@article{MTMT:34799188,
	title = {Personal Air-Quality Monitoring with Sensor-Based Wireless Internet-of-Things Electronics Embedded in Protective Face Masks},
	url = {https://m2.mtmt.hu/api/publication/34799188},
	author = {Kuglics, Lajos and Géczy, Attila and Dusek, Karel and Busek, David and Illés, Balázs György},
	doi = {10.3390/s24082601},
	journal-iso = {SENSORS-BASEL},
	journal = {SENSORS},
	volume = {24},
	unique-id = {34799188},
	abstract = {In this paper, the design and research of a sensor-based personal air-quality monitoring device are presented, which is retrofitted into different personal protective face masks. Due to its small size and low power consumption, the device can be integrated into and applied in practical urban usage. We present our research and the development of the sensor node based on a BME680-type environmental sensor cluster with a wireless IoT (Internet of Things)-capable central unit and overall low power consumption. The integration of the sensor node was investigated with traditional medical masks and a professional FFP2-type mask. The filtering efficiency after embedding was validated with a head model and a particle counter. We found that the professional mask withstood the embedding without losing the protective filtering aspect. We compared the inner and outer sensor data and investigated the temperature, pressure, humidity, and AQI (Air Quality Index) relations with possible sensor data-fusion options. The novelty is increased with the dual-sensor layout (inward and outward). It was found that efficient respiration monitoring is achievable with the device. With the analysis of the recorded data, characteristic signals were identified in an urban environment, enabling urban altimetry and urban zone detection. The results promote smart city concepts and help in endeavors related to SDGs (Sustainable Development Goals) 3 and 11.},
	year = {2024},
	eissn = {1424-8220},
	pages = {2601},
	orcid-numbers = {Busek, David/0000-0002-8110-7496; Illés, Balázs György/0000-0002-8619-5472}
}

@article{MTMT:34772009,
	title = {Thermal diffusity in copper benzene-1,3,5-tricarboxylate–reduced graphite oxide mechanical composites},
	url = {https://m2.mtmt.hu/api/publication/34772009},
	author = {Gál, Márton and Samaniego Andrade, Samantha Kathiuska and Fehér, Anna Éva and Farkas, Attila and Madarász, János and Horváth, Lili and Gordon, Péter and Kovács, Róbert Sándor and Nagyné László, Krisztina},
	doi = {10.1007/s10973-024-13021-x},
	journal-iso = {J THERM ANAL CALORIM},
	journal = {JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY},
	unique-id = {34772009},
	issn = {1388-6150},
	abstract = {Metal organic frameworks (MOFs) and particularly copper benzene-1,3,5-tricarboxylate (HKUST-1) are excellent materials for gas storage (e.g., CH 4 , N 2 , H 2 adsorption) and gas separation. In this work, reduced graphene oxide (RGO)–HKUST-1 mechanical mixtures were studied in order to reveal the effect of RGO content on the pressure tolerance of the texture and heat conductivity. HKUST-1 was obtained by two different synthesis routes. Air-dried MOF and RGO were thoroughly mixed prior to the compression. Powder XRD and Raman spectroscopy were used to characterize the response of the crystal structure, while low-temperature nitrogen adsorption was used the follow the adsorption properties of the pellets. Finally, the "flash" heat pulse method was used to assess the thermal properties. The gas adsorption isotherms revealed that the adsorption capacity decreases when RGO is added. Based on Raman and XRD results, we found that the synthesis route has an effect on multiple scales. We experimentally confirmed that evaluation of the thermal diffusivity requires a model more complex than the simple Fourier equation, due to the inherent heterogeneous structure of the material. A good approximation of the Fourier coefficient of thermal diffusivity was obtained using the parameters of the Guyer–Krumhansl equation. The heat pulse experiments also revealed possible size-dependent behavior.},
	year = {2024},
	eissn = {1572-8943},
	orcid-numbers = {Fehér, Anna Éva/0000-0002-2366-6388; Farkas, Attila/0000-0002-8877-2587; Kovács, Róbert Sándor/0000-0001-5822-6035; Nagyné László, Krisztina/0000-0003-4499-3983}
}

