@article{MTMT:33890597,
	title = {An adaptive Energy acquisition power supply for power transmission line},
	url = {https://m2.mtmt.hu/api/publication/33890597},
	author = {Zhang, Zhonghao and Li, Zong and Yin, Fanghui and Cao, Bin and Wang, Liming},
	doi = {10.1587/elex.20.20230072},
	journal-iso = {IEICE ELECTRON EXPR},
	journal = {IEICE ELECTRONICS EXPRESS},
	unique-id = {33890597},
	issn = {1349-2543},
	abstract = {Reliable power supply is of great significance to the stable operation of the online monitoring device. This paper studies a kind of electric energy collection power supply based on the principle of current mutual inductance. The iron core is made of nanocrystalline alloy with high permeability, and the relationship between the number of turns and the energy consumption power is analyzed by equivalent circuit. A discharge circuit is formed by connecting multiple diodes in series to avoid oversaturation of the iron core, and the residual voltage on the diode supplies the load electric energy. Combined with simulation and experiment, the number of turns and the number of diodes in series are optimized, so that the power supply has high efficiency and is not easy to be deeply saturated. The rectifier bridge and DC-DC voltage regulator module are used to stabilize the output voltage. The test shows that the power supply can support reliable energy extraction within the range of wire current of 17A at least and 1000A at most, and can be applied to lines of various voltage levels.},
	keywords = {power supply; Online monitoring; energy collection; saturation inhibition},
	year = {2023},
	eissn = {1349-2543}
}

@inproceedings{MTMT:33192167,
	title = {Multidomain Modeling for Reliability Evaluation of Devices and Microsystems Using Verilog-A},
	url = {https://m2.mtmt.hu/api/publication/33192167},
	author = {Kammerer, Jean-Baptiste and Garci, Maroua and Kaid, Achraf and Roqueta, Fabrice},
	booktitle = {2022 29TH INTERNATIONAL CONFERENCE ON MIXED DESIGN OF INTEGRATED CIRCUITS AND SYSTEM (MIXDES 2022)},
	doi = {10.23919/MIXDES55591.2022.9838222},
	unique-id = {33192167},
	year = {2022},
	pages = {51-56}
}

@inproceedings{MTMT:33632613,
	title = {FEM-based Thermal Profile Prediction for Thermal Management of System-on-Chips},
	url = {https://m2.mtmt.hu/api/publication/33632613},
	author = {Oukaira, Aziz and Touati, Djallel Eddine and Hassan, Ahmad and Ali, Mohamed and Savaria, Yvon and Lakhssassi, Ahmed},
	booktitle = {2022 8th International Conference on Optimization and Applications (ICOA)},
	doi = {10.1109/ICOA55659.2022.9934719},
	unique-id = {33632613},
	abstract = {In this paper, we propose a thermal profile based on the finite element method (FEM). The proposed model is used to predict the temperature profile of the Xilinx™ SPARTAN-3E Field-Programmable Gate Array (FPGA) board during one day. In addition, thermal measurements based on infrared thermography are performed to validate our thermal profiles. These predicted profiles are compared to the temperature maps obtained with a thermal camera over 24 hours. A good agreement, with a maximum error of 1.8 °C, between the predicted and measured temperatures is obtained, which helps a lot in the proper functioning and the thermal management of the system-on-chips (SoC).},
	year = {2022},
	pages = {1-4}
}

@article{MTMT:30723309,
	title = {Application source code modification for processor architecture lifetime improvement},
	url = {https://m2.mtmt.hu/api/publication/30723309},
	author = {Saad, Montassar Ben and Jedidi, Ahmed and Niar, Smail and Abid, Mohamed},
	doi = {10.1504/IJES.2019.098289},
	journal-iso = {INT J EMBED SYST},
	journal = {INTERNATIONAL JOURNAL OF EMBEDDED SYSTEMS},
	volume = {11},
	unique-id = {30723309},
	issn = {1741-1068},
	abstract = {In the optimal functioning of SoCs, two significant metrics of quality are the most important; lifetime and reliability. The context of this paper focuses on methods to increase the lifetime of a processor. Two methods are presented: relax point injection (RPI) and code structure adaptation (CSA). In RPI, a specific treatment is incorporated into the application code to prevent a harmful rise in the temperature of the chip. The MTTF of the processor is increased by 33.88% through means of an RPI method. However, the execution time of the application is sometimes increased by the RPI to a higher than 12%. In CSA method, the arrangement of the application code is regulated to improve the lifetime of the processor. The MTTF of the processor is increased up to 28% by CSA technique and the implementation time is maintained.},
	year = {2019},
	eissn = {1741-1076},
	pages = {125}
}

@article{MTMT:3157075,
	title = {Compact modeling approach for microchannel cooling and its validation},
	url = {https://m2.mtmt.hu/api/publication/3157075},
	author = {Németh, Márton and Takács, Gábor and Jani, Lázár and Poppe, András},
	doi = {10.1007/s00542-017-3330-z},
	journal-iso = {MICROSYST TECHNOL},
	journal = {MICROSYSTEM TECHNOLOGIES},
	volume = {24},
	unique-id = {3157075},
	issn = {0946-7076},
	year = {2018},
	eissn = {1432-1858},
	pages = {419-431},
	orcid-numbers = {Németh, Márton/0000-0002-3517-5359; Takács, Gábor/0000-0001-8081-1169; Jani, Lázár/0000-0002-4280-0319; Poppe, András/0000-0002-9381-6716}
}

@inproceedings{MTMT:3237362,
	title = {Extending a Multi-Level Logi-Thermal Simulation Framework to a Mixed Signal Thermal Aware Simulation Environment Using SystemC-AMS},
	url = {https://m2.mtmt.hu/api/publication/3237362},
	author = {Jani, Lázár and Poppe, András},
	booktitle = {2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)},
	doi = {10.1109/ITHERM.2017.7992486},
	unique-id = {3237362},
	abstract = {With the advance of the semiconductor technology power 
		density and related thermal management issues became design 
		bottlenecks. These physical limits require design engineers 
		to make several thermal aware decisions during the design 
		process: the earlier the better. Modern hardware description 
		languages have extensions for simulation of mixed-signal 
		circuits (e.g. SystemC-AMS, Verilog-AMS, VHDL-AMS) but none 
		of these approaches support co-simulation of the effect of 
		the foreseen thermal environment of the design with the logic 
		behavior. 
		A relatively new simulation paradigm called logithermal 
		simulation is aimed to fill this gap in the available set of 
		simulation tools. Our framework for co-simulation of logic 
		and thermal behavior called LogiTherm contains generic 
		interfaces towards usual logic and thermal simulation 
		engines. In our present framework setup SystemC and Verilog 
		is supported as hardware description languages and two 
		thermal field solvers, SUNRED and 3D-ICE can be used as 
		thermal simulation engines. 
		In this paper we present the recent developments of the 
		LogiTherm framework that enable logithermal simulation of 
		mixed signal designs. We demonstrate the capability of our 
		system by presenting simulation results of a test system, 
		which contains a microprocessor and mixed signal components 
		as well.},
	year = {2017},
	pages = {307-313},
	orcid-numbers = {Jani, Lázár/0000-0002-4280-0319; Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:3207234,
	title = {Framework for thermal-aware verification of digital and mixed signal systems},
	url = {https://m2.mtmt.hu/api/publication/3207234},
	author = {Jani, Lázár and Poppe, András},
	doi = {10.1016/j.microrel.2017.03.023},
	journal-iso = {MICROELECTRON RELIAB},
	journal = {MICROELECTRONICS RELIABILITY},
	volume = {79},
	unique-id = {3207234},
	issn = {0026-2714},
	year = {2017},
	eissn = {1872-941X},
	pages = {499-508},
	orcid-numbers = {Jani, Lázár/0000-0002-4280-0319; Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:26783844,
	title = {Automated High-level Modeling of Power, Temperature and Timing Variation for Microprocessor},
	url = {https://m2.mtmt.hu/api/publication/26783844},
	author = {Zheng, Wang and Shazia, Kanwal and Lai, Wang and Anupam, Chattopadhyay},
	doi = {10.14416/j.ijast.2017.08.002},
	journal-iso = {KMUTNB IJAST},
	journal = {KMUTNB INTERNATIONAL JOURNAL OF APPLIED SCIENCE AND TECHNOLOGY},
	volume = {2017},
	unique-id = {26783844},
	year = {2017}
}

