21.
Poppe, A ✉ ; Yan, Zhang ; Wilson, J ; Farkas, G ; Szabo, P ; Parry, J ; Rencz, M ; Szekely, V
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 32 : 2 pp. 484-492. , 9 p. (2009)
Publication:2648625 Admin approved Core Citing Suspect Journal Article (Article ) Scientific
Citing papers: 70 | Independent citation: 67 | Self citation: 3 | Unknown citation: 0 | Number of citations in WoS: 55 | Number of citations in Scopus: 50 | WoS/Scopus assigned: 62 | Number of citations with DOI: 65
Citation count: 72 | Independent citation: 69 | Self citation: 3 | Unknown citation: 0
Article (Journal Article) | Scientific[2648625] [Admin approved]
All citations+mentions: 70, External citations: 67, Self citations: 3, Unhandled citations: 0
Citation count: 72, External citations: 69, Self citations: 3, Unhandled citations: 0
22.
New York City, United States of America : IEEE (2009) pp. 322-328. , 2 p.
Publication:2646141 Published Core Chapter in Book (Conference paper ) Scientific
Citing papers: 2 | Independent citation: 2 | Self citation: 0 | Unknown citation: 0
Conference paper (Chapter in Book) | Scientific[2646141] [Approved]
All citations+mentions: 2, External citations: 2, Self citations: 0, Unhandled citations: 0
23.
MICROSYSTEM TECHNOLOGIES 15 : 8 pp. 1293-1301. , 9 p. (2009)
Publication:2644396 Admin approved Core Citing Journal Article (Article ) Scientific
Citing papers: 10 | Independent citation: 6 | Self citation: 4 | Unknown citation: 0 | Number of citations in WoS: 6 | Number of citations in Scopus: 10 | WoS/Scopus assigned: 10 | Number of citations with DOI: 7
Article (Journal Article) | Scientific[2644396] [Admin approved]
All citations+mentions: 10, External citations: 6, Self citations: 4, Unhandled citations: 0
24.
MICROSYSTEM TECHNOLOGIES 15 : 8 pp. 1279-1285. , 7 p. (2009)
Publication:2639875 Admin approved Core Citing Journal Article (Article ) Scientific
Citing papers: 6 | Independent citation: 3 | Self citation: 3 | Unknown citation: 0 | Number of citations in WoS: 5 | Number of citations in Scopus: 6 | WoS/Scopus assigned: 6 | Number of citations with DOI: 5
Article (Journal Article) | Scientific[2639875] [Admin approved]
All citations+mentions: 6, External citations: 3, Self citations: 3, Unhandled citations: 0
25.
Grenoble, France : EDA Publishing Association (2008) pp. 20-25. , 6 p.
Publication:2626547 Published Core Citing Chapter in Book (Conference paper ) Scientific
Citing papers: 6 | Independent citation: 6 | Self citation: 0 | Unknown citation: 0 | Number of citations in WoS: 6 | Number of citations in Scopus: 5 | WoS/Scopus assigned: 6 | Number of citations with DOI: 5
Conference paper (Chapter in Book) | Scientific[2626547] [Approved]
All citations+mentions: 6, External citations: 6, Self citations: 0, Unhandled citations: 0
26.
Grenoble, France : EDA Publishing Association (2008) pp. 132-136. , 5 p.
Publication:2626543 Published Core Citing Chapter in Book (Conference paper ) Scientific
Citing papers: 3 | Independent citation: 1 | Self citation: 2 | Unknown citation: 0 | Number of citations in WoS: 2 | Number of citations in Scopus: 3 | WoS/Scopus assigned: 3 | Number of citations with DOI: 2
Conference paper (Chapter in Book) | Scientific[2626543] [Approved]
All citations+mentions: 3, External citations: 1, Self citations: 2, Unhandled citations: 0
27.
In: Victor, M Bright; Tarik, Bourouina; Bernard, Courtois; Marc, Desmulliez; Jean, Michel Karam; Gou-Jen, Wang (eds.) Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'08)
Grenoble, France : EDA Publishing Association (2008) 392 p. pp. 350-354. , 5 p.
Publication:2622118 Published Core Citing Chapter in Book (Conference paper ) Scientific
Citing papers: 1 | Independent citation: 0 | Self citation: 1 | Unknown citation: 0 | Number of citations in WoS: 1 | Number of citations in Scopus: 1 | WoS/Scopus assigned: 1 | Number of citations with DOI: 1
Conference paper (Chapter in Book) | Scientific[2622118] [Approved]
All citations+mentions: 1, External citations: 0, Self citations: 1, Unhandled citations: 0
28.
In: Victor, M Bright; Tarik, Bourouina; Bernard, Courtois; Marc, Desmulliez; Jean, Michel Karam; Gou-Jen, Wang (eds.) Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'08)
Grenoble, France : EDA Publishing Association (2008) 392 p. pp. 345-349. , 5 p.
Publication:2622057 Admin approved Core Citing Chapter in Book (Conference paper ) Scientific
Citing papers: 1 | Independent citation: 1 | Self citation: 0 | Unknown citation: 0 | Number of citations in Scopus: 1 | WoS/Scopus assigned: 1 | Number of citations with DOI: 1
Conference paper (Chapter in Book) | Scientific[2622057] [Admin approved]
All citations+mentions: 1, External citations: 1, Self citations: 0, Unhandled citations: 0
29.
Grenoble, France : EDA Publishing Association, (2008) pp. 62-63. , 2 p.
Publication:2620888 Admin approved Core Chapter in Book (Conference paper )
Conference paper (Chapter in Book) | Scientific[2620888] [Admin approved]
30.
New York City, United States of America : Institute of Electrical and Electronics Engineers (2008) pp. 68-76. Paper: 4509369 , 9 p.
Publication:2613659 Published Core Citing Chapter in Book (Conference paper ) Scientific
Citing papers: 21 | Independent citation: 12 | Self citation: 9 | Unknown citation: 0 | Number of citations in WoS: 13 | Number of citations in Scopus: 18 | WoS/Scopus assigned: 19 | Number of citations with DOI: 15
Conference paper (Chapter in Book) | Scientific[2613659] [Approved]
All citations+mentions: 21, External citations: 12, Self citations: 9, Unhandled citations: 0
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