TY - JOUR AU - Szalai, Albin AU - Székely, Vladimir TI - Distributed RC one-ports: Characteristic functions and their relations JF - PERIODICA POLYTECHNICA-ELECTRICAL ENGINEERING AND COMPUTER SCIENCE J2 - PERIOD POLYTECH ELECTR ENG COMP SCI VL - 60 PY - 2016 IS - 3 SP - 171 EP - 177 PG - 7 SN - 2064-5260 DO - 10.3311/PPee.7160 UR - https://m2.mtmt.hu/api/publication/3128441 ID - 3128441 LA - English DB - MTMT ER - TY - JOUR AU - Székely, Vladimir AU - Szalai, Albin TI - Transformation between Linear Network Features in Convolution Approach JF - INTERNATIONAL JOURNAL OF CIRCUIT THEORY AND APPLICATIONS J2 - INT J CIRC THEOR APP VL - 43 PY - 2015 IS - 1 SP - 94 EP - 110 PG - 17 SN - 0098-9886 DO - 10.1002/cta.1928 UR - https://m2.mtmt.hu/api/publication/2694153 ID - 2694153 N1 - Füzet WoS alapján javítva. LA - English DB - MTMT ER - TY - JOUR AU - Szabó, Péter Gábor AU - Székely, Vladimir TI - Crosstalk Compensation in Thermal Transient Measurements JF - INFOCOMMUNICATIONS JOURNAL J2 - INFOCOMM J VL - 4 PY - 2012 IS - 3 SP - 9 EP - 14 PG - 6 SN - 2061-2079 UR - https://m2.mtmt.hu/api/publication/2689826 ID - 2689826 LA - English DB - MTMT ER - TY - CHAP AU - Szalai, Albin AU - Czirkos, Zoltán AU - Székely, Vladimir ED - International, Workshop on Thermal Investigations of ICs and Microstructures TI - A quasi-SPICE electro-thermal simulator T2 - 18th THERMINIC International Workshop on Thermal Investigations of ICs and Systems PB - EDA Publishing Association CY - Grenoble SN - 9781467318822 PY - 2012 SP - 190 EP - 195 PG - 6 UR - https://m2.mtmt.hu/api/publication/2688135 ID - 2688135 N1 - Befoglaló mű WoS és MTMT megnevezése nem azonos. Az MTMT-ben 1995 óta standardizált konferenciamegnevezéssel lett a befoglaló mű rögzítve. AB - Integrated circuits exhibit coupled electro-thermal phenomena. The circuit elements dissipate heat, which propagates in the chip, rising the temperature of all circuit elements. Since the operation of the latter is temperature dependent, their dissipation will also change. This change results in the variation of the element voltages and currents, causing further changes in the dissipation, etc. Therefore we are facing a pair of couplings: an electronic → thermal one and a thermal → electronic one, meaning that all integrated circuits constitute essentially a mutually coupled electronic and thermal system. In this paper a detailed discussion of the electro- thermal phenomena is presented regarding the practical implementation. The final implementation is a SPICE compatible electro-thermal solver (qSPICE), which implements some of the major industry standard models with extended coupled thermal capabilities. The accuracy of qSPICE is demonstrated on multiple examples. LA - English DB - MTMT ER - TY - JOUR AU - Székely, Vladimir AU - Szalai, Albin TI - Measurement of the Time-Constant Spectrum: Systematic Errors, Correction JF - MICROELECTRONICS JOURNAL J2 - MICROELECTRON J VL - 43 PY - 2012 IS - 11 SP - 904 EP - 907 PG - 4 SN - 0026-2692 DO - 10.1016/j.mejo.2012.05.011 UR - https://m2.mtmt.hu/api/publication/2686137 ID - 2686137 LA - English DB - MTMT ER - TY - CHAP AU - Ender, Ferenc AU - Székely, Vladimir ED - IEEE, null TI - Thermal Transfer Impedance Variations by Forced Convective Heat Transfer in Microchannels T2 - 2012 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP) PB - IEEE Press CY - New York, New York SN - 9782355000201 PY - 2012 SP - 119 EP - 124 PG - 6 UR - https://m2.mtmt.hu/api/publication/2685729 ID - 2685729 LA - English DB - MTMT ER - TY - JOUR AU - Szalai, Albin AU - Székely, Vladimir TI - Possible acception criteria for structure functions JF - MICROELECTRONICS JOURNAL J2 - MICROELECTRON J VL - 43 PY - 2012 IS - 2 SP - 164 EP - 168 PG - 5 SN - 0026-2692 DO - 10.1016/j.mejo.2011.08.010 UR - https://m2.mtmt.hu/api/publication/2679937 ID - 2679937 AB - This paper