@article{MTMT:26786424,
	title = {Design methodology for over-temperature and over-current protection of an LDO voltage regulator by using electro-thermal simulations},
	url = {https://m2.mtmt.hu/api/publication/26786424},
	author = {Cosmin-Sorin, Plesa and Marius, Neag and Cristian, Boianceanu and Andrei, Negoita},
	doi = {10.1016/j.microrel.2017.03.028},
	journal-iso = {MICROELECTRON RELIAB},
	journal = {MICROELECTRONICS RELIABILITY},
	volume = {509},
	unique-id = {26786424},
	issn = {0026-2714},
	year = {2017},
	eissn = {1872-941X},
	pages = {509-516}
}

@inproceedings{MTMT:3212553,
	title = {Transfer function order reducing method for successive network reduction in complex frequency space},
	url = {https://m2.mtmt.hu/api/publication/3212553},
	author = {Németh, Márton and Pálovics, Péter and Poppe, András},
	booktitle = {Proceedings of the 18th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE'17)},
	doi = {10.1109/EuroSimE.2017.7926265},
	unique-id = {3212553},
	abstract = {In this paper we present a direct computational method for 
		calculating thermal transfer impedances between two separate 
		locations of a given physical structure aimed at the 
		implementation into a field-solver based on the SUNRED 
		(SUccessive Node REDuction) algorithm. The paper describes a 
		further reduction method in complex frequency space based on 
		Hankel singular values. We tested the method on a typical 
		MCPCB assembled LED structure in 2D. With that model we were 
		able to compare the results from analytical calculations and 
		from that approximations. The results show that the 
		approximation method is very accurate, the calculated error 
		were below 2 %.},
	keywords = {Compact models; HEAT-SOURCES},
	year = {2017},
	orcid-numbers = {Németh, Márton/0000-0002-3517-5359; Pálovics, Péter/0000-0002-0108-3448; Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:26225706,
	title = {SHORT-CIRCUIT ROBUSTNESS ASSESSMENT IN POWER ELECTRONIC MODULES FOR MEGAWATT APPLICATIONS},
	url = {https://m2.mtmt.hu/api/publication/26225706},
	author = {Iannuzzo, Francesco},
	doi = {10.2298/FUEE1601035I},
	journal-iso = {FACTA UNIV SER ELECTRON ENERGET},
	journal = {FACTA UNIVERSITATIS SERIES: ELECTRONICS AND ENERGETICS},
	volume = {29},
	unique-id = {26225706},
	issn = {0353-3670},
	year = {2016},
	eissn = {2217-5997},
	pages = {35-47}
}

@article{MTMT:2946363,
	title = {Multi-domain compact modeling of LEDs: an overview of models and experimental data},
	url = {https://m2.mtmt.hu/api/publication/2946363},
	author = {Poppe, András},
	doi = {10.1016/j.mejo.2015.09.013},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {46},
	unique-id = {2946363},
	issn = {0026-2692},
	abstract = {Operating parameters of power LEDs are strongly coupled and 
		are mutually dependent. There have been lots of attempts to 
		provide different kinds of multi-domain LED models with 
		different complexity. This paper gives an overview of 
		recently published models and suggests a practical approach 
		in which the forward current is split into two parts in a 
		straightforward manner. One current component is derived from 
		the LED’s measured radiant flux directly, the other component 
		is calculated as the difference of the net forward current 
		and the previously mentioned current component associated 
		with light emission. Parameters of the proposed model can be 
		identified from isothermal LED characteristics measured in 
		industry standard LED test setups using textbook techniques. 
		Temperature dependence of the model parameters is discussed 
		in detail; including comparison of different models for the 
		temperature dependence of the saturation current in 
		Shockley’s diode equation.},
	year = {2015},
	eissn = {0959-8324},
	pages = {1138-1151},
	orcid-numbers = {Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:25570744,
	title = {Towards electro-thermo-mechanical simulation of integrated circuits in standard CAD environment},
	url = {https://m2.mtmt.hu/api/publication/25570744},
	author = {Garci, Maroua and Kammerer, Jean-Baptiste and Hebrard, Luc},
	doi = {10.1016/j.mejo.2015.09.006},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {46},
	unique-id = {25570744},
	issn = {0026-2692},
	year = {2015},
	eissn = {0959-8324},
	pages = {1121-1128}
}