@article{MTMT:25796311,
	title = {Feedback system for divertor impurity seeding based on real-time measurements of surface heat flux in the Alcator C-Mod tokamak},
	url = {https://m2.mtmt.hu/api/publication/25796311},
	author = {Brunner, D and Burke, W and Kuang, A Q and LaBombard, B and Lipschultz, B and Wolfe, S},
	doi = {10.1063/1.4941047},
	journal-iso = {REV SCI INSTRUM},
	journal = {REVIEW OF SCIENTIFIC INSTRUMENTS},
	volume = {87},
	unique-id = {25796311},
	issn = {0034-6748},
	year = {2016},
	eissn = {1089-7623}
}

@inproceedings{MTMT:3115614,
	title = {Improved Method for Logi-Thermal Simulation with Temperature Dependent Signal Delay},
	url = {https://m2.mtmt.hu/api/publication/3115614},
	author = {Jani, Lázár and Poppe, András},
	booktitle = {2016 22nd International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'16)},
	doi = {10.1109/THERMINIC.2016.7749071},
	unique-id = {3115614},
	abstract = {Evolution of the semiconductor manufacturing allows integrating 
		more components on a single die which further increase the
		complexity of the chips and introduce new design challenges. 
		Power dissipation density has reached the limits of current 
		cooling solutions, thus thermal-aware decisions must be taken 
		into account during the design process. Co-simulating the logic 
		function and thermal behaviour of the design can help to 
		evaluate the performance of the system at various stages of the 
		design process. Logi-thermal simulators use the switching 
		activities of the system to predict the dissipated power and 
		calculate the temperature distribution across the chip. The 
		temperature dependence of certain parameters (such as delay) can 
		also be considered during the co-simulation. This paper presents 
		an improved method for temperature dependent signal delays 
		compared to previous solutions. Our approach is based on mixed 
		abstraction level logic simulation, which reduce the simulation 
		time while the temperature distribution and the calculated 
		delays remain accurate.},
	year = {2016},
	pages = {302-306},
	orcid-numbers = {Jani, Lázár/0000-0002-4280-0319; Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:3106711,
	title = {Multilevel logic and thermal co-simulation},
	url = {https://m2.mtmt.hu/api/publication/3106711},
	author = {Jani, Lázár and Poppe, András},
	doi = {10.1016/j.microrel.2016.08.019},
	journal-iso = {MICROELECTRON RELIAB},
	journal = {MICROELECTRONICS RELIABILITY},
	volume = {67},
	unique-id = {3106711},
	issn = {0026-2714},
	abstract = {While the semiconductor industry makes progress in every year 
		integrating more components on a single die and stacking them, 
		manufacturers face great challenge as the dissipated power 
		densities reach the limits of current cooling solutions. Since 
		peak temperature and temperature gradients influence the 
		functional behavior of the ICs, co-simulation of the logic 
		function and thermal behavior can help to assess the overall 
		performance of the system at various stages of the design flow 
		better. Logi-thermal simulators (extending the concept of the 
		transistor level electro-thermal simulation of integrated 
		circuits to higher abstraction levels) can predict the 
		dissipated power based on the switching activities of the 
		system, consider the local temperature dependence of certain 
		circuit properties and calculate the temperature distribution 
		across the chip consistently.
		
		This paper presents a logi-thermal simulation framework that 
		allows to couple logic simulators and thermal solver engines to 
		facilitate the co-simulation of high level functional and 
		thermal behavior of digital circuits, both on gate level and 
		register-transfer level. We show examples by integrating SystemC 
		with the thermal simulator SUNRED, and comparing the results of 
		a gate level logi-thermal simulation and logi-thermal simulation 
		obtained with the register-transfer level description of the 
		same system.},
	year = {2016},
	eissn = {1872-941X},
	pages = {46-53},
	orcid-numbers = {Jani, Lázár/0000-0002-4280-0319; Poppe, András/0000-0002-9381-6716}
}

@inproceedings{MTMT:3064883,
	title = {Compact modeling approach for microchannel cooling aimed at high-level thermal analysis of 3D packaged ICs},
	url = {https://m2.mtmt.hu/api/publication/3064883},
	author = {Németh, Márton and Jani, Lázár and Poppe, András},
	booktitle = {Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'16)},
	doi = {10.1109/DTIP.2016.7514865},
	unique-id = {3064883},
	abstract = {This paper presents a new compact modeling technique to describe 
		the convective heat transfer realized by a flow of coolant in 
		integrated microchannels used for thermal management of IC 
		chips. This model works only in case of laminar flow and 
		straight microchannels. The compact model represents the 
		convective heat transfer with alternating resistors in the flow 
		path. The implementation of this model in a successive node 
		reduction (SUNRED) algorithm based thermal filed solver is also 
		presented. A simulation example for a simplified geometry with 
		one channel situated in the center of a pyramidal stack of 
		silicon dice is presented, though, the final target application 
		is
		in the thermal simulation engine of a logi-thermal simulation 
		system. The errors have been calculated as the difference of the 
		results of the alternating resistor and modified SUNRED model 
		and the result of a detailed CFD simulation. The error of our 
		new compact model was below 2 % for both modeling techniques.},
	year = {2016},
	pages = {182-187},
	orcid-numbers = {Németh, Márton/0000-0002-3517-5359; Jani, Lázár/0000-0002-4280-0319; Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:2946363,
	title = {Multi-domain compact modeling of LEDs: an overview of models and experimental data},
	url = {https://m2.mtmt.hu/api/publication/2946363},
	author = {Poppe, András},
	doi = {10.1016/j.mejo.2015.09.013},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {46},
	unique-id = {2946363},
	issn = {0026-2692},
	abstract = {Operating parameters of power LEDs are strongly coupled and 
		are mutually dependent. There have been lots of attempts to 
		provide different kinds of multi-domain LED models with 
		different complexity. This paper gives an overview of 
		recently published models and suggests a practical approach 
		in which the forward current is split into two parts in a 
		straightforward manner. One current component is derived from 
		the LED’s measured radiant flux directly, the other component 
		is calculated as the difference of the net forward current 
		and the previously mentioned current component associated 
		with light emission. Parameters of the proposed model can be 
		identified from isothermal LED characteristics measured in 
		industry standard LED test setups using textbook techniques. 
		Temperature dependence of the model parameters is discussed 
		in detail; including comparison of different models for the 
		temperature dependence of the saturation current in 
		Shockley’s diode equation.},
	year = {2015},
	eissn = {0959-8324},
	pages = {1138-1151},
	orcid-numbers = {Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:25570744,
	title = {Towards electro-thermo-mechanical simulation of integrated circuits in standard CAD environment},
	url = {https://m2.mtmt.hu/api/publication/25570744},
	author = {Garci, Maroua and Kammerer, Jean-Baptiste and Hebrard, Luc},
	doi = {10.1016/j.mejo.2015.09.006},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {46},
	unique-id = {25570744},
	issn = {0026-2692},
	year = {2015},
	eissn = {0959-8324},
	pages = {1121-1128}
}

