TY  - CHAP
AU  - Cardoso, André Gil
AU  - Barros, Hugo
AU  - Hantos, Gusztáv
ED  - Poppe, András
TI  - Fabrication, Performance and Reliability of a Thermally Enhanced Wafer Level Fan Out Demonstrator with Integrated Heatsink
T2  - 2016 22nd International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'16)
PB  - Institute of Electrical and Electronics Engineers (IEEE)
CY  - New York, New York
SN  - 9781509054503
PY  - 2016
SP  - 336
EP  - 344
PG  - 9
DO  - 10.1109/THERMINIC.2016.7749079
UR  - https://m2.mtmt.hu/api/publication/3148012
ID  - 3148012
LA  - English
DB  - MTMT
ER  -