deals with the verification of thermal transient evaluation implementations. This subject is relevant because e.g. the upcoming standard will describe the thermal transient measurement as a standard method to estimate the junction-to-case thermal resistance [1] and [2], thus anybody can create their own implementation of the evaluation method. We have to have a method to verify these implementations. For this reason we examined the result of the NID (Network Identification by Deconvolution) method from different aspects. For these examinations we defined a multilayer structure as a reference structure and we analytically expressed the unit-step response and the cumulative structure function of this structure. Using the unit-step response as an input data set for the implementation in question we got an approximation of the structure function. Analysing this and the reference RC network we could define a practical maximum tolerance for the deviation between the analytical and the calculated functions. LA - English DB - MTMT ER - TY - JOUR AU - Székely, Vladimir AU - Szabó, Péter Gábor TI - Blind tracing of mechanical movement in electrostatic MEMS structures JF - ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING J2 - ANALOG INTEGR CIRC S VL - 71 PY - 2012 IS - 1 SP - 11 EP - 21 PG - 11 SN - 0925-1030 DO - 10.1007/s10470-010-9551-z UR - https://m2.mtmt.hu/api/publication/2659700 ID - 2659700 N1 - Published online: 11 November 2010. LA - English DB - MTMT ER - TY - CHAP AU - Vass-Várnai, András AU - Székely, Vladimir AU - Sárkány, Zoltán AU - Kerecsen Istvánné Rencz, Márta ED - Wesling, P. TI - New level of accuracy in TIM measurements T2 - 2011 27TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM) PB - IEEE CY - Piscataway (NJ) SN - 9781612847405 T3 - PROCEEDINGS, IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENTSYMPOSIUM, ISSN 1065-2221 PY - 2011 SP - 317 EP - 324 PG - 8 DO - 10.1109/STHERM.2011.5767218 UR - https://m2.mtmt.hu/api/publication/2675952 ID - 2675952 AB - The thermal management of semiconductor devices and systems has become a widely discussed topic over the past decades due to the ever increasing integration and the resulting power densities inside the packages. The increasing junction temperature is a great threat for the operation and the long-term reliability of the packaged device. One of the most important barriers in the heat conduction path is the thermal interface material. Their thermal performance significantly influences the overall thermal resistance of a system from the junction to the ambient. In this paper two approaches are described for the accurate thermal conductivity measurement of these materials; both techniques were developed in the framework of the European Nanopack project. One of them is a highly accurate, scientific method which benefits from the improvements of the semiconductor industry: the TIM is measured between two bare sensor chip surfaces. The other method is based on thermal transient testing and allows the measurement of a given grease or paste in its real environment. Both of them are capable of the measurement of highly conductive, nanoparticle based TIM materials. In this paper these two methods are explained in more details and measured results are compared with each-other. The effect of the measurement arrangement on the measured thermal resistance values is also discussed. LA - English DB - MTMT ER - TY - CHAP AU - Székely, Vladimir AU - Szalai, Albin ED - Bernard, Courtois ED - Marta, Rencz TI - Measurement of the time-constant spectrum: systematic errors, correction T2 - Proceedings of the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'11) PB - EDA Publishing Association CY - Grenoble SN - 9781457707780 PY - 2011 SP - 45 EP - 48 PG - 4 UR - https://m2.mtmt.hu/api/publication/2668744 ID - 2668744 LA - English DB - MTMT ER -