@article{MTMT:2908301,
	title = {Advancing the thermal stability of 3D ICs using logi-thermal simulation},
	url = {https://m2.mtmt.hu/api/publication/2908301},
	author = {Nagy, Gergely and Horváth, Péter and Pohl, László and Poppe, András},
	doi = {10.1016/j.mejo.2015.06.025},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {46},
	unique-id = {2908301},
	issn = {0026-2692},
	year = {2015},
	eissn = {0959-8324},
	pages = {1114-1120},
	orcid-numbers = {Horváth, Péter/0000-0002-5926-6650; Pohl, László/0000-0003-2390-1381; Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:24233195,
	title = {Exponential ADE Solution Based Compact Model of Planar Injection Enhanced IGBT Dedicated to Robust Power Converter Design},
	url = {https://m2.mtmt.hu/api/publication/24233195},
	author = {Igić, Petar},
	doi = {10.1109/TPEL.2014.2330655},
	journal-iso = {IEEE T POWER ELECTR},
	journal = {IEEE TRANSACTIONS ON POWER ELECTRONICS},
	volume = {30},
	unique-id = {24233195},
	issn = {0885-8993},
	abstract = {The compact model of an injection enhanced insulated gate bipolar transistors based on the exponential solution of the ambipolar diffusion equation is presented in this paper. To model plasma carrier distribution, an exponential shape function is used, and in steady-state forward bias operation, the plasma carrier concentration has a distribution of catenary form with just two exponential basis functions, while in transient operation, more complex profiles can be approximated using a number of exponential basis functions with a range of decay length parameters, shorter than the steady state ones. The device model developed has been implemented in Saber circuit simulator and successfully tested against complete set of high current, high voltage experimental results.},
	year = {2015},
	eissn = {1941-0107},
	pages = {1914-1924}
}

@CONFERENCE{MTMT:25281927,
	title = {A physics-based electro-thermal model for FS IGBT},
	url = {https://m2.mtmt.hu/api/publication/25281927},
	author = {Yu, Cheng Guicui Fu},
	booktitle = {The 2015 3rd International Conference on Material, Mechanical and Manufacturing Engineering (IC3ME 2015)},
	publisher = {Atlantis Press International BV},
	unique-id = {25281927},
	year = {2015},
	pages = {1107-1111}
}

@mastersthesis{MTMT:23892243,
	title = {Multi-Level Analysis of Non-Functional Properties},
	url = {https://m2.mtmt.hu/api/publication/23892243},
	author = {Nadereh, Hatami Mazinani},
	unique-id = {23892243},
	year = {2014}
}

@article{MTMT:23892244,
	title = {REVIEW OF ADVANCED IGBT COMPACT MODELS DEDICATED TO CIRCUIT SIMULATION},
	url = {https://m2.mtmt.hu/api/publication/23892244},
	author = {Petar, Igić and Nebojša, Janković},
	doi = {10.2298/FUEE1401013I},
	journal-iso = {FACTA UNIV SER ELECTRON ENERGET},
	journal = {FACTA UNIVERSITATIS SERIES: ELECTRONICS AND ENERGETICS},
	volume = {27},
	unique-id = {23892244},
	issn = {0353-3670},
	abstract = {The paper aims to review the research area of the IGBT compact modelling and to introduce different device models. The models are separated in two groups, one that solves ambipolar diffusion equation (ADE) and one that does not. Both types of compact models have been successfully used in the past for power electronic circuit design.},
	keywords = {POWER; CIRCUIT; compact; inverter; IGBT},
	year = {2014},
	eissn = {2217-5997},
	pages = {13-23}
}

@inproceedings{MTMT:23892242,
	title = {Logi-thermal analysis of digital circuits using mixed-signal simulator Questa ADMS},
	url = {https://m2.mtmt.hu/api/publication/23892242},
	author = {Petrosyants, K O and Rjabov, N I},
	booktitle = {East-West Design & Test Symposium, 2013},
	doi = {10.1109/EWDTS.2013.6673151},
	unique-id = {23892242},
	year = {2013},
	pages = {1-4}
}

@article{MTMT:23892241,
	title = {Solution of PDEs-electrically coupled systems with electrical analogy},
	url = {https://m2.mtmt.hu/api/publication/23892241},
	author = {Save, YD and Narayanan, H and Patkar, SB},
	doi = {10.1016/j.vlsi.2012.10.002},
	journal-iso = {INTEGRATION-VLSI J},
	journal = {INTEGRATION-THE VLSI JOURNAL},
	volume = {46},
	unique-id = {23892241},
	issn = {0167-9260},
	year = {2013},
	eissn = {1872-7522},
	pages = {427-440}
}

@mastersthesis{MTMT:2944137,
	title = {Logi-termikus szimuláció sztenderd tervező rendszerekben},
	url = {https://m2.mtmt.hu/api/publication/2944137},
	author = {Timár, András},
	publisher = {Budapest University of Technology and Economics},
	unique-id = {2944137},
	year = {2013},
	orcid-numbers = {Timár, András/0000-0002-4173-1550}
}

@article{MTMT:23892233,
	title = {Analysis of Temperature Effect on p-i-n Diode Circuits by a Multiphysics and Circuit Cosimulation Algorithm},
	url = {https://m2.mtmt.hu/api/publication/23892233},
	author = {Chen, JQ and Chen, X and Liu, CJ and Huang, KM and Xu, XB},
	doi = {10.1109/TED.2012.2211602},
	journal-iso = {IEEE T ELECTRON DEV},
	journal = {IEEE TRANSACTIONS ON ELECTRON DEVICES},
	volume = {59},
	unique-id = {23892233},
	issn = {0018-9383},
	year = {2012},
	eissn = {1557-9646},
	pages = {3069-3077}
}

@inproceedings{MTMT:2683177,
	title = {New simulation approaches supporting temperature-aware design of digital ICs},
	url = {https://m2.mtmt.hu/api/publication/2683177},
	author = {Nagy, Gergely and Timár, András and Szalai, Albin and Kerecsen Istvánné Rencz, Márta and Poppe, András},
	booktitle = {2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)},
	doi = {10.1109/STHERM.2012.6188866},
	unique-id = {2683177},
	abstract = {Regarding thermal issues in digital IC design a major concern is how timing integrity is affected by the elevated junction temperature and temperature gradients on the chip surface. To predict this in a thermal aware design process one needs a dedicated simulation tool in which the logic simulation of the circuit is coupled to the thermal simulation of the chip and its environment. This paper presents two approaches to this so called logi-thermal simulation. In one of our approaches we rely completely on industry standard EDA tools, standard EDA file formats and interfaces. In the other solution which provides us total freedom in the abstraction level of circuit description and simulation accuracy we use our own logic simulation engine. In both cases the logic simulation engine is connected to our own thermal simulation engines which also use compact thermal models of the IC package during simulation. This paper describes certain implementation aspects and features of our logi-thermal simulation solutions, with emphasizes on modeling the thermal properties of the IC packaging.},
	year = {2012},
	pages = {313-318},
	orcid-numbers = {Timár, András/0000-0002-4173-1550; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@inproceedings{MTMT:2662891,
	title = {Studying the influence of chip temperatures on timing integrity},
	url = {https://m2.mtmt.hu/api/publication/2662891},
	author = {Timár, András and Kerecsen Istvánné Rencz, Márta},
	booktitle = {Proceedings of the 12th IEEE Latin-American Test Workshop (LATW'11)},
	doi = {10.1109/LATW.2011.5985920},
	unique-id = {2662891},
	abstract = {Thermal (side-)effects can detrimentally influence operation of integrated circuits. The increase of temperature changes the devices’ characteristics and may result in timing integrity issues. In extreme cases the increased delays can foil correct operation of the circuit. This paper presents a methodology as well as a tool to address timing integrity errors caused by thermal effects. The methodology presented shows how the thermal distribution map on the IC surface can be used to calculate device delay changes during logic simulation. A software tool called CellTherm developed in the Department of
		Electron Devices, BME, Hungary is also briefly presented in this
		paper. With the help of the software, logic simulations of digital integrated circuits can be back-annotated with temperaturedependent delays during the running simulation.},
	year = {2011},
	orcid-numbers = {Timár, András/0000-0002-4173-1550; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@article{MTMT:23892227,
	title = {SABER-based simulation for compact dynamic electro-thermal modeling analysis of power electronic devices},
	url = {https://m2.mtmt.hu/api/publication/23892227},
	author = {Chen, M and Hu, A and Tang, Y and Wang, B},
	doi = {10.4028/www.scientific.net/AMR.291-294.1704},
	journal-iso = {ADV MATER RES},
	journal = {ADVANCED MATERIALS RESEARCH},
	volume = {291-294},
	unique-id = {23892227},
	issn = {1022-6680},
	year = {2011},
	eissn = {1662-8985},
	pages = {1704-1708}
}

@inproceedings{MTMT:2668280,
	title = {A Novel Simulation Environment Enabling Multilevel Power Estimation of Digital Systems},
	url = {https://m2.mtmt.hu/api/publication/2668280},
	author = {Nagy, Gergely and Poppe, András},
	booktitle = {Proceedings of the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'11)},
	unique-id = {2668280},
	abstract = {This paper presents a novel logi-thermal simulator
		architecture. A logi-thermal simulator encorporates a logic and
		a thermal core in strong coupling. It is capable of calculating
		the self-heating of digital blocks and is able to account for the consequences of temperature change by implementing the delays of the blocks as a function of the temperature. 
		