@inproceedings{MTMT:2698143,
	title = {Practical aspects of implementation of a multi-domain LED model},
	url = {https://m2.mtmt.hu/api/publication/2698143},
	author = {Poppe, András and Szalai, Albin},
	booktitle = {Thirtieth Annual SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM},
	doi = {10.1109/SEMI-THERM.2014.6892232},
	unique-id = {2698143},
	abstract = {Based on prior paper on multi-domain modeling of LEDs this paper provides an overview of the implementation issues of such model. On one hand the option of simplifying SPICE like macro models by using a commercial, fully coupled electro-thermal simulator is shown. On the other hand implementation details of an LED model are shown in which the current components responsible for heat dissipation and light emission are described separately. Using the current component responsible for light emission the radiant flux of the LED can be calculated directly. As a novelty in LED multid-domain modeling, using the “efficacy of radiation of the light source” is proposed for modeling the emitted luminous flux. The applicability of this quantity is demonstrated by an example.},
	year = {2014},
	pages = {153-158},
	orcid-numbers = {Poppe, András/0000-0002-9381-6716}
}

@mastersthesis{MTMT:2944137,
	title = {Logi-termikus szimuláció sztenderd tervező rendszerekben},
	url = {https://m2.mtmt.hu/api/publication/2944137},
	author = {Timár, András},
	publisher = {Budapest University of Technology and Economics},
	unique-id = {2944137},
	year = {2013},
	orcid-numbers = {Timár, András/0000-0002-4173-1550}
}

@article{MTMT:26507298,
	title = {Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels},
	url = {https://m2.mtmt.hu/api/publication/26507298},
	author = {Priyadarshi, S and Harris, TR and Melamed, S and Otero, C and Kriplani, NM and Christoffersen, CE and Manohar, R and Dooley, SR and Davis, WR and Franzon, PD and Steer, MB},
	doi = {10.1049/iet-cds.2011.0061},
	journal-iso = {IET CIRC DEVICE SYST},
	journal = {IET CIRCUITS DEVICES & SYSTEMS},
	volume = {6},
	unique-id = {26507298},
	issn = {1751-858X},
	year = {2012},
	eissn = {1751-8598},
	pages = {35-44}
}

@inproceedings{MTMT:2688135,
	title = {A quasi-SPICE electro-thermal simulator},
	url = {https://m2.mtmt.hu/api/publication/2688135},
	author = {Szalai, Albin and Czirkos, Zoltán and Székely, Vladimir},
	booktitle = {18th THERMINIC International Workshop on Thermal Investigations of ICs and Systems},
	unique-id = {2688135},
	abstract = {Integrated circuits exhibit coupled
		electro-thermal phenomena. The circuit elements dissipate heat, 
		which propagates in the chip, rising the temperature of all 
		circuit elements. Since the operation of the latter is 
		temperature dependent, their dissipation will also change. This 
		change results in the variation of the element voltages and 
		currents, causing further changes in the dissipation, etc. 
		Therefore we are facing a pair of couplings: an electronic → 
		thermal one and a thermal → electronic one, meaning that all 
		integrated circuits constitute essentially a mutually
		coupled electronic and thermal system. In this paper a detailed 
		discussion of the electro- thermal phenomena is presented 
		regarding the practical implementation. The final implementation 
		is a SPICE compatible electro-thermal solver (qSPICE), which 
		implements some of the major industry standard models with 
		extended coupled thermal capabilities. The accuracy of qSPICE is 
		demonstrated on multiple examples.},
	year = {2012},
	pages = {190-195},
	orcid-numbers = {Czirkos, Zoltán/0000-0001-9269-0472}
}

