@article{MTMT:3128441,
	title = {Distributed RC one-ports: Characteristic functions and their relations},
	url = {https://m2.mtmt.hu/api/publication/3128441},
	author = {Szalai, Albin and Székely, Vladimir},
	doi = {10.3311/PPee.7160},
	journal-iso = {PERIOD POLYTECH ELECTR ENG COMP SCI},
	journal = {PERIODICA POLYTECHNICA-ELECTRICAL ENGINEERING AND COMPUTER SCIENCE},
	volume = {60},
	unique-id = {3128441},
	issn = {2064-5260},
	year = {2016},
	eissn = {2064-5279},
	pages = {171-177}
}

@article{MTMT:2694153,
	title = {Transformation between Linear Network Features in Convolution Approach},
	url = {https://m2.mtmt.hu/api/publication/2694153},
	author = {Székely, Vladimir and Szalai, Albin},
	doi = {10.1002/cta.1928},
	journal-iso = {INT J CIRC THEOR APP},
	journal = {INTERNATIONAL JOURNAL OF CIRCUIT THEORY AND APPLICATIONS},
	volume = {43},
	unique-id = {2694153},
	issn = {0098-9886},
	year = {2015},
	eissn = {1097-007X},
	pages = {94-110}
}

@article{MTMT:2689826,
	title = {Crosstalk Compensation in Thermal Transient Measurements},
	url = {https://m2.mtmt.hu/api/publication/2689826},
	author = {Szabó, Péter Gábor and Székely, Vladimir},
	journal-iso = {INFOCOMM J},
	journal = {INFOCOMMUNICATIONS JOURNAL},
	volume = {4},
	unique-id = {2689826},
	issn = {2061-2079},
	year = {2012},
	eissn = {2061-2125},
	pages = {9-14},
	orcid-numbers = {Szabó, Péter Gábor/0000-0001-7601-743X}
}

@inproceedings{MTMT:2688135,
	title = {A quasi-SPICE electro-thermal simulator},
	url = {https://m2.mtmt.hu/api/publication/2688135},
	author = {Szalai, Albin and Czirkos, Zoltán and Székely, Vladimir},
	booktitle = {18th THERMINIC International Workshop on Thermal Investigations of ICs and Systems},
	unique-id = {2688135},
	abstract = {Integrated circuits exhibit coupled
		electro-thermal phenomena. The circuit elements dissipate heat, 
		which propagates in the chip, rising the temperature of all 
		circuit elements. Since the operation of the latter is 
		temperature dependent, their dissipation will also change. This 
		change results in the variation of the element voltages and 
		currents, causing further changes in the dissipation, etc. 
		Therefore we are facing a pair of couplings: an electronic → 
		thermal one and a thermal → electronic one, meaning that all 
		integrated circuits constitute essentially a mutually
		coupled electronic and thermal system. In this paper a detailed 
		discussion of the electro- thermal phenomena is presented 
		regarding the practical implementation. The final implementation 
		is a SPICE compatible electro-thermal solver (qSPICE), which 
		implements some of the major industry standard models with 
		extended coupled thermal capabilities. The accuracy of qSPICE is 
		demonstrated on multiple examples.},
	year = {2012},
	pages = {190-195},
	orcid-numbers = {Czirkos, Zoltán/0000-0001-9269-0472}
}

@article{MTMT:2686137,
	title = {Measurement of the Time-Constant Spectrum: Systematic Errors, Correction},
	url = {https://m2.mtmt.hu/api/publication/2686137},
	author = {Székely, Vladimir and Szalai, Albin},
	doi = {10.1016/j.mejo.2012.05.011},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {43},
	unique-id = {2686137},
	issn = {0026-2692},
	year = {2012},
	eissn = {0959-8324},
	pages = {904-907}
}

@inproceedings{MTMT:2685729,
	title = {Thermal Transfer Impedance Variations by Forced Convective Heat Transfer in Microchannels},
	url = {https://m2.mtmt.hu/api/publication/2685729},
	author = {Ender, Ferenc and Székely, Vladimir},
	booktitle = {2012 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP)},
	unique-id = {2685729},
	year = {2012},
	pages = {119-124},
	orcid-numbers = {Ender, Ferenc/0000-0003-3800-5707}
}

