1.
Szekely, V ; Poppe, A ; Rencz, M ; Rosental, M ; Teszeri, T
THERMAN: a Thermal Simulation Tool for IC Chips, Microstructures and PW Boards
MICROELECTRONICS RELIABILITY 40 : 3 pp. 517-524. , 8 p. (2000)
DOI WoS Scopus Teljes dokumentum Handle Google scholar
Publication:2606997 Admin approved Core Citing Journal Article (Article ) Scientific
Citing papers: 44 | Independent citation: 20 | Self citation: 24 | Unknown citation: 0 | Number of citations in WoS: 32 | Number of citations in Scopus: 37 | WoS/Scopus assigned: 39 | Number of citations with DOI: 34
Article (Journal Article) | Scientific[2606997] [Admin approved]
All citations+mentions: 44, External citations: 20, Self citations: 24, Unhandled citations: 0
2023-12-03 18:52