@inproceedings{MTMT:2662891,
	title = {Studying the influence of chip temperatures on timing integrity},
	url = {https://m2.mtmt.hu/api/publication/2662891},
	author = {Timár, András and Kerecsen Istvánné Rencz, Márta},
	booktitle = {Proceedings of the 12th IEEE Latin-American Test Workshop (LATW'11)},
	doi = {10.1109/LATW.2011.5985920},
	unique-id = {2662891},
	abstract = {Thermal (side-)effects can detrimentally influence operation of integrated circuits. The increase of temperature changes the devices’ characteristics and may result in timing integrity issues. In extreme cases the increased delays can foil correct operation of the circuit. This paper presents a methodology as well as a tool to address timing integrity errors caused by thermal effects. The methodology presented shows how the thermal distribution map on the IC surface can be used to calculate device delay changes during logic simulation. A software tool called CellTherm developed in the Department of
		Electron Devices, BME, Hungary is also briefly presented in this
		paper. With the help of the software, logic simulations of digital integrated circuits can be back-annotated with temperaturedependent delays during the running simulation.},
	year = {2011},
	orcid-numbers = {Timár, András/0000-0002-4173-1550; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@inproceedings{MTMT:23893013,
	title = {3D electro-thermal simulations of analog ICs carried out with standard CAD tools and verilog-A},
	url = {https://m2.mtmt.hu/api/publication/23893013},
	author = {Krencker, J -C and Kammerer, J -B and Hervé, Y and Hébrard, L},
	booktitle = {Proceedings of the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'11)},
	unique-id = {23893013},
	year = {2011},
	pages = {19-22}
}

@inproceedings{MTMT:23892268,
	title = {THERMINATOR: Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future},
	url = {https://m2.mtmt.hu/api/publication/23892268},
	author = {A, Calimera and A, Macii and E, Macii and S, Rinaudo and M, Poncino},
	booktitle = {Proceedings of the 16th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'10)},
	unique-id = {23892268},
	year = {2010},
	pages = {171-176}
}

@inproceedings{MTMT:2655080,
	title = {Electro-thermal co-simulation of ICs with runtime back-annotation capability},
	url = {https://m2.mtmt.hu/api/publication/2655080},
	author = {Timár, András and Bognár, György and Poppe, András and Kerecsen Istvánné Rencz, Márta},
	booktitle = {Proceedings of the 16th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'10)},
	unique-id = {2655080},
	abstract = {This paper presents a novel approach to logical
		and thermal co-simulation of ASIC circuits. Numerous electrothermal simulator implementations are present nowadays, but these simulators approach the electro-thermal simulation domain by co-simulating electronic and thermal effects at a low structural level. This approach has the advantage of being very accurate but at the expense of simulation time. In this paper we provide an alternative way to simulate standard cell ASIC circuits electrically and thermally in a concurrent process in real-time, in RTL level. Our approach takes standard cells of the digital design as basic building blocks and calculates a thermal distribution map on the surface of the virtual chip. The temperature map is calculated from the cells’ power characteristics and the switching activity of the regularly working circuit. We call the presented approach logi-thermal simulation. An implementation of the method is also presented in this paper: a new simulation software, LogiTherm is under heavy development in the Department of Electron Devices at BME, Hungary.},
	year = {2010},
	pages = {183-188},
	orcid-numbers = {Timár, András/0000-0002-4173-1550; Bognár, György/0000-0003-4582-3900; Poppe, András/0000-0002-9381-6716; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@inproceedings{MTMT:23892209,
	title = {Direct Electro-Thermal Simulation of Integrated Circuits using Standard CAD Tools},
	url = {https://m2.mtmt.hu/api/publication/23892209},
	author = {J, Ch Krencker and J B, Kammerer and Y, Hervé and L, Hébrard},
	booktitle = {Proceedings of the 16th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'10)},
	unique-id = {23892209},
	year = {2010},
	pages = {61-64}
}