@article{MTMT:34767534,
	title = {Climatically Accelerated Material Processes Determining the Long-Term Reliability of Light-Emitting Diodes},
	url = {https://m2.mtmt.hu/api/publication/34767534},
	author = {Harsányi, Gábor and Poppe, András and Hegedüs, János and Hantos, Gusztáv and Bojta, Péter and Kovacs, Robert},
	doi = {10.3390/ma17071643},
	journal-iso = {MATERIALS},
	journal = {MATERIALS},
	volume = {17},
	unique-id = {34767534},
	abstract = {LEDs (Light-Emitting Diodes) are widely applied not only in decorative illumination but also in everyday lighting in buildings, flats, public areas, and automotive fields. These application areas often mean harsh environments, for example, regarding the humidity content of the surrounding air: besides outdoor and automotive illumination, even the household use cases (kitchen, bathroom, cellar) may represent extreme temperature and humidity variations (often reaching relative humidity levels close to 100%) for these devices; thus, their reliability behaviour in such circumstances should be better understood. Thermally activated processes were studied in several previous publications, but less information is available regarding high-humidity environmental tests. Moisture and temperature ageing tests with appropriate environmental parameter settings were performed as accelerated lifetime tests to investigate not only the effect of temperature but also that of humidity on the ageing and reliability of LED packages containing RGB (red green blue) chips and phosphor-converted white (pcW) LEDs. The ageing was followed not only through monitoring optical/electrical/spectral parameters but also with material analysis. Moisture–material interaction models were proposed and set up. It was found that humidity-accelerated ageing processes are more severe than expected from previous assumptions. RGB and pcW LEDs showed strongly different behaviour.},
	year = {2024},
	eissn = {1996-1944},
	orcid-numbers = {Harsányi, Gábor/0000-0002-8514-8842; Poppe, András/0000-0002-9381-6716; Hegedüs, János/0000-0003-4792-6225; Hantos, Gusztáv/0000-0002-0401-2098}
}

@article{MTMT:34757552,
	title = {Improving efficiency of vapour phase soldering ovens with pressure and temperature-based process monitoring},
	url = {https://m2.mtmt.hu/api/publication/34757552},
	author = {Havellant, Gergő and Illés, Balázs György and Busek, David and Géczy, Attila},
	doi = {10.1016/j.csite.2024.104315},
	journal-iso = {CASE STUD THERM ENG},
	journal = {CASE STUDIES IN THERMAL ENGINEERING},
	volume = {57},
	unique-id = {34757552},
	issn = {2214-157X},
	year = {2024},
	eissn = {2214-157X}
}

