hu/api/publication/23892250 ID - 23892250 LA - English DB - MTMT ER - TY - JOUR AU - Liu, M AU - Zhou, R D AU - Jia, S L AU - Gu, Y Q AU - Liang, X G AU - Zhang, R H TI - Self-heating effects in integrated circuits with hot spot method and electro-thermal coupling method JF - QINGHUA DAXUE XUEBAO/JOURNAL OF TSINGHUA UNIVERSITY J2 - J TSINGHUA UNIV VL - 41 PY - 2001 IS - 4 SP - 194 EP - 198 PG - 5 SN - 1000-0054 UR - https://m2.mtmt.hu/api/publication/23892332 ID - 23892332 LA - Chinese DB - MTMT ER - TY - CHAP AU - L, Miao AU - Z, Runde AU - J, Songliang AU - G, Yugin AU - L, Xingang AU - Z, Ronghai TI - Study on self-heat effects in integrated circuits with hot-spot and electro-thermal coupling methods T2 - Proceedings of the 4th International Conference on ASIC (ASICON'01) SN - 0780366778 PY - 2001 SP - 880 EP - 883 PG - 4 DO - 10.1109/ICASIC.2001.982705 UR - https://m2.mtmt.hu/api/publication/23892265 ID - 23892265 LA - English DB - MTMT ER - TY - CHAP AU - Codecasa, L AU - D’Amore, D AU - Maffezzoni, P ED - B, Courtois TI - Eelctro-thermal networks for the analysis of power devices T2 - Proceedings of the 6th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'00) PB - TIMA Laboratory CY - Budapest SN - 2913329519 PY - 2000 SP - 131 EP - 136 PG - 6 UR - https://m2.mtmt.hu/api/publication/23892259 ID - 23892259 LA - English DB - MTMT ER - TY - CONF AU - L, Miao AU - Z, Runde AU - G, Yuanquing TI - A new electro-thermal simulator based on relaxation method for integrated circuits with distributed temperatures T2 - Proceedings of the International Conference on Chip Design Automation (ICDA'00) PY - 2000 SP - 11 EP - 13 PG - 3 UR - https://m2.mtmt.hu/api/publication/23892266 ID - 23892266 LA - English DB - MTMT ER - TY - JOUR AU - Stepowicz, W J AU - Zarebski, J TI - Influence of electrothermal interactions on nonisothermal small-signal parameters of BJTs in ICs JF - MICROELECTRONICS JOURNAL J2 - MICROELECTRON J VL - 31 PY - 2000 IS - 9-10 SP - 759 EP - 764 PG - 6 SN - 0026-2692 DO - 10.1016/S0026-2692(00)00056-2 UR - https://m2.mtmt.hu/api/publication/23892257 ID - 23892257 LA - English DB - MTMT ER - TY - CHAP AU - K O, Petrojanc AU - I A, Kharitonov AU - P, Maltcev AU - N I, Rjabov AU - L N, Kravtchenko AU - A N, Sapelnikov ED - Anon, null TI - High-speed digital GaAs ICs electro-thermal simulation with PSPICE T2 - Proceedings of the 18th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'99) PB - TIMA Laboratory CY - Grenoble SN - 2913329322 PY - 1999 SP - 103 EP - 106 PG - 4 UR - https://m2.mtmt.hu/api/publication/23892253 ID - 23892253 N1 - Source: PublEx LA - English DB - MTMT ER - TY - CHAP AU - M, Jakovljevic AU - P, Fotiu AU - Z, Mrcarica AU - H, Detter ED - Anon, null TI - A Method for Simultaneous 3D Electro-Thermal Simulation of Microsystems T2 - Proceedings of the 18th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'99) PB - TIMA Laboratory CY - Grenoble SN - 2913329322 PY - 1999 SP - 178 EP - 183 PG - 6 UR - https://m2.mtmt.hu/api/publication/23892252 ID - 23892252 N1 - Source: PublEx LA - English DB - MTMT ER - TY - JOUR AU - Kerecsen Istvánné Rencz, Márta AU - Székely, Vladimir AU - A, Páhi AU - Poppe, András TI - Algorithmic and practical questions of electro-thermal circuit simulation JF - PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING J2 - PROCEEDINGS OF SPIE VL - 3893 PY - 1999 SP - 178 EP - 187 PG - 10 SN - 0277-786X DO - 10.1117/12.368423 UR - https://m2.mtmt.hu/api/publication/2613574 ID - 2613574 AB - In recent years great attention has been paid to the thermal issues in electronics design on system, board, package and chip level, including thermal and electro-thermal simulation of integrated circuits and MCM-s, or even integrated microsystems. In this paper we address some algorithmic issues regarding the method of simultaneous iteration. With the node reduction algorithm outlined here electro-thermal simulation