@inproceedings{MTMT:2662675,
	title = {A Novel Approach of Logi-thermal Simulation Methodology and Implementation for ASIC Designs},
	url = {https://m2.mtmt.hu/api/publication/2662675},
	author = {Timár, András and Poppe, András and Kerecsen Istvánné Rencz, Márta},
	booktitle = {Proceedings of the 17th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES '10)},
	unique-id = {2662675},
	year = {2010},
	pages = {351-356},
	orcid-numbers = {Timár, András/0000-0002-4173-1550; Poppe, András/0000-0002-9381-6716; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@inproceedings{MTMT:2613659,
	title = {Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits},
	url = {https://m2.mtmt.hu/api/publication/2613659},
	author = {Poppe, András and Horváth, György Gábor and Nagy, Gergely and Kerecsen Istvánné Rencz, Márta and Székely, Vladimir},
	booktitle = {Proceedings of the 24th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'08)},
	doi = {10.1109/STHERM.2008.4509369},
	unique-id = {2613659},
	year = {2008},
	pages = {68-76},
	orcid-numbers = {Poppe, András/0000-0002-9381-6716; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@article{MTMT:23892202,
	title = {Investigation of the Impact of Power Granularity on Chip Thermal Modeling Using White Noise Analysis},
	url = {https://m2.mtmt.hu/api/publication/23892202},
	author = {Etessam-Yazdani, K and Asheghi, M and Hamann, H F},
	doi = {10.1109/TCAPT.2008.916859},
	journal-iso = {IEEE T COMPON PACK T},
	journal = {IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES},
	volume = {31},
	unique-id = {23892202},
	issn = {1521-3331},
	year = {2008},
	pages = {211-215}
}

@inproceedings{MTMT:23892267,
	title = {Practical chip-centric electro-thermal simulations},
	url = {https://m2.mtmt.hu/api/publication/23892267},
	author = {Renaud, GILLON and Patricia, JORIS and Herman, OPRINS and Bart, VANDEVELDE and Adi, SRINIVASAN and Rajit, CHANDRA},
	booktitle = {Proceedings of the 14th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'08)},
	doi = {10.1109/THERMINIC.2008.4669912},
	unique-id = {23892267},
	year = {2008},
	pages = {220-223}
}

@inproceedings{MTMT:2613643,
	title = {Multi-domain simulation and measurement of power LED-s and power LED assemblies},
	url = {https://m2.mtmt.hu/api/publication/2613643},
	author = {Poppe, András and Farkas, Gábor and Székely, Vladimir and Horváth, György Gábor and Kerecsen Istvánné Rencz, Márta},
	booktitle = {Proceedings of the 22nd IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'06)},
	doi = {10.1109/STHERM.2006.1625227},
	unique-id = {2613643},
	year = {2006},
	pages = {191-198},
	orcid-numbers = {Poppe, András/0000-0002-9381-6716; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@article{MTMT:23892249,
	title = {Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods},
	url = {https://m2.mtmt.hu/api/publication/23892249},
	author = {Pedram, M and Nazarian, S},
	doi = {10.1109/JPROC.2006.879797},
	journal-iso = {P IEEE},
	journal = {PROCEEDINGS OF THE IEEE},
	volume = {94},
	unique-id = {23892249},
	issn = {0018-9219},
	year = {2006},
	eissn = {1558-2256},
	pages = {1487-1501}
}

@inproceedings{MTMT:2622102,
	title = {Theoretical investigation of thermal feedback effects in low power circuits},
	url = {https://m2.mtmt.hu/api/publication/2622102},
	author = {M, Kuuse and M., Loikkanen and Bognár, György},
	booktitle = {Proceedings of the 11th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'05)},
	unique-id = {2622102},
	year = {2005},
	pages = {55-58},
	orcid-numbers = {Bognár, György/0000-0003-4582-3900}
}

@article{MTMT:23892581,
	title = {Compact, netlist-based representation of thermal transient coupling using controlled sources},
	url = {https://m2.mtmt.hu/api/publication/23892581},
	author = {Walkey, DJ and Smy, TJ and Celo, D and MacElwee, TW and Maliepaard, MC},
	doi = {10.1109/TCAD.2004.836722},
	journal-iso = {IEEE T COMPUT AID D},
	journal = {IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS},
	volume = {23},
	unique-id = {23892581},
	issn = {0278-0070},
	year = {2004},
	eissn = {1937-4151},
	pages = {1593-1596}
}