		The simulator architecture presented is able to work with logic entities described at different levels of abstraction. This allows to simulate a design at a very early phase when only
		high-level descriptions are available or to simulate systems
		that have elements in different design phases. Such a feature
		enables engineers to perform logi-thermal simulation throughout
		almost the entire design process which allows for the application of multiple-level optimization. It can also be used to shorten simulation times when only some parts of the design need to be simulated in high detail.},
	year = {2011},
	pages = {149-152},
	orcid-numbers = {Poppe, András/0000-0002-9381-6716}
}

@inproceedings{MTMT:23893013,
	title = {3D electro-thermal simulations of analog ICs carried out with standard CAD tools and verilog-A},
	url = {https://m2.mtmt.hu/api/publication/23893013},
	author = {Krencker, J -C and Kammerer, J -B and Hervé, Y and Hébrard, L},
	booktitle = {Proceedings of the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'11)},
	unique-id = {23893013},
	year = {2011},
	pages = {19-22}
}

@mastersthesis{MTMT:23892237,
	title = {Electrothermal Analysis of Three-Dimensional Integrated Circuits},
	url = {https://m2.mtmt.hu/api/publication/23892237},
	author = {Theodore, Robert HARRIS},
	unique-id = {23892237},
	year = {2011}
}

@inproceedings{MTMT:2655080,
	title = {Electro-thermal co-simulation of ICs with runtime back-annotation capability},
	url = {https://m2.mtmt.hu/api/publication/2655080},
	author = {Timár, András and Bognár, György and Poppe, András and Kerecsen Istvánné Rencz, Márta},
	booktitle = {Proceedings of the 16th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'10)},
	unique-id = {2655080},
	abstract = {This paper presents a novel approach to logical
		and thermal co-simulation of ASIC circuits. Numerous electrothermal simulator implementations are present nowadays, but these simulators approach the electro-thermal simulation domain by co-simulating electronic and thermal effects at a low structural level. This approach has the advantage of being very accurate but at the expense of simulation time. In this paper we provide an alternative way to simulate standard cell ASIC circuits electrically and thermally in a concurrent process in real-time, in RTL level. Our approach takes standard cells of the digital design as basic building blocks and calculates a thermal distribution map on the surface of the virtual chip. The temperature map is calculated from the cells’ power characteristics and the switching activity of the regularly working circuit. We call the presented approach logi-thermal simulation. An implementation of the method is also presented in this paper: a new simulation software, LogiTherm is under heavy development in the Department of Electron Devices at BME, Hungary.},
	year = {2010},
	pages = {183-188},
	orcid-numbers = {Timár, András/0000-0002-4173-1550; Bognár, György/0000-0003-4582-3900; Poppe, András/0000-0002-9381-6716; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@inproceedings{MTMT:23892210,
	title = {Automatic Thermal Network Extraction and Multiscale Electro-Thermal Simulation},
	url = {https://m2.mtmt.hu/api/publication/23892210},
	author = {Culpo, M and de Falco, C and Denk, G and Voigtmann, S},
	booktitle = {SCIENTIFIC COMPUTING IN ELECTRICAL ENGINEERING SCEE 2008},
	doi = {10.1007/978-3-642-12294-1_36},
	unique-id = {23892210},
	year = {2010},
	pages = {281-288}
}

@inproceedings{MTMT:23892209,
	title = {Direct Electro-Thermal Simulation of Integrated Circuits using Standard CAD Tools},
	url = {https://m2.mtmt.hu/api/publication/23892209},
	author = {J, Ch Krencker and J B, Kammerer and Y, Hervé and L, Hébrard},
	booktitle = {Proceedings of the 16th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'10)},
	unique-id = {23892209},
	year = {2010},
	pages = {61-64}
}

@inproceedings{MTMT:2662675,
	title = {A Novel Approach of Logi-thermal Simulation Methodology and Implementation for ASIC Designs},
	url = {https://m2.mtmt.hu/api/publication/2662675},
	author = {Timár, András and Poppe, András and Kerecsen Istvánné Rencz, Márta},
	booktitle = {Proceedings of the 17th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES '10)},
	unique-id = {2662675},
	year = {2010},
	pages = {351-356},
	orcid-numbers = {Timár, András/0000-0002-4173-1550; Poppe, András/0000-0002-9381-6716; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@mastersthesis{MTMT:23932525,
	title = {Thermal Modeling and Management of Microprocessors},
	url = {https://m2.mtmt.hu/api/publication/23932525},
	author = {Karthik, Sankaranarayanan},
	unique-id = {23932525},
	year = {2009}
}

@inproceedings{MTMT:23892211,
	title = {Logi-Thermal Simulation of Digital CMOS ICs with Emphasis on Dynamic Power Dissipation},
	url = {https://m2.mtmt.hu/api/publication/23892211},
	author = {Klab, S and Napieralski, A and De Mey, G},
	booktitle = {MIXDES 2009: PROCEEDINGS OF THE 16TH INTERNATIONAL CONFERENCE MIXED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS},
	unique-id = {23892211},
	year = {2009},
	pages = {361-365}
}

@mastersthesis{MTMT:23892236,
	title = {Numerical Algorithms for System Level Electro-Thermal Simulation},
	url = {https://m2.mtmt.hu/api/publication/23892236},
	author = {Massimiliano, Culpo},
	unique-id = {23892236},
	year = {2009}
}

@inproceedings{MTMT:26443868,
	title = {Electro-thermal simulation: A new subsystem in mentor graphics IC design flow},
	url = {https://m2.mtmt.hu/api/publication/26443868},
	author = {Petrosjanc, KO and Ryabov, NI and Kharitonov, IA and Kozynko, PA},
	booktitle = {Proceedings of the 15th International Worshop on THERMal INvestigations of ICs and Systems (THERMINIC'09)},
	publisher = {IEEE},
	unique-id = {26443868},
	year = {2009},
	pages = {70-74}
}

@inproceedings{MTMT:2613659,
	title = {Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits},
	url = {https://m2.mtmt.hu/api/publication/2613659},
	author = {Poppe, András and Horváth, György Gábor and Nagy, Gergely and Kerecsen Istvánné Rencz, Márta and Székely, Vladimir},
	booktitle = {Proceedings of the 24th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'08)},
	doi = {10.1109/STHERM.2008.4509369},
	unique-id = {2613659},
	year = {2008},
	pages = {68-76},
	orcid-numbers = {Poppe, András/0000-0002-9381-6716; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@article{MTMT:23892205,
	title = {Electro-Thermal Analysis of Multi-Fin Devices},
	url = {https://m2.mtmt.hu/api/publication/23892205},
	author = {Brian, Swahn and Soha, Hassoun},
	doi = {10.1109/TVLSI.2008.2000455},
	journal-iso = {IEEE T VLSI SYST},
	journal = {IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS},
	volume = {16},
	unique-id = {23892205},
	issn = {1063-8210},
	year = {2008},
	pages = {816-829}
}

@article{MTMT:23892202,
	title = {Investigation of the Impact of Power Granularity on Chip Thermal Modeling Using White Noise Analysis},
	url = {https://m2.mtmt.hu/api/publication/23892202},
	author = {Etessam-Yazdani, K and Asheghi, M and Hamann, H F},
	doi = {10.1109/TCAPT.2008.916859},
	journal-iso = {IEEE T COMPON PACK T},
	journal = {IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES},
	volume = {31},
	unique-id = {23892202},
	issn = {1521-3331},
	year = {2008},
	pages = {211-215}
}

