TY  - JOUR
AU  - Székely, Vladimir
AU  - Poppe, András
AU  - Kerecsen Istvánné Rencz, Márta
AU  - Rosental, M
AU  - Teszeri, T
TI  - THERMAN: a Thermal Simulation Tool for IC Chips, Microstructures and PW Boards
JF  - MICROELECTRONICS RELIABILITY
J2  - MICROELECTRON RELIAB
VL  - 40
PY  - 2000
IS  - 3
SP  - 517
EP  - 524
PG  - 8
SN  - 0026-2714
DO  - 10.1016/S0026-2714(99)00249-8
UR  - https://m2.mtmt.hu/api/publication/2606997
ID  - 2606997
AB  - This article presents THERMAN: the renewed version of the μS-THERMANAL simulation program. The program was rewritten last year, in order to include algorithmic novelties such as time-constant analysis. The new code is fully transportable providing the same user interface on PCs and on Unix-based workstations. The graphical interface allows a fast problem definition and easy, many-sided evaluation of the results.
LA  - English
DB  - MTMT
ER  -