@article{MTMT:23892255,
	title = {Electromigration reliability diagnosis and clock signal integrity analysis using electrothermal simulations},
	url = {https://m2.mtmt.hu/api/publication/23892255},
	author = {Wang, N and Zhang, S and Zhou, R},
	journal-iso = {J TSINGHUA UNIV},
	journal = {QINGHUA DAXUE XUEBAO/JOURNAL OF TSINGHUA UNIVERSITY},
	volume = {44},
	unique-id = {23892255},
	issn = {1000-0054},
	year = {2004},
	pages = {984-987}
}

@article{MTMT:23932482,
	title = {Compact modeling of electrical devices for electrothermal analysis},
	url = {https://m2.mtmt.hu/api/publication/23932482},
	author = {L, Codecasa and D D'Amore and P, Maffezzoni},
	doi = {10.1109/TCSI.2003.811422},
	journal-iso = {IEEE T CIRCUITS-I},
	journal = {IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS},
	volume = {50},
	unique-id = {23932482},
	issn = {1549-8328},
	year = {2003},
	eissn = {1558-0806},
	pages = {465-476}
}

@inproceedings{MTMT:2613617,
	title = {A fast algorithm for the layout based electro-thermal simulation},
	url = {https://m2.mtmt.hu/api/publication/2613617},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir and Poppe, András},
	booktitle = {Proceedings of the Design, Automation and Test in Europe Conference and Exhibition (DATE'03)},
	doi = {10.1109/DATE.2003.1253740},
	unique-id = {2613617},
	abstract = {A new algorithm has been developed for the layout based direct electro-thermal simulation of integrated circuits. The advantage of the direct electro-thermal simulation over simulator coupling is, that very fast changes can also be considered, the drawback is that the thermal nodes are added to the number of nodes of the network to be simulated. The novelties of our method are the modeling and the solution of the thermal structure. This paper presents the algorithm of the time constant spectrum based FOSTER chain matrix thermal modeling, and the new algorithm of the coupled electro-thermal solution, where parts of the network, which represent the thermal behavior, are not computed in all steps of the iteration. This speeded up algorithm works both in the time-, and in the frequency domain. A simulation example demonstrates a typical application: the prediction of how the layout arrangement and the packaging of an analogue integrated circuit influence the electrical parameters.},
	year = {2003},
	pages = {1032-1037},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@inproceedings{MTMT:2613619,
	title = {Electro-thermal simulation for the prediction of chip operation within the package},
	url = {https://m2.mtmt.hu/api/publication/2613619},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir and Poppe, András and K, Torki and B, Courtois},
	booktitle = {Proceedings of the 19th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'03)},
	doi = {10.1109/STHERM.2003.1194357},
	unique-id = {2613619},
	year = {2003},
	pages = {168-175},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@misc{MTMT:25401610,
	title = {TED software tools for thermal evaluation of integrated circuits. White Paper Version 2.1},
	url = {https://m2.mtmt.hu/api/publication/25401610},
	author = {PULTRONICS, Inc},
	unique-id = {25401610},
	year = {2003}
}

@article{MTMT:24029484,
	title = {Modeling the thermal response of semiconductor devices through equivalent electrical networks},
	url = {https://m2.mtmt.hu/api/publication/24029484},
	author = {Codecasa, L and D, Amore D and Maffezzoni, P},
	doi = {10.1109/TCSI.2002.801279},
	journal-iso = {IEEE T CIRC SYST FUND},
	journal = {IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I - FUNDAMENTAL THEORY AND APPLICATIONS},
	volume = {49},
	unique-id = {24029484},
	issn = {1057-7122},
	year = {2002},
	pages = {1187-1197}
}

@article{MTMT:23892250,
	title = {Thermal networks for electro-thermal analysis of power devices},
	url = {https://m2.mtmt.hu/api/publication/23892250},
	author = {Codecasa, L and D, Amore D and Maffezzoni, P},
	doi = {10.1016/S0026-2692(01)00068-4},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {32},
	unique-id = {23892250},
	issn = {0026-2692},
	year = {2001},
	eissn = {0959-8324},
	pages = {817-822}
}