@inproceedings{MTMT:2626538,
	title = {Consideration of Thermal Effects in Logic Simulation},
	url = {https://m2.mtmt.hu/api/publication/2626538},
	author = {Nagy, Gergely and Horváth, György Gábor and Poppe, András},
	booktitle = {Proceedings of the 14th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'08)},
	doi = {10.1109/THERMINIC.2008.4669914},
	unique-id = {2626538},
	abstract = {This paper presents a method that considers
		thermal effects in logic simulations. The aim is to develop a tool
		that is capable of modeling the thermal behavior of a digital
		circuit and, at the same time, yields results almost at the speed
		of ordinary logic simulators. The importance of such a
		simulation is that thermal effects can be the cause of signal
		integrity problems.
		The structure and the basic operation of the simulator are
		discussed as well as the issues that need to be addressed
		throughout the development. A detailed description of the
		implementation of the tightly integrated thermal and logic
		simulation is also given.},
	year = {2008},
	pages = {229-234},
	orcid-numbers = {Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:26436502,
	title = {Development of an electrothermal simulation tool for integrated circuits: Application to a two-transistor circuit},
	url = {https://m2.mtmt.hu/api/publication/26436502},
	author = {Mohammadi, F A and Attar, S Sharifian},
	doi = {10.1109/CJECE.2008.4721625},
	journal-iso = {CAN J ELECT COMPUT E},
	journal = {CANADIAN JOURNAL OF ELECTRICAL AND COMPUTER ENGINEERING-REVUE CANADIENNE DE GENIE ELECTRIQUE ET INFORMATIQUE},
	volume = {33},
	unique-id = {26436502},
	issn = {0840-8688},
	year = {2008},
	eissn = {0840-8688},
	pages = {191-200}
}

@CONFERENCE{MTMT:23892239,
	title = {Realizacija processaelektro teplovogo modelirovanija v SAPR BIS Mentor Graphics [Реализация процесса электротеплового моделирования в САПР БИС Mentor Graphics]},
	url = {https://m2.mtmt.hu/api/publication/23892239},
	author = {Petrosjanc, KO and Rjabov, NI and Kharitonov, IA and Kozunko, P},
	booktitle = {Problemi razrabotki mikro- i nanoelektronnikh sistem – 2008 Sbornik nauchnikh trudov [Проблемы разработки перспективных микро- и наноэлектронных систем - 2008. Сборник научных трудов / под общ. ред. А.Л.Стемпковского. М.:ИППМ РАН,]},
	unique-id = {23892239},
	year = {2008},
	pages = {243-246}
}

@inproceedings{MTMT:23892231,
	title = {An ADPLL-based fast start-up technique for sensor radio frequency synthesizers},
	url = {https://m2.mtmt.hu/api/publication/23892231},
	author = {Xu, L and Lindfors, S and Ryynänen, J},
	booktitle = {Proceedings of the 15th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2008},
	doi = {10.1109/ICECS.2008.4674872},
	unique-id = {23892231},
	year = {2008},
	pages = {388-391}
}

@inproceedings{MTMT:23892188,
	title = {New Electro-Thermal Integrated Circuit Modeling using Coupling of Simulators},
	url = {https://m2.mtmt.hu/api/publication/23892188},
	author = {Attar, S S and Yagoub, M C E and Mohammadi, F},
	booktitle = {Proceedings of the Canadian Conference on Electrical and Computer Engineering (CCECE'06)},
	doi = {10.1109/CCECE.2006.277791},
	unique-id = {23892188},
	year = {2007},
	pages = {1218-1222}
}

@CONFERENCE{MTMT:23892207,
	title = {A New Technique of Multi-layer Thermal Analysis for VLSI Chips},
	url = {https://m2.mtmt.hu/api/publication/23892207},
	author = {Keiji, Nakabayashi and Kazuo, Nakajima and Hajimu, Iida},
	booktitle = {Proceedings of the 9th WSEAS Int. Conference on Mathematical Methods and Computational Techniques in Electrical Engineering},
	unique-id = {23892207},
	year = {2007},
	pages = {24-30}
}

@misc{MTMT:23892197,
	title = {Alleviating Thermal Constraints while Maintaining Performance Via Silicon-Based On-Chip Optical Interconnects},
	url = {https://m2.mtmt.hu/api/publication/23892197},
	author = {N, Nelson and G, Briggs and M, Haurylau and G, Chen and H, Chen and D H, Albonesi and E G, Friedman and P M, Fauchet},
	unique-id = {23892197},
	year = {2007}
}

@inproceedings{MTMT:2613643,
	title = {Multi-domain simulation and measurement of power LED-s and power LED assemblies},
	url = {https://m2.mtmt.hu/api/publication/2613643},
	author = {Poppe, András and Farkas, Gábor and Székely, Vladimir and Horváth, György Gábor and Kerecsen Istvánné Rencz, Márta},
	booktitle = {Proceedings of the 22nd IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'06)},
	doi = {10.1109/STHERM.2006.1625227},
	unique-id = {2613643},
	year = {2006},
	pages = {191-198},
	orcid-numbers = {Poppe, András/0000-0002-9381-6716; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@book{MTMT:23892245,
	title = {Thermal and Power Management of Integrated Circuits. Chapter 4: Thermal and Electrothermal Modeling},
	url = {https://m2.mtmt.hu/api/publication/23892245},
	isbn = {9780387297491},
	author = {Arman, Vassighi and Manoj, Sachdev},
	doi = {10.1007/0-387-29749-9_4},
	publisher = {Springer Netherlands},
	unique-id = {23892245},
	year = {2006}
}

@article{MTMT:23892189,
	title = {Simulation of Electro-Thermal Effects in Device and Circuit},
	url = {https://m2.mtmt.hu/api/publication/23892189},
	author = {Attar, S S and Yagoub, M C E and Mohammadi, F},
	journal-iso = {WSEAS TRANS CIRCUITS SYSTEMS},
	journal = {WSEAS TRANSACTIONS ON CIRCUITS AND SYSTEMS},
	volume = {5},
	unique-id = {23892189},
	issn = {1109-2734},
	year = {2006},
	eissn = {2224-266X},
	pages = {926-930}
}

@CONFERENCE{MTMT:23892208,
	title = {Simulation of Electro-Thermal Effects in Device and Circuit},
	url = {https://m2.mtmt.hu/api/publication/23892208},
	author = {ATTAR, S SHARIFIAN and YAGOUB, M C E and MOHAMMADI, F},
	booktitle = {Proceedings of the 10th WSEAS International Conference on CIRCUITS},
	unique-id = {23892208},
	year = {2006},
	pages = {143-147}
}

@inproceedings{MTMT:23892200,
	title = {METS: A Metric for Electro-Thermal Sensitivity, and Its Application To FinFETs},
	url = {https://m2.mtmt.hu/api/publication/23892200},
	author = {B, Swahn and S, Hassoun},
	booktitle = {Proceedings of the 7th International Symposium on Quality Electronic Design (ISDEQ'06)},
	doi = {10.1109/ISQED.2006.86},
	unique-id = {23892200},
	year = {2006},
	pages = {121-126}
}

@article{MTMT:23892249,
	title = {Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods},
	url = {https://m2.mtmt.hu/api/publication/23892249},
	author = {Pedram, M and Nazarian, S},
	doi = {10.1109/JPROC.2006.879797},
	journal-iso = {P IEEE},
	journal = {PROCEEDINGS OF THE IEEE},
	volume = {94},
	unique-id = {23892249},
	issn = {0018-9219},
	year = {2006},
	eissn = {1558-2256},
	pages = {1487-1501}
}

@inproceedings{MTMT:26813208,
	title = {An Adaptive-Grain Thermal Simulation Method to Evaluate Effects of Spatio-Temporal Analysis Granularity upon The Thermal Behavior of VLSIs},
	url = {https://m2.mtmt.hu/api/publication/26813208},
	author = {M, Ito and N, Hesegawa and R, Egawa and KI, Suzuki and T, Nakamura},
	booktitle = {Proceedings of the 11th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'05)},
	unique-id = {26813208},
	year = {2005},
	pages = {43-50}
}

