TY - CHAP AU - Ress, Sándor László AU - Sárkány, Zoltán AU - Kerecsen Istvánné Rencz, Márta AU - Farkas, Gábor ED - Poppe, András TI - Thermal Transient Tests with Programmed Powering on Wide Bandgap Power Devices of Non-Monotonous and Time-Variant Characteristics T2 - 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) PB - IEEE CY - Budapest SN - 9798350318623 PY - 2023 PG - 8 DO - 10.1109/THERMINIC60375.2023.10325869 UR - https://m2.mtmt.hu/api/publication/34448273 ID - 34448273 N1 - Budapest University of Technology and Economics, Hungary Siemens Digital Industry Software, Budapest, Hungary Conference code: 194796 Export Date: 22 December 2023 Correspondence Address: Ress, S.; Budapest University of Technology and EconomicsHungary; email: sandor.ress@vik.bme.hu AB - Thermal transient testing of semiconductor devices needs a well-defined power level for heating and proper data acquisition for recording the change of a thermally sensitive device parameter. While the latter is fully solved by up-to-date thermal testers, power level setting is typically limited to forcing varying current levels on two pin devices, such as diodes. Other proposed methods need trials for setting the power and have poor stability.The paper presents a methodology for applying power in various test arrangements, on devices with three pins such as MOSFETs, IGBTs, BJTs and HEMTs. A simple analog circuitry is proposed which ensures thermally and electrically stable powering and an exact operating voltage and current.Several simulation and measurement experiments prove that a novel solution based on fast drain-source voltage change at constant current ensures optimal powering in reliability tests and short electric distortion in transient tests. © 2023 IEEE. LA - English DB - MTMT ER - TY - CHAP AU - Ress, Sándor László AU - Sarkany, Zoltan AU - Farkas, Gabor AU - Kerecsen Istvánné Rencz, Márta TI - Accelerating the Thermal Transient Testing by a Novel Temperature Sensitive Parameter Calibration Method based on I-V Characteristic Measurement T2 - Proceedings of the 28th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'22) PB - IEEE CY - Dublin SN - 9781665492294 PY - 2022 SP - 1 EP - 4 PG - 4 DO - 10.1109/THERMINIC57263.2022.9950658 UR - https://m2.mtmt.hu/api/publication/33698131 ID - 33698131 N1 - WoS:hiba:000899338800036 2023-12-31 16:52 befoglaló egyiknél nincsenek szerzők AB - Thermal characterisation of each large power module or assembly is inevitable in the industry. Thermal transient testing provides not only generic thermal parameters but also the root causes of potential failures. The major bottleneck in this process is the long time needed for the calibration of a thermally sensitive parameter of the semiconductor devices, opposed to the actual measurement time which is a few tens of seconds. The article presents a methodology which replaces the lengthy measurement of a parameter at many temperatures by a complete current-voltage sweep fulfilled below a second and some calculations based on semiconductor physics. The method also may predict the high temperature behaviour of wide band gap semiconductor components, needed for lifetime estimation. LA - English DB - MTMT ER - TY - CHAP AU - Poppe, András AU - Kerecsen Istvánné Rencz, Márta ED - Kerecsen Istvánné Rencz, Márta ED - Farkas, Gábor ED - Poppe, András TI - On the Accuracy and Repeatability of Thermal Transient Measurements T2 - Theory and Practice of Thermal Transient Testing of Electronic Components PB - Springer Netherlands CY - Cham SN - 9783030861742 PY - 2022 SP - 353 EP - 369 PG - 17 DO - 10.1007/978-3-030-86174-2_8 UR - https://m2.mtmt.hu/api/publication/33589494 ID - 33589494 N1 - Export Date: 1 June 2023 Correspondence Address: Poppe, A.; Siemens Digital Industry Software STSHungary; email: rencz.marta@vik.bme.hu LA - English DB - MTMT ER - TY - CHAP AU - Kerecsen Istvánné Rencz, Márta AU - Farkas, Gábor AU - Sárkány, Zoltán AU - Vass-Várnai, András ED - Kerecsen Istvánné Rencz, Márta ED - Farkas, Gábor ED - Poppe, András TI - The Use of Thermal Transient Testing T2 - Theory and Practice of Thermal Transient Testing of Electronic Components PB - Springer Netherlands CY - Cham SN - 9783030861742 PY - 2022 SP - 319 EP - 352 PG - 34 DO - 10.1007/978-3-030-86174-2_7 UR - https://m2.mtmt.hu/api/publication/33589490 ID - 33589490 N1 - Siemens Digital Industry Software STS, Budapest, Hungary Budapest University of Technology and Economics, Budapest, Hungary Siemens Digital Industry Software, Plano, TX, United States Export Date: 1 June 2023 Correspondence Address: Rencz, M.; Siemens Digital Industry Software STSHungary; email: rencz.marta@vik.bme.hu LA - English DB - MTMT ER - TY - CHAP AU - Farkas, Gábor AU - Poppe, András