@article{MTMT:23892332,
	title = {Self-heating effects in integrated circuits with hot spot method and electro-thermal coupling method},
	url = {https://m2.mtmt.hu/api/publication/23892332},
	author = {Liu, M and Zhou, R D and Jia, S L and Gu, Y Q and Liang, X G and Zhang, R H},
	journal-iso = {J TSINGHUA UNIV},
	journal = {QINGHUA DAXUE XUEBAO/JOURNAL OF TSINGHUA UNIVERSITY},
	volume = {41},
	unique-id = {23892332},
	issn = {1000-0054},
	year = {2001},
	pages = {194-198}
}

@inproceedings{MTMT:23892265,
	title = {Study on self-heat effects in integrated circuits with hot-spot and electro-thermal coupling methods},
	url = {https://m2.mtmt.hu/api/publication/23892265},
	author = {L, Miao and Z, Runde and J, Songliang and G, Yugin and L, Xingang and Z, Ronghai},
	booktitle = {Proceedings of the 4th International Conference on ASIC (ASICON'01)},
	doi = {10.1109/ICASIC.2001.982705},
	unique-id = {23892265},
	year = {2001},
	pages = {880-883}
}

@inproceedings{MTMT:23892259,
	title = {Eelctro-thermal networks for the analysis of power devices},
	url = {https://m2.mtmt.hu/api/publication/23892259},
	author = {Codecasa, L and D’Amore, D and Maffezzoni, P},
	booktitle = {Proceedings of the 6th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'00)},
	unique-id = {23892259},
	year = {2000},
	pages = {131-136}
}

@CONFERENCE{MTMT:23892266,
	title = {A new electro-thermal simulator based on relaxation method for integrated circuits with distributed temperatures},
	url = {https://m2.mtmt.hu/api/publication/23892266},
	author = {L, Miao and Z, Runde and G, Yuanquing},
	booktitle = {Proceedings of the International Conference on Chip Design Automation (ICDA'00)},
	unique-id = {23892266},
	year = {2000},
	pages = {11-13}
}

@article{MTMT:23892257,
	title = {Influence of electrothermal interactions on nonisothermal small-signal parameters of BJTs in ICs},
	url = {https://m2.mtmt.hu/api/publication/23892257},
	author = {Stepowicz, W J and Zarebski, J},
	doi = {10.1016/S0026-2692(00)00056-2},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {31},
	unique-id = {23892257},
	issn = {0026-2692},
	year = {2000},
	eissn = {0959-8324},
	pages = {759-764}
}

@inproceedings{MTMT:23892253,
	title = {High-speed digital GaAs ICs electro-thermal simulation with PSPICE},
	url = {https://m2.mtmt.hu/api/publication/23892253},
	author = {K O, Petrojanc and I A, Kharitonov and P, Maltcev and N I, Rjabov and L N, Kravtchenko and A N, Sapelnikov},
	booktitle = {Proceedings of the 18th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'99)},
	unique-id = {23892253},
	year = {1999},
	pages = {103-106}
}

@inproceedings{MTMT:23892252,
	title = {A Method for Simultaneous 3D Electro-Thermal Simulation of Microsystems},
	url = {https://m2.mtmt.hu/api/publication/23892252},
	author = {M, Jakovljevic and P, Fotiu and Z, Mrcarica and H, Detter},
	booktitle = {Proceedings of the 18th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'99)},
	unique-id = {23892252},
	year = {1999},
	pages = {178-183}
}