@article{MTMT:34746761,
	title = {Sustainable printed circuit board substrates based on flame-retarded PLA/flax composites to reduce environmental load of electronics: Quality, reliability, degradation and application tests},
	url = {https://m2.mtmt.hu/api/publication/34746761},
	author = {Farkas, Csaba and Gál, László and Csiszár, András and Grennerat, Vincent and Jeannin, Pierre-Olivier and Xavier, Pascal and Rigler, Dániel and Krammer, Olivér and Plachy, Zbynek and Dusek, Karel and Kovács, Róbert Sándor and Fehér, Anna Éva and Géczy, Attila},
	doi = {10.1016/j.susmat.2024.e00902},
	journal-iso = {SUSTAINABLE MATERIALS TECHNOLOGIES},
	journal = {SUSTAINABLE MATERIALS AND TECHNOLOGIES},
	volume = {40},
	unique-id = {34746761},
	issn = {2214-9929},
	abstract = {The present paper introduces a novel, sustainable approach to produce an eco-friendly Printed Circuit Board (PCB) substrate; a substitute for traditional substrates, to significantly reduce e-waste. We present the prepreg technology, the road to actual circuit assembly with application studies, life cycle analysis (LCA), and sustainability analysis. The flame-retarded prepregs and resulting PCB assemblies were based on polylactic acid (PLA), the structure is reinforced with flax textiles. After copper lamination, subtractive PCB production was performed, and thermal and mechanical reliability was investigated in the case of both laminated and bare substrates. Steps of surface roughness, peel and thermal analysis followed. After a new set of assemblies, the post-assembly analysis was extended with further shear strength analysis on the soldered components and mass analysis regarding thermal processes. The evaluation showed that PLA/Flax substrates provide reliable structural performance up to 200 °C in the reflow soldering process; this allows limited but stabilized application possibilities with specific eco-friendly lead-free solders. A basic blinker circuit and a field programmable gate array (FPGA)–based design was produced and tested; the latter has the general complexity of a commercial circuit. A vol% and wt% analysis extended our discussion with a reduction of harmful components in waste in the range of 90%, which is a disruptive and significant result. Life cycle analysis (LCA) quantified the ecological impact of the assembly, highlighting a significant ease on environmental load (∼10%) for the total assembly. Finally, a qualitative degradation study was introduced to the prepared samples to investigate short-term stability with mechanical-, colour-, mass- and scanning electron microscopy (structure) analysis. Early results show that the boards can withstand the harsh environment of a composting bin for a few days, but in the time of a few weeks, degradation starts, pointing to eventual decomposition. The work directly connects with multiple sustainability development goals. © 2024 The Authors},
	keywords = {life cycle; scanning electron microscopy; recycling; Substrates; Surface roughness; Thermoanalysis; environmental protection; Electric network analysis; Sustainable development; Soldering; Electronic equipment; Field programmable gate arrays (FPGA); Waste reduction; Lead-free solders; Environmental loads; Electronic waste; PCB; Printed circuit boards; Eco-friendly; Timing circuits; E-wastes; sustainable electronics; Flame-retarded; Biodegradable PCB; E-waste reduction; Environmentally-friendly electronics; Printed circuit board substrate; Biodegradable printed circuit board; E-waste reduction; Environmentally-friendly electronic; Printed circuit board substrate},
	year = {2024},
	eissn = {2214-9937},
	orcid-numbers = {Kovács, Róbert Sándor/0000-0001-5822-6035; Fehér, Anna Éva/0000-0002-2366-6388}
}

@article{MTMT:34745108,
	title = {Classification of colorectal primer carcinoma from normal colon with mid‐infrared spectra},
	url = {https://m2.mtmt.hu/api/publication/34745108},
	author = {Borkovits, B. and Kontsek, Endre and Pesti, Adrián István and Gordon, Péter and Gergely, Szilveszter and Csabai, I. and Kiss, András and Pollner, Péter},
	doi = {10.1002/cem.3542},
	journal-iso = {J CHEMOMETR},
	journal = {JOURNAL OF CHEMOMETRICS},
	unique-id = {34745108},
	issn = {0886-9383},
	abstract = {In this project, we used formalin‐fixed paraffin‐embedded (FFPE) tissue samples to measure thousands of spectra per tissue core with Fourier transform mid‐infrared spectroscopy using an FT‐IR imaging system. These cores varied between normal colon (NC) and colorectal primer carcinoma (CRC) tissues. We created a database to manage all the multivariate data obtained from the measurements. Then, we applied classifier algorithms to identify the tissue based on its yielded spectra. For classification, we used the random forest, a support vector machine, XGBoost, and linear discriminant analysis methods, as well as three deep neural networks. We compared two data manipulation techniques using these models and then applied filtering. In the end, we compared model performances via the sum of ranking differences (SRD).},
	year = {2024},
	eissn = {1099-128X},
	orcid-numbers = {Borkovits, B./0009-0004-0696-7586; Kontsek, Endre/0000-0002-8098-1392; Pesti, Adrián István/0000-0001-6706-6221; Gergely, Szilveszter/0000-0003-1945-526X; Csabai, I./0000-0001-9232-9898; Kiss, András/0000-0002-7453-3163; Pollner, Péter/0000-0003-0464-4893}
}

