TY  - JOUR
AU  - Székely, Vladimir
TI  - Identification of RC Networks by Deconvolution: Chances and Limits
JF  - IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I - FUNDAMENTAL THEORY AND APPLICATIONS
J2  - IEEE T CIRC SYST FUND
VL  - 45
PY  - 1998
IS  - 3
SP  - 244
EP  - 258
PG  - 15
SN  - 1057-7122
DO  - 10.1109/81.662698
UR  - https://m2.mtmt.hu/api/publication/2671270
ID  - 2671270
AB  - This paper deals with the identification of RC networks from their time-or frequency-domain responses. A new method is presented based on a recent approach of the network description where all response functions are calculated by convolution integrals. The identification is carried out by deconvolution (NID method). This paper discusses the practical details of the method. Special attention is paid to the identification and modeling of distributed RC networks, like the problems of conductive heat-flow, A number of examples make easy to understand the operation and the capabilities of the NID method. Comparative considerations are given concerning the accuracy and expenses of the NID and the popular AWE (momentum-matching) methods.
LA  - English
DB  - MTMT
ER  - 

TY  - JOUR
AU  - Székely, Vladimir
AU  - Poppe, András
AU  - Páhi, A
AU  - Csendes, A
AU  - Hajas, G
AU  - Kerecsen Istvánné Rencz, Márta
TI  - Electro-thermal and logi-thermal simulation of VLSI designs
JF  - IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS
J2  - IEEE T VLSI SYST
VL  - 5
PY  - 1997
IS  - 3
SP  - 258
EP  - 269
PG  - 12
SN  - 1063-8210
DO  - 10.1109/92.609868
UR  - https://m2.mtmt.hu/api/publication/2606975
ID  - 2606975
AB  - Due to severe thermal problems of today's VLSI integrated circuits the need for reliable and quick thermal, electro-thermal and logi-thermal simulation tools is increasing, In this paper, we discuss the latest advances in the SISSI package (simulator for integrated structures by simultaneous iteration) which is a tool developed originally for analog VLSI design, The improvements include electro-thermal ac and transient simulation and the consideration of the thermal voltage of Si-Al contacts, Furthermore, we introduce a new module of SISSI, LOGITHERM, which is aimed at the self-consistent logic and thermal simulation of large digital VLSI designs, The features of our simulator package are highlighted by simulation examples that are compared in most cases with measurement results.
LA  - English
DB  - MTMT
ER  - 

TY  - JOUR
AU  - Székely, Vladimir
AU  - Poppe, András
AU  - Kerecsen Istvánné Rencz, Márta
AU  - Csendes, A
AU  - Páhi, A
TI  - Electro-thermal simulation: a realization by simultaneous iteration
JF  - MICROELECTRONICS JOURNAL
J2  - MICROELECTRON J
VL  - 28
PY  - 1997
IS  - 3
SP  - 247
EP  - 262
PG  - 16
SN  - 0026-2692
DO  - 10.1016/S0026-2692(96)00029-8
UR  - https://m2.mtmt.hu/api/publication/2606976
ID  - 2606976
AB  - After a comparison of major strategies of electro-thermal simulation (the relaxation method and the method of simultaneous iteration) a detailed description of the fundamentals and realization issues of the simultaneous iteration method is given. The paper introduces the SISSSI electro-thermal simulation package which is a recent realization of the latter method, fully integrated into the Cadence Opus design framework. The use of the package as an analogue circuit layout design verification tool is demonstrated through a detailed case study.
LA  - English
DB  - MTMT
ER  -