@article{MTMT:2613574,
	title = {Algorithmic and practical questions of electro-thermal circuit simulation},
	url = {https://m2.mtmt.hu/api/publication/2613574},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir and A, Páhi and Poppe, András},
	doi = {10.1117/12.368423},
	journal-iso = {PROCEEDINGS OF SPIE},
	journal = {PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING},
	volume = {3893},
	unique-id = {2613574},
	issn = {0277-786X},
	abstract = {In recent years great attention has been paid to the thermal issues in electronics design on system, board, package and chip level, including thermal and electro-thermal simulation of integrated circuits and MCM-s, or even integrated microsystems. In this paper we address some algorithmic issues regarding the method of simultaneous iteration. With the node reduction algorithm outlined here electro-thermal simulation of large problems becomes feasible. Besides this algorithmic innovation we provide a specification for a modular, platform independent electro-thermal simulator.},
	year = {1999},
	eissn = {1996-756X},
	pages = {178-187},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@inproceedings{MTMT:2613575,
	title = {An alternative method for electro-thermal circuit simulation},
	url = {https://m2.mtmt.hu/api/publication/2613575},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir and Páhi, A and Poppe, András},
	booktitle = {Proceedings of the IEEE 1999 Southwest Symposium on Mixed-Signal Design (SSMSD '99)},
	doi = {10.1109/SSMSD.1999.768603},
	unique-id = {2613575},
	year = {1999},
	pages = {117-122},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:2606987,
	title = {Electro-Thermal Simulation with the SISSI Package},
	url = {https://m2.mtmt.hu/api/publication/2606987},
	author = {Székely, Vladimir and Pahi, A and Poppe, András and Kerecsen Istvánné Rencz, Márta},
	doi = {10.1023/A:1008371625945},
	journal-iso = {ANALOG INTEGR CIRC S},
	journal = {ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING},
	volume = {21},
	unique-id = {2606987},
	issn = {0925-1030},
	abstract = {In this paper a brief overview of the electro-thermal simulation based on the method of simultaneous iteration is given, through the example of the SISSI (Simulator for Integrated Structures by Simultaneous Iteration) package. The modular approach used for the layout-based electro-thermal netlist generation is described. This approach allows an easy implementation of package model libraries. The capabilities of SISSI are introduced by simulation examples where in most cases the results are compared to measurement results.},
	year = {1999},
	eissn = {1573-1979},
	pages = {21-31},
	orcid-numbers = {Poppe, András/0000-0002-9381-6716; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@article{MTMT:2606980,
	title = {An efficient thermal simulation tool for ICs, microsystem elements and MCMs: the μS-THERMANAL},
	url = {https://m2.mtmt.hu/api/publication/2606980},
	author = {Csendes, A and Székely, Vladimir and Kerecsen Istvánné Rencz, Márta},
	doi = {10.1016/S0026-2692(97)00064-5},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {29},
	unique-id = {2606980},
	issn = {0026-2692},
	abstract = {Integrated microsystems raise new problems in thermal simulation. The frequently used structures such as cantilevers and membranes have different heat transfer properties than the simple silicon cubes of conventional integrated circuits (ICs). To take advantage of this, numerous functions are realized on these structures based on the thermal principle. Quick and correct thermal simulation of these structures is needed during the design process. The paper presents the μS-THERMANAL thermal simulation tool which is capable of simulating, beyond the IC chips and three-dimensional multi-chip module packaging structures, the cantilever, the bridge and the membrane structures as well, both in steady-state and in the frequency-domain case. The algorithms of the program, based on the Fourier method, are detailed in the paper and numerous examples illustrate the capabilities of the tool.},
	year = {1998},
	eissn = {0959-8324},
	pages = {241-255},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@article{MTMT:2606986,
	title = {Tracing the Thermal Behavior of ICs},
	url = {https://m2.mtmt.hu/api/publication/2606986},
	author = {Székely, Vladimir and Kerecsen Istvánné Rencz, Márta and Courtois, B},
	doi = {10.1109/54.679204},
	journal-iso = {IEEE DES TEST COMPUT},
	journal = {IEEE DESIGN & TEST OF COMPUTERS},
	volume = {15},
	unique-id = {2606986},
	issn = {0740-7475},
	abstract = {Today's increased power and packaging densities demand designer's attention to the effects of heat on ICs. Here, the authors review thermal and electrothermal simulation and measurement methods, thermal package characterization, and the concept and techniques of design for thermal testability.},
	year = {1998},
	eissn = {1558-1918},
	pages = {14-21},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@article{MTMT:2671270,
	title = {Identification of RC Networks by Deconvolution: Chances and Limits},
	url = {https://m2.mtmt.hu/api/publication/2671270},
	author = {Székely, Vladimir},
	doi = {10.1109/81.662698},
	journal-iso = {IEEE T CIRC SYST FUND},
	journal = {IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I - FUNDAMENTAL THEORY AND APPLICATIONS},
	volume = {45},
	unique-id = {2671270},
	issn = {1057-7122},
	abstract = {This paper deals with the identification of RC networks from their time-or frequency-domain responses. A new method is presented based on a recent approach of the network description where all response functions are calculated by convolution integrals. The identification is carried out by deconvolution (NID method). This paper discusses the practical details of the method. Special attention is paid to the identification and modeling of distributed RC networks, like the problems of conductive heat-flow, A number of examples make easy to understand the operation and the capabilities of the NID method. Comparative considerations are given concerning the accuracy and expenses of the NID and the popular AWE (momentum-matching) methods.},
	year = {1998},
	pages = {244-258}
}