@inproceedings{MTMT:23892198,
	title = {Temperature Gradient Alleviating Method for Arithmetic Units},
	url = {https://m2.mtmt.hu/api/publication/23892198},
	author = {R, Egawa and M, Ito and N, Hasegawa and T, Nakamura and K, Suzuki},
	booktitle = {Proceedings of the 11th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'05)},
	unique-id = {23892198},
	year = {2005},
	pages = {151-156}
}

@inproceedings{MTMT:23892216,
	title = {TED thermo electrical designer: a new physical design verification tool},
	url = {https://m2.mtmt.hu/api/publication/23892216},
	author = {Sokolowska, E and Barszcz, M and Kaminska, B},
	booktitle = {6th International Symposium on Quality Electronic Design, Proceedings},
	doi = {10.1109/ISQED.2005.119},
	unique-id = {23892216},
	year = {2005},
	pages = {164-168}
}

@inproceedings{MTMT:23892238,
	title = {Simulating fine-grain thermal behaviors on VLSIs},
	url = {https://m2.mtmt.hu/api/publication/23892238},
	author = {ITO, Mutsuo and EGAWA, Ryusuke and SANO, Kentaro and SUZUKI, Ken-Ichi and NAKAMURA, Tadao},
	booktitle = {Proceedings of the 10th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'04)},
	unique-id = {23892238},
	year = {2004},
	pages = {63-68}
}

@inproceedings{MTMT:23932522,
	title = {A computer-architecture approach to thermal management in computer systems: opportunities and challenges},
	url = {https://m2.mtmt.hu/api/publication/23932522},
	author = {K, Skadron and M R, Stan and W, Huang and Zhijian, Lu and K, Sankaranarayanan and J, Lach},
	booktitle = {Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE'04)},
	doi = {10.1109/ESIME.2004.1304072},
	unique-id = {23932522},
	year = {2004},
	pages = {415-422}
}

@CONFERENCE{MTMT:23892204,
	title = {Model to Hardware Closure for nm Generation Technologies},
	url = {https://m2.mtmt.hu/api/publication/23892204},
	author = {Sani, R Nassif},
	booktitle = {Proceedings of the 12th Workshop on Synthesis And System Integration of MIxed Technologies (SASIMI'04)},
	unique-id = {23892204},
	year = {2004},
	pages = {15-20}
}

@inproceedings{MTMT:2607107,
	title = {Electro-thermal Transistor Models in the Sissi Electro-thermal IC Simulator},
	url = {https://m2.mtmt.hu/api/publication/2607107},
	author = {Székely, Vladimir and Poppe, András and Hajas, G},
	booktitle = {Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE'04)},
	doi = {10.1109/esime.2004.1304029},
	unique-id = {2607107},
	year = {2004},
	pages = {105-112},
	orcid-numbers = {Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:23892835,
	title = {A dynamic thermal management circuit for system-on-chip designs},
	url = {https://m2.mtmt.hu/api/publication/23892835},
	author = {Chiueh, Herming and Draper, Jeffrey and Choma, John},
	doi = {10.1023/A:1024430504653},
	journal-iso = {ANALOG INTEGR CIRC S},
	journal = {ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING},
	volume = {36},
	unique-id = {23892835},
	issn = {0925-1030},
	year = {2003},
	eissn = {1573-1979},
	pages = {175-181}
}

@article{MTMT:23892191,
	title = {An Arnoldi based thermal network reduction method for electro-thermal analysis},
	url = {https://m2.mtmt.hu/api/publication/23892191},
	author = {Codecasa, L and D'Amore, D and Maffezzoni, P},
	doi = {10.1109/TCAPT.2002.808005},
	journal-iso = {IEEE T COMPON PACK T},
	journal = {IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES},
	volume = {26},
	unique-id = {23892191},
	issn = {1521-3331},
	year = {2003},
	pages = {186-192}
}

@inproceedings{MTMT:23892192,
	title = {Large time-scale electro-thermal simulation for loss and thermal management of power MOSFET},
	url = {https://m2.mtmt.hu/api/publication/23892192},
	author = {Hoon, Lee J and Cho, B H},
	booktitle = {Proceedings of the 34th IEEE Annual Power Electronics Specialist Conference (PESC'03)},
	unique-id = {23892192},
	year = {2003},
	pages = {112-117}
}

@misc{MTMT:23892203,
	title = {Temperature-Aware Microarchitecture: Extended Discussion and Results},
	url = {https://m2.mtmt.hu/api/publication/23892203},
	author = {Kevin, Skadron and Mircea, R Stan' and Wei, Huang and Sivakumar, Velusamy and Karthik, Sankaranarayanan and David, Tarjan},
	unique-id = {23892203},
	year = {2003}
}

@inproceedings{MTMT:2613617,
	title = {A fast algorithm for the layout based electro-thermal simulation},
	url = {https://m2.mtmt.hu/api/publication/2613617},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir and Poppe, András},
	booktitle = {Proceedings of the Design, Automation and Test in Europe Conference and Exhibition (DATE'03)},
	doi = {10.1109/DATE.2003.1253740},
	unique-id = {2613617},
	abstract = {A new algorithm has been developed for the layout based direct electro-thermal simulation of integrated circuits. The advantage of the direct electro-thermal simulation over simulator coupling is, that very fast changes can also be considered, the drawback is that the thermal nodes are added to the number of nodes of the network to be simulated. The novelties of our method are the modeling and the solution of the thermal structure. This paper presents the algorithm of the time constant spectrum based FOSTER chain matrix thermal modeling, and the new algorithm of the coupled electro-thermal solution, where parts of the network, which represent the thermal behavior, are not computed in all steps of the iteration. This speeded up algorithm works both in the time-, and in the frequency domain. A simulation example demonstrates a typical application: the prediction of how the layout arrangement and the packaging of an analogue integrated circuit influence the electrical parameters.},
	year = {2003},
	pages = {1032-1037},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@inproceedings{MTMT:2613619,
	title = {Electro-thermal simulation for the prediction of chip operation within the package},
	url = {https://m2.mtmt.hu/api/publication/2613619},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir and Poppe, András and K, Torki and B, Courtois},
	booktitle = {Proceedings of the 19th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'03)},
	doi = {10.1109/STHERM.2003.1194357},
	unique-id = {2613619},
	year = {2003},
	pages = {168-175},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@inproceedings{MTMT:2613621,
	title = {Electro-thermal simulation of MEMS elements},
	url = {https://m2.mtmt.hu/api/publication/2613621},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir and Poppe, András and B, Courtois},
	booktitle = {Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'03)},
	doi = {10.1109/DTIP.2003.1287001},
	unique-id = {2613621},
	year = {2003},
	pages = {15-20},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@misc{MTMT:25401610,
	title = {TED software tools for thermal evaluation of integrated circuits. White Paper Version 2.1},
	url = {https://m2.mtmt.hu/api/publication/25401610},
	author = {PULTRONICS, Inc},
	unique-id = {25401610},
	year = {2003}
}

@inproceedings{MTMT:2607072,
	title = {Algorithmic and Modeling Aspects in the Electro-thermal Simulation of Thermally Operated Microsystems},
	url = {https://m2.mtmt.hu/api/publication/2607072},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir and Poppe, András and Courtois, B},
	booktitle = {Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show (NANOTECH'03)},
	unique-id = {2607072},
	abstract = {A new algorithm has been developed for the layout based electro-thermal simulation of integrated circuits and MEMS, using simultaneous iteration. The general advantage of this method over simulator coupling is that, in contrast with the case of simulator coupling, very fast changes can also be considered. The usual drawback is however, that the thermal nodes have to be added to the nodes of the electrical network, rendering usually huge networks to be simulated. The novelties of our method are the modeling and the solution of the thermal structure that results in fastened calculations. The novelty of the modeling is that the thermal impedances are represented with the discretised thermal time-constant spectrum. The novelty of the solution algorithm is that in our method pre-computed solutions are used for the representation of the linear thermal sub-network, effectively reducing the number of thermal nodes that are participating in the iteration. This fastened algorithm works both in the time-, and in the frequency domain. The paper will shortly summarize the algorithm of the time constant spectrum based thermal modeling and the new algorithm of the electro-thermal co-simulation. In order to verify the correctness of the simulated electrical and thermal values, the simulated results will be compared with the measured results of a realised electro-thermal converter.},
	keywords = {MEMS simulation; Electro-thermal simulation; Compact thermal modeling},
	year = {2003},
	pages = {476-479},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@inproceedings{MTMT:23892170,
	title = {High level synthesis with adaptive evolutionary algorithm for solving reliability and thermal problems in reconfigurable microelectronic systems},
	url = {https://m2.mtmt.hu/api/publication/23892170},
	author = {S, Koziel and W, Szezesniak},
	booktitle = {Proceedings of the 9th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'03)},
	unique-id = {23892170},
	year = {2003},
	pages = {79-84}
}