@article{MTMT:34726787,
	title = {An Efficient and Dependable UAV-Assisted Code Dissemination in 5G-Enabled Industrial IoT},
	url = {https://m2.mtmt.hu/api/publication/34726787},
	author = {Sharma, Ravi and Villányi, Balázs János},
	doi = {10.1109/OJCOMS.2024.3368275},
	journal-iso = {IEEE OPEN J COMMUN SOC},
	journal = {IEEE OPEN JOURNAL OF THE COMMUNICATIONS SOCIETY},
	volume = {5},
	unique-id = {34726787},
	abstract = {The Industrial Internet of Things (IIoT) has infiltrated our culture and is gaining traction in a variety of industrial applications. All of this is made possible by the use of 5G-connected massive Intelligent Sensing Devices (ISDs) and software-defined technology. It is sometimes desirable, and even required, to upgrade these ISDs without replacing hardware to make them smarter by adding new features and/or removing bugs through code dissemination. Using moving vehicles of the 5G-enabled Internet of Vehicles (IoV) infrastructure is one possible and efficient way to disseminate code. Specifically, safe code dissemination through a large number of vehicles in a 5G network has emerged as a critical issue. The motivation stems from the limitations of existing methods, often centralized and vulnerable to compromise, particularly in semi-connected networks. Therefore, this paper proposes an efficient and reliable Unmanned Aerial Vehicle (UAV)-assisted digital signature-based safe code dissemination framework for a 5G-enabled IIoT system. Our decentralized approach, which uses digital signatures and a Subjective Logic model, not only ensures code integrity but also identifies credible code mules, avoiding the pitfalls of traditional trust evaluation schemes. Furthermore, for UAV trajectory optimization, we redesign the trajectory with virtual waypoints to shorten the trajectory path for upgrading ISDs that were not upgraded due to the long-time trailing phenomenon. Our approach is useful in scenarios such as smart cities, where ISDs lack communication facilities. Through extensive experiments, our framework demonstrates superior efficiency and reliability compared to state-of-the-art methods. Authors},
	keywords = {behavioral science; Reliability; code; network coding; Unmanned aerial vehicles (UAV); Behavioral research; Codes (symbols); Trajectories; Behavioral Sciences; AUTHENTICATION; CODES; aerodynamics; Antennas; Mobile communications; Internet of Things; 5G mobile communication; 5G mobile communication; Malware; 5G mobile communication systems; trajectory optimization; trajectory optimization; Industrial Internet of Things; Industrial Internet of Things; 5G network; trust evaluation; trust evaluation; Code dissemination; Code dissemination; autonomous aerial vehicles; Industrial internet of thing; Malwares},
	year = {2024},
	eissn = {2644-125X},
	pages = {1525-1536},
	orcid-numbers = {Villányi, Balázs János/0000-0003-2873-9934}
}