@article{MTMT:2671272,
	title = {THERMODEL: a tool for compact dynamic thermal model generation},
	url = {https://m2.mtmt.hu/api/publication/2671272},
	author = {Székely, Vladimir},
	doi = {10.1016/S0026-2692(97)00065-7},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {29},
	unique-id = {2671272},
	issn = {0026-2692},
	abstract = {THERMODEL is a software tool which generates compact thermal models to describe the heat conduction of three-dimensional physical structures, from either the time-domain or the frequency-domain response of the given structure. The generated compact model consists of a single (or twin) RC ladder of 8-12 stages. Both the one-port and the transfer thermal behavior can be modeled. These compact models can be useful in circuit-level simulators (like SPICE or ELDO) where thermal effects have to be considered in the model or in the electro-thermal integrated circuit chip simulators where all the relevant thermal couplings of the chip can be modeled in this way.},
	year = {1998},
	eissn = {0959-8324},
	pages = {257-267}
}

@mastersthesis{MTMT:24129245,
	title = {IC csipek és mikrostruktúrák termikus vizsgálata},
	url = {https://m2.mtmt.hu/api/publication/24129245},
	author = {Csendes, Alpár},
	unique-id = {24129245},
	year = {1997}
}

@article{MTMT:2606975,
	title = {Electro-thermal and logi-thermal simulation of VLSI designs},
	url = {https://m2.mtmt.hu/api/publication/2606975},
	author = {Székely, Vladimir and Poppe, András and Páhi, A and Csendes, A and Hajas, G and Kerecsen Istvánné Rencz, Márta},
	doi = {10.1109/92.609868},
	journal-iso = {IEEE T VLSI SYST},
	journal = {IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS},
	volume = {5},
	unique-id = {2606975},
	issn = {1063-8210},
	abstract = {Due to severe thermal problems of today's VLSI integrated circuits the need for reliable and quick thermal, electro-thermal and logi-thermal simulation tools is increasing, In this paper, we discuss the latest advances in the SISSI package (simulator for integrated structures by simultaneous iteration) which is a tool developed originally for analog VLSI design, The improvements include electro-thermal ac and transient simulation and the consideration of the thermal voltage of Si-Al contacts, Furthermore, we introduce a new module of SISSI, LOGITHERM, which is aimed at the self-consistent logic and thermal simulation of large digital VLSI designs, The features of our simulator package are highlighted by simulation examples that are compared in most cases with measurement results.},
	year = {1997},
	pages = {258-269},
	orcid-numbers = {Poppe, András/0000-0002-9381-6716; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@CONFERENCE{MTMT:23892258,
	title = {Providing electro-thermal compatibility of hybrid microcircuits in CAD environment},
	url = {https://m2.mtmt.hu/api/publication/23892258},
	author = {V A, Koval and D V, Fedsyuk and I Y, Kazymyra and M B, Blyzniuk},
	booktitle = {Proceedings of the 3rd International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'97)},
	unique-id = {23892258},
	year = {1997},
	pages = {67-71}
}