of large problems becomes feasible. Besides this algorithmic innovation we provide a specification for a modular, platform independent electro-thermal simulator. LA - English DB - MTMT ER - TY - CHAP AU - Kerecsen Istvánné Rencz, Márta AU - Székely, Vladimir AU - Páhi, A AU - Poppe, András ED - Carothers, Jo Dale TI - An alternative method for electro-thermal circuit simulation T2 - Proceedings of the IEEE 1999 Southwest Symposium on Mixed-Signal Design (SSMSD '99) PB - IEEE Press CY - New York, New York SN - 0780355105 PY - 1999 SP - 117 EP - 122 PG - 6 DO - 10.1109/SSMSD.1999.768603 UR - https://m2.mtmt.hu/api/publication/2613575 ID - 2613575 LA - English DB - MTMT ER - TY - JOUR AU - Székely, Vladimir AU - Pahi, A AU - Poppe, András AU - Kerecsen Istvánné Rencz, Márta TI - Electro-Thermal Simulation with the SISSI Package JF - ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING J2 - ANALOG INTEGR CIRC S VL - 21 PY - 1999 IS - 1 SP - 21 EP - 31 PG - 11 SN - 0925-1030 DO - 10.1023/A:1008371625945 UR - https://m2.mtmt.hu/api/publication/2606987 ID - 2606987 AB - In this paper a brief overview of the electro-thermal simulation based on the method of simultaneous iteration is given, through the example of the SISSI (Simulator for Integrated Structures by Simultaneous Iteration) package. The modular approach used for the layout-based electro-thermal netlist generation is described. This approach allows an easy implementation of package model libraries. The capabilities of SISSI are introduced by simulation examples where in most cases the results are compared to measurement results. LA - English DB - MTMT ER - TY - JOUR AU - Csendes, A AU - Székely, Vladimir AU - Kerecsen Istvánné Rencz, Márta TI - An efficient thermal simulation tool for ICs, microsystem elements and MCMs: the μS-THERMANAL JF - MICROELECTRONICS JOURNAL J2 - MICROELECTRON J VL - 29 PY - 1998 IS - 4-5 SP - 241 EP - 255 PG - 15 SN - 0026-2692 DO - 10.1016/S0026-2692(97)00064-5 UR - https://m2.mtmt.hu/api/publication/2606980 ID - 2606980 AB - Integrated microsystems raise new problems in thermal simulation. The frequently used structures such as cantilevers and membranes have different heat transfer properties than the simple silicon cubes of conventional integrated circuits (ICs). To take advantage of this, numerous functions are realized on these structures based on the thermal principle. Quick and correct thermal simulation of these structures is needed during the design process. The paper presents the μS-THERMANAL thermal simulation tool which is capable of simulating, beyond the IC chips and three-dimensional multi-chip module packaging structures, the cantilever, the bridge and the membrane structures as well, both in steady-state and in the frequency-domain case. The algorithms of the program, based on the Fourier method, are detailed in the paper and numerous examples illustrate the capabilities of the tool. LA - English DB - MTMT ER - TY - JOUR AU - Székely, Vladimir AU - Kerecsen Istvánné Rencz, Márta AU - Courtois, B TI - Tracing the Thermal Behavior of ICs JF - IEEE DESIGN & TEST OF COMPUTERS J2 - IEEE DES TEST COMPUT VL - 15 PY - 1998 IS - 2 SP - 14 EP - 21 PG - 8 SN - 0740-7475 DO - 10.1109/54.679204 UR - https://m2.mtmt.hu/api/publication/2606986 ID - 2606986 AB - Today's increased power and packaging densities demand designer's attention to the effects of heat on ICs. Here, the authors review thermal and electrothermal simulation and measurement methods, thermal package characterization, and the concept and techniques of design for thermal testability. LA - English DB - MTMT ER - TY - JOUR AU - Székely, Vladimir TI - Identification of RC Networks by Deconvolution: Chances and Limits JF - IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I - FUNDAMENTAL THEORY AND APPLICATIONS J2 - IEEE T CIRC SYST FUND VL - 45 PY - 1998 IS - 3 SP - 244 EP - 258 PG - 15 SN - 1057-7122 