@inproceedings{MTMT:34656961,
	title = {Development and Characterization of Sn99Ag0.3Cu0.7-(ZrO2/CuO/TiO2) Nano-Composite Solder Alloys},
	url = {https://m2.mtmt.hu/api/publication/34656961},
	author = {Illés, Balázs György and Choi, Halim and Skwarek, Agata},
	booktitle = {2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific)},
	doi = {10.23919/PanPacific60013.2024.10436525},
	unique-id = {34656961},
	abstract = {The 'lead-free' change in the soldering technology caused the widespread application of the SnAgCu (SAC) solder alloys. The so-called low Ag content ones, like Sn99Ag0.3Cu0.7 (SAC0307) and Sn98.5Ag1Cu0.5 (SAC105), are more and more popular recently due to their good price and thermo-mechanical properties. The most novel solution to further improve the solder alloys' properties is adding nano-sized ceramic reinforcement particles into the solder alloys. This procedure results in, nano-composite'' solder joints. A wide range of ceramic nano-particles (NPs) was already tested, like Fe2O3, TiO2, Si3Ni4, ZrO2, Al2O3, SiC, La2O3, etc. The reinforcement particles improve the solder joints' mechanical properties (shear force, yield strength, microhardness, etc.), with some Kelvin of increase in the liquidus-Temperature of the alloy. It is generally accepted that mechanical improvement is caused by dispersion-strengthening mechanisms. The ceramic nano-particles are not soluble in the Sn, so they incorporate at the intermetallic (Cu6Sn5, CU3Sn, and Ag3Sn) grains and at the Sn grain boundaries, where they enhance heterogeneous nucleation. This effect suppresses the grain growth (all phases) and decreases dislocation motions. In the present study, the effect of three oxide ceramics (TiO2, ZrO2, and CuO) as reinforcements in 0.25wt% weight fraction was investigated on the quality and reliability of the composite SAC0307 solder alloy. The primary particle size of NPs was between 20-100nm. The NPs were mixed into the solder paste. Standard spread tests of the different alloys were done on FR4 laminates covered by Cu foil and imm-Ag surface finishing over on it. Solder joints were prepared from the alloys and 0603 chip resistors by convectional surface mounting technology on FR4-based printed circuit boards with imm-Ag surface finish. The shear strength of the chip resistors was measured. The solder joints were loaded with 4000 hours 85°C/85RH% climatic test to investigate their corrosion resistance. The results showed that NPs slightly decreased the wettability of nano-composite solder alloys. The shear strength of the composite joints generally increased, which proved that the second phase dispersion strengthening mechanism worked. However, the NPs have different effects on the corrosion resistance of the composite alloys. A former study proved that TiO2 could increase corrosion resistance [13]. Now it was observed that ZrO2 did not change it, and CuO decreased it considerably. In correlation with corrosion resistance, the different composite alloys produced different amounts of Sn whiskers during the corrosive climate test. © 2024 SMTA.},
	keywords = {Binary alloys; microstructure; NANOPARTICLES; grain growth; particle size; grain boundaries; NUCLEATION; silicon carbide; Aluminum Oxide; Nano-particles; ALUMINA; Copper alloys; Hematite; REINFORCEMENT; Ceramic materials; Soldering; Zirconia; Soldered joints; Finishing; Ternary alloys; Tin alloys; Ceramic nanoparticles; Lead-free solders; Reflow soldering; Solder alloys; titanium dioxide; Printed circuit boards; nano composite; Solder joints; Reinforcement particles; Surface mount technology; Nanoparti-cles; Composite solders; composite solder alloy; Reflow--soldering; SAC0307; Sac0307},
	year = {2024},
	pages = {91-98}
}

@article{MTMT:34556952,
	title = {Self-supervised data lakes discovery through unsupervised metadata-driven weighted similarity},
	url = {https://m2.mtmt.hu/api/publication/34556952},
	author = {I Made, Putrama and Martinek, Péter},
	doi = {10.1016/j.ins.2024.120242},
	journal-iso = {INFORM SCIENCES},
	journal = {INFORMATION SCIENCES},
	volume = {662},
	unique-id = {34556952},
	issn = {0020-0255},
	year = {2024},
	eissn = {1872-6291}
}

@article{MTMT:34556904,
	title = {Hydrodynamic function and spring constant calibration of FluidFM micropipette cantilevers},
	url = {https://m2.mtmt.hu/api/publication/34556904},
	author = {Bonyár, Attila and Nagy, Ágoston Gábor and Gunstheimer, Hans and Fläschner, Gotthold and Horváth, Róbert},
	doi = {10.1038/s41378-023-00629-6},
	journal-iso = {MICROSYST NANOENG},
	journal = {MICROSYSTEMS & NANOENGINEERING},
	volume = {10},
	unique-id = {34556904},
	issn = {2055-7434},
	year = {2024},
	eissn = {2055-7434},
	orcid-numbers = {Bonyár, Attila/0000-0002-6976-7846; Horváth, Róbert/0000-0001-8617-2302}
}