@article{MTMT:2679937,
	title = {Possible acception criteria for structure functions},
	url = {https://m2.mtmt.hu/api/publication/2679937},
	author = {Szalai, Albin and Székely, Vladimir},
	doi = {10.1016/j.mejo.2011.08.010},
	journal-iso = {MICROELECTRON J},
	journal = {MICROELECTRONICS JOURNAL},
	volume = {43},
	unique-id = {2679937},
	issn = {0026-2692},
	abstract = {This paper deals with the verification of thermal transient evaluation implementations. This subject is relevant because e.g. the upcoming standard will describe the thermal transient measurement as a standard method to estimate the junction-to-case thermal resistance [1] and [2], thus anybody can create their own implementation of the evaluation method. We have to have a method to verify these implementations. For this reason we examined the result of the NID (Network Identification by Deconvolution) method from different aspects. For these examinations we defined a multilayer structure as a reference structure and we analytically expressed the unit-step response and the cumulative structure function of this structure. Using the unit-step response as an input data set for the implementation in question we got an approximation of the structure function. Analysing this and the reference RC network we could define a practical maximum tolerance for the deviation between the analytical and the calculated functions.},
	year = {2012},
	eissn = {0959-8324},
	pages = {164-168}
}

@article{MTMT:2659700,
	title = {Blind tracing of mechanical movement in electrostatic MEMS structures},
	url = {https://m2.mtmt.hu/api/publication/2659700},
	author = {Székely, Vladimir and Szabó, Péter Gábor},
	doi = {10.1007/s10470-010-9551-z},
	journal-iso = {ANALOG INTEGR CIRC S},
	journal = {ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING},
	volume = {71},
	unique-id = {2659700},
	issn = {0925-1030},
	year = {2012},
	eissn = {1573-1979},
	pages = {11-21},
	orcid-numbers = {Szabó, Péter Gábor/0000-0001-7601-743X}
}

@inproceedings{MTMT:2675952,
	title = {New level of accuracy in TIM measurements},
	url = {https://m2.mtmt.hu/api/publication/2675952},
	author = {Vass-Várnai, András and Székely, Vladimir and Sárkány, Zoltán and Kerecsen Istvánné Rencz, Márta},
	booktitle = {2011 27TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM)},
	doi = {10.1109/STHERM.2011.5767218},
	unique-id = {2675952},
	abstract = {The thermal management of semiconductor devices and systems has 
		become a widely discussed topic over the past decades due to the 
		ever increasing integration and the resulting power densities 
		inside the packages. The increasing junction temperature is a 
		great threat for the operation and the long-term reliability of 
		the packaged device. One of the most important barriers in the 
		heat conduction path is the thermal interface material. Their 
		thermal performance significantly influences the overall thermal 
		resistance of a system from the junction to the ambient. In this 
		paper two approaches are described for the accurate thermal 
		conductivity measurement of these materials; both techniques 
		were developed in the framework of the European Nanopack 
		project. One of them is a highly accurate, scientific method 
		which benefits from the improvements of the semiconductor 
		industry: the TIM is measured between two bare sensor chip 
		surfaces. The other method is based on thermal transient testing 
		and allows the measurement of a given grease or paste in its 
		real environment. Both of them are capable of the measurement of 
		highly conductive, nanoparticle based TIM materials. In this 
		paper these two methods are explained in more details and 
		measured results are compared with each-other. The effect of the 
		measurement arrangement on the measured thermal resistance 
		values is also discussed.},
	keywords = {thermal resistance; semiconductor device reliability; Semiconductor devices; Transient analysis; Thermal transient testing; thermal management; thermal interface material; semiconductor industry; packaged device reliability; junction temperature; heat conduction path; TIM measurements; thermal management (packaging); Thermal conductivity measurement; semiconductor device packaging},
	year = {2011},
	pages = {317-324},
	orcid-numbers = {Kerecsen Istvánné Rencz, Márta/0000-0003-4183-3853}
}

@inproceedings{MTMT:2668744,
	title = {Measurement of the time-constant spectrum: systematic errors, correction},
	url = {https://m2.mtmt.hu/api/publication/2668744},
	author = {Székely, Vladimir and Szalai, Albin},
	booktitle = {Proceedings of the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'11)},
	unique-id = {2668744},
	year = {2011},
	pages = {45-48}
}