DO - 10.1109/81.662698 UR - https://m2.mtmt.hu/api/publication/2671270 ID - 2671270 AB - This paper deals with the identification of RC networks from their time-or frequency-domain responses. A new method is presented based on a recent approach of the network description where all response functions are calculated by convolution integrals. The identification is carried out by deconvolution (NID method). This paper discusses the practical details of the method. Special attention is paid to the identification and modeling of distributed RC networks, like the problems of conductive heat-flow, A number of examples make easy to understand the operation and the capabilities of the NID method. Comparative considerations are given concerning the accuracy and expenses of the NID and the popular AWE (momentum-matching) methods. LA - English DB - MTMT ER - TY - JOUR AU - Székely, Vladimir TI - THERMODEL: a tool for compact dynamic thermal model generation JF - MICROELECTRONICS JOURNAL J2 - MICROELECTRON J VL - 29 PY - 1998 IS - 4-5 SP - 257 EP - 267 PG - 11 SN - 0026-2692 DO - 10.1016/S0026-2692(97)00065-7 UR - https://m2.mtmt.hu/api/publication/2671272 ID - 2671272 AB - THERMODEL is a software tool which generates compact thermal models to describe the heat conduction of three-dimensional physical structures, from either the time-domain or the frequency-domain response of the given structure. The generated compact model consists of a single (or twin) RC ladder of 8-12 stages. Both the one-port and the transfer thermal behavior can be modeled. These compact models can be useful in circuit-level simulators (like SPICE or ELDO) where thermal effects have to be considered in the model or in the electro-thermal integrated circuit chip simulators where all the relevant thermal couplings of the chip can be modeled in this way. LA - English DB - MTMT ER - TY - THES AU - Csendes, Alpár TI - IC csipek és mikrostruktúrák termikus vizsgálata PY - 1997 UR - https://m2.mtmt.hu/api/publication/24129245 ID - 24129245 N1 - PhD értekezés BME Villamosmérnöki és Informatikai Kar, Elektronikus Eszközök Tanszéke, Budapest Source: PublEx LA - Hungarian DB - MTMT ER - TY - JOUR AU - Székely, Vladimir AU - Poppe, András AU - Páhi, A AU - Csendes, A AU - Hajas, G AU - Kerecsen Istvánné Rencz, Márta TI - Electro-thermal and logi-thermal simulation of VLSI designs JF - IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS J2 - IEEE T VLSI SYST VL - 5 PY - 1997 IS - 3 SP - 258 EP - 269 PG - 12 SN - 1063-8210 DO - 10.1109/92.609868 UR - https://m2.mtmt.hu/api/publication/2606975 ID - 2606975 AB - Due to severe thermal problems of today's VLSI integrated circuits the need for reliable and quick thermal, electro-thermal and logi-thermal simulation tools is increasing, In this paper, we discuss the latest advances in the SISSI package (simulator for integrated structures by simultaneous iteration) which is a tool developed originally for analog VLSI design, The improvements include electro-thermal ac and transient simulation and the consideration of the thermal voltage of Si-Al contacts, Furthermore, we introduce a new module of SISSI, LOGITHERM, which is aimed at the self-consistent logic and thermal simulation of large digital VLSI designs, The features of our simulator package are highlighted by simulation examples that are compared in most cases with measurement results. LA - English DB - MTMT ER - TY - CONF AU - V A, Koval AU - D V, Fedsyuk AU - I Y, Kazymyra AU - M B, Blyzniuk ED - Courtois, B ED - Kerecsen Istvánné Rencz, Márta ED - Székely, Vladimir TI - Providing electro-thermal compatibility of hybrid microcircuits in CAD environment T2 - Proceedings of the 3rd International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'97) PB - TIMA Laboratory C1 - Cannes PY - 1997 SP - 67 EP - 71 PG - 5 UR - https://m2.mtmt.hu/api/publication/23892258 ID - 23892258 LA - English DB - MTMT ER -