@article{MTMT:23892558,
	title = {HotSpot: a dynamic compact thermal model at the processor-architecture level},
	url = {https://m2.mtmt.hu/api/publication/23892558},
	author = {Stan, MR and Skadron, K and Barcella, M and Huang, W and Sankaranarayanan, K and Velusamy, S},
	doi = {10.1016/S0026-2692(03)00206-4},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {34},
	unique-id = {23892558},
	issn = {0026-2692},
	year = {2003},
	eissn = {0959-8324},
	pages = {1153-1165}
}

@CONFERENCE{MTMT:23932521,
	title = {HotSpot: techniques for modeling thermal effects at the processor-architecture level,},
	url = {https://m2.mtmt.hu/api/publication/23932521},
	author = {Kevin, Skadron and Mircea, Stan and Marco, Barcella and Amar, Dwarka and Wei, Huang and Yingmin, Li and Yong, Ma and Amit, Naidu and Dharmesh, Parikh and Paolo, Re and Garrett, Rose and Karthik, Sankaranarayanan and Ram, Suryanarayan and Sivakumar, Velusamy and Hao, Zhang and Yan, Zhang},
	booktitle = {Proceedings of the 8th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'02)},
	unique-id = {23932521},
	year = {2002},
	pages = {169-172}
}

@CONFERENCE{MTMT:23932449,
	title = {IC thermal map from digital and thermal simulations},
	url = {https://m2.mtmt.hu/api/publication/23932449},
	author = {K, Torki and F, Ciontu},
	booktitle = {Proceedings of the 8th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'02)},
	unique-id = {23932449},
	year = {2002},
	pages = {303-308}
}

@article{MTMT:23892085,
	title = {Thermal coupling in integrated circuits: application to thermal testing},
	url = {https://m2.mtmt.hu/api/publication/23892085},
	isbn = {1402070764},
	author = {Altet, J and Rubio, A and Schaub, E and Dilhaire, S and Claeys, W},
	doi = {10.1109/4.896232},
	journal-iso = {IEEE J SOLID-ST CIRC},
	journal = {IEEE JOURNAL OF SOLID-STATE CIRCUITS},
	volume = {36},
	unique-id = {23892085},
	issn = {0018-9200},
	year = {2001},
	eissn = {1558-173X},
	pages = {81-91}
}

@article{MTMT:24029418,
	title = {Electrothremal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3D systems},
	url = {https://m2.mtmt.hu/api/publication/24029418},
	author = {Batty, W and Christoffersen, CE and Panks, AJ and David, S and Snowden, CM and Steer, MB},
	doi = {10.1109/6144.974944},
	journal-iso = {IEEE T COMPON PACK T},
	journal = {IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES},
	volume = {24},
	unique-id = {24029418},
	issn = {1521-3331},
	year = {2001},
	pages = {566-590}
}

@inproceedings{MTMT:24029549,
	title = {Fully physical time-dependent compact thermal modelling of complex non linear 3-dimensional systems for device and circuit level electro-thermal CAD},
	url = {https://m2.mtmt.hu/api/publication/24029549},
	author = {Batty, W and Christoffersen, CE and David, S and Panks, AJ and Johnson, RG and Snowden, CM and Steer, MB},
	booktitle = {Proceedings of the 17th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'01)},
	doi = {10.1109/STHERM.2001.915149},
	unique-id = {24029549},
	year = {2001},
	pages = {71-84}
}

@article{MTMT:23892193,
	title = {Thermal component model for electrothermal analysis of IGBT module systems},
	url = {https://m2.mtmt.hu/api/publication/23892193},
	author = {Chan-Su, Yun and Malberti, P and Ciappa, M and Fichtner, W},
	doi = {10.1109/6040.938309},
	journal-iso = {IEEE T ADV PACKAGING},
	journal = {IEEE TRANSACTIONS ON ADVANCED PACKAGING},
	volume = {24},
	unique-id = {23892193},
	issn = {1521-3323},
	year = {2001},
	pages = {401-406}
}

@inproceedings{MTMT:23892222,
	title = {A dynamic thermal management circuit for system-on-chip designs},
	url = {https://m2.mtmt.hu/api/publication/23892222},
	author = {Chiueh, H and Draper, J and Choma, J},
	booktitle = {ICECS 2001: 8TH IEEE INTERNATIONAL CONFERENCE ON ELECTRONICS, CIRCUITS AND SYSTEMS, VOLS I-III, CONFERENCE PROCEEDINGS},
	doi = {10.1109/ICECS.2001.957542},
	unique-id = {23892222},
	year = {2001},
	pages = {577-580}
}

@inproceedings{MTMT:23892174,
	title = {Dynamic electro-thermal physically based compact models of the power devices for device and circuit simulations},
	url = {https://m2.mtmt.hu/api/publication/23892174},
	author = {Igic, P M and Mawby, P A and Towers, M S and Batcup, S},
	booktitle = {Proceedings of the 17th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'01)},
	doi = {10.1109/STHERM.2001.915142},
	unique-id = {23892174},
	year = {2001},
	pages = {35-42}
}

@article{MTMT:23892176,
	title = {Electro-thermal simulation of microsystems with mixed abstraction modelling},
	url = {https://m2.mtmt.hu/api/publication/23892176},
	author = {Jakovljevic, M and Fotiu, PA and Mrcarica, Z and Litovski, V and Detter, H},
	doi = {10.1016/S0026-2714(01)00024-5},
	journal-iso = {MICROELECTRON RELIAB},
	journal = {MICROELECTRONICS RELIABILITY},
	volume = {41},
	unique-id = {23892176},
	issn = {0026-2714},
	year = {2001},
	eissn = {1872-941X},
	pages = {823-835}
}

@article{MTMT:23892175,
	title = {Physically based compact device models for circuit modelling applications},
	url = {https://m2.mtmt.hu/api/publication/23892175},
	author = {Mawby, PA and Igic, PM and Towers, MS},
	doi = {10.1016/S0026-2692(01)00013-1},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {32},
	unique-id = {23892175},
	issn = {0026-2692},
	year = {2001},
	eissn = {0959-8324},
	pages = {433-447}
}

@inproceedings{MTMT:23892199,
	title = {Modeling and forecasting of manufacturing variations},
	url = {https://m2.mtmt.hu/api/publication/23892199},
	author = {Sani, R Nassif},
	booktitle = {Proceedings of the ASP-DAC 2001 Asia and South Pacific Design Automation Conference},
	doi = {10.1145/370155.370308},
	unique-id = {23892199},
	year = {2001},
	pages = {145-150}
}

@article{MTMT:23892177,
	title = {Influence of high-level synthesis on average and peak temperatures of CMOS circuits},
	url = {https://m2.mtmt.hu/api/publication/23892177},
	author = {Szczesniak, W and Voss, B and Theisen, M and Becker, J and Glesner, M},
	doi = {10.1016/S0026-2692(01)00073-8},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {32},
	unique-id = {23892177},
	issn = {0026-2692},
	year = {2001},
	eissn = {0959-8324},
	pages = {855-862}
}

@CONFERENCE{MTMT:23892195,
	title = {Substrate thermal model reduction for efficient transient electrothermal simulation},
	url = {https://m2.mtmt.hu/api/publication/23892195},
	author = {Ching-Han, Tsai and Sung-Mo, Kang},
	booktitle = {Proceedings of the Southwest Symposium on Mixed-Signal Design (SSMSD'00)},
	doi = {10.1109/SSMSD.2000.836471},
	unique-id = {23892195},
	year = {2000},
	pages = {185-190}
}

@article{MTMT:23892183,
	title = {Thermal macromodelling of integrated circuits},
	url = {https://m2.mtmt.hu/api/publication/23892183},
	author = {Noren, KV and Tarakji, A},
	doi = {10.1080/002072100404604},
	journal-iso = {INT J ELECTRON},
	journal = {INTERNATIONAL JOURNAL OF ELECTRONICS},
	volume = {87},
	unique-id = {23892183},
	issn = {0020-7217},
	year = {2000},
	eissn = {1362-3060},
	pages = {941-959}
}

@inproceedings{MTMT:23892253,
	title = {High-speed digital GaAs ICs electro-thermal simulation with PSPICE},
	url = {https://m2.mtmt.hu/api/publication/23892253},
	author = {K O, Petrojanc and I A, Kharitonov and P, Maltcev and N I, Rjabov and L N, Kravtchenko and A N, Sapelnikov},
	booktitle = {Proceedings of the 18th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'99)},
	unique-id = {23892253},
	year = {1999},
	pages = {103-106}
}

@article{MTMT:2613574,
	title = {Algorithmic and practical questions of electro-thermal circuit simulation},
	url = {https://m2.mtmt.hu/api/publication/2613574},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir and A, Páhi and Poppe, András},
	doi = {10.1117/12.368423},
	journal-iso = {PROCEEDINGS OF SPIE},
	journal = {PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING},
	volume = {3893},
	unique-id = {2613574},
	issn = {0277-786X},
	abstract = {In recent years great attention has been paid to the thermal issues in electronics design on system, board, package and chip level, including thermal and electro-thermal simulation of integrated circuits and MCM-s, or even integrated microsystems. In this paper we address some algorithmic issues regarding the method of simultaneous iteration. With the node reduction algorithm outlined here electro-thermal simulation of large problems becomes feasible. Besides this algorithmic innovation we provide a specification for a modular, platform independent electro-thermal simulator.},
	year = {1999},
	eissn = {1996-756X},
	pages = {178-187},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:23892194,
	title = {Introducing cool chips},
	url = {https://m2.mtmt.hu/api/publication/23892194},
	author = {Nakamura, T},
	doi = {10.1109/MM.1999.782562},
	journal-iso = {IEEE MICRO},
	journal = {IEEE MICRO},
	volume = {19},
	unique-id = {23892194},
	issn = {0272-1732},
	year = {1999},
	eissn = {1937-4143},
	pages = {9-10}
}

@inproceedings{MTMT:2613575,
	title = {An alternative method for electro-thermal circuit simulation},
	url = {https://m2.mtmt.hu/api/publication/2613575},
	author = {Kerecsen Istvánné Rencz, Márta and Székely, Vladimir and Páhi, A and Poppe, András},
	booktitle = {Proceedings of the IEEE 1999 Southwest Symposium on Mixed-Signal Design (SSMSD '99)},
	doi = {10.1109/SSMSD.1999.768603},
	unique-id = {2613575},
	year = {1999},
	pages = {117-122},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853; Poppe, András/0000-0002-9381-6716}
}

@article{MTMT:2607045,
	title = {A Step Forward in the Transient Thermal Characterization of Chips and Packages},
	url = {https://m2.mtmt.hu/api/publication/2607045},
	author = {Székely, Vladimir and Kerecsen Istvánné Rencz, Márta and Courtois, B},
	doi = {10.1016/S0026-2714(98)00198-X},
	journal-iso = {MICROELECTRON RELIAB},
	journal = {MICROELECTRONICS RELIABILITY},
	volume = {39},
	unique-id = {2607045},
	issn = {0026-2714},
	abstract = {Generating compact dynamic thermal models is a key issue in the thermal characterization of packages. A further but related problem is the modeling of the thermal coupling between chip locations, for the use in electro-thermal circuit simulators. The paper presents a measurement based method which provides a way to solve both problems. A thermal benchmark chip has been designed and realized, to facilitate thermal transient measurements. The developed evaluation method provides the compact thermal multiport model of the IC chip including package effects, for the accurate electro-thermal simulation of the ICs. The evaluation method is also suitable to generate the compact thermal model of the package. (C) 1999 Elsevier Science Ltd. All rights reserved.},
	year = {1999},
	eissn = {1872-941X},
	pages = {89-96},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@article{MTMT:2606987,
	title = {Electro-Thermal Simulation with the SISSI Package},
	url = {https://m2.mtmt.hu/api/publication/2606987},
	author = {Székely, Vladimir and Pahi, A and Poppe, András and Kerecsen Istvánné Rencz, Márta},
	doi = {10.1023/A:1008371625945},
	journal-iso = {ANALOG INTEGR CIRC S},
	journal = {ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING},
	volume = {21},
	unique-id = {2606987},
	issn = {0925-1030},
	abstract = {In this paper a brief overview of the electro-thermal simulation based on the method of simultaneous iteration is given, through the example of the SISSI (Simulator for Integrated Structures by Simultaneous Iteration) package. The modular approach used for the layout-based electro-thermal netlist generation is described. This approach allows an easy implementation of package model libraries. The capabilities of SISSI are introduced by simulation examples where in most cases the results are compared to measurement results.},
	year = {1999},
	eissn = {1573-1979},
	pages = {21-31},
	orcid-numbers = {Poppe, András/0000-0002-9381-6716; Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@inproceedings{MTMT:23892186,
	title = {Efficient thermal simulators: SUNRED and QuickTHERM},
	url = {https://m2.mtmt.hu/api/publication/23892186},
	author = {A, Páhi and V, Székely},
	booktitle = {Proceedings of the 1st IEEE International Workshop on Design, Test and Application (WDTA'98)},
	unique-id = {23892186},
	year = {1998},
	pages = {85-88}
}

@inproceedings{MTMT:23892185,
	title = {Characterization of submicron bulk and SOI MOS transistors for electro-thermal and logi-thermal simulation},
	url = {https://m2.mtmt.hu/api/publication/23892185},
	author = {Hajas, G and Lipták-Fegó, L},
	booktitle = {Proceedings of the 4th International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'98)},
	unique-id = {23892185},
	year = {1998},
	pages = {31-34}
}

@article{MTMT:23892232,
	title = {Compact Electrothermal Models for Power Electronics},
	url = {https://m2.mtmt.hu/api/publication/23892232},
	author = {Mawby, P},
	doi = {10.1049/ic:19980894},
	journal-iso = {IEE},
	journal = {INSTITUTION OF ELECTRICAL ENGINEERS. COLLOQUIUM},
	volume = {1998},
	unique-id = {23892232},
	issn = {0963-3308},
	year = {1998},
	pages = {3/1-3/4}
}

@article{MTMT:2606986,
	title = {Tracing the Thermal Behavior of ICs},
	url = {https://m2.mtmt.hu/api/publication/2606986},
	author = {Székely, Vladimir and Kerecsen Istvánné Rencz, Márta and Courtois, B},
	doi = {10.1109/54.679204},
	journal-iso = {IEEE DES TEST COMPUT},
	journal = {IEEE DESIGN & TEST OF COMPUTERS},
	volume = {15},
	unique-id = {2606986},
	issn = {0740-7475},
	abstract = {Today's increased power and packaging densities demand designer's attention to the effects of heat on ICs. Here, the authors review thermal and electrothermal simulation and measurement methods, thermal package characterization, and the concept and techniques of design for thermal testability.},
	year = {1998},
	eissn = {1558-1918},
	pages = {14-21},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@mastersthesis{MTMT:24129245,
	title = {IC csipek és mikrostruktúrák termikus vizsgálata},
	url = {https://m2.mtmt.hu/api/publication/24129245},
	author = {Csendes, Alpár},
	unique-id = {24129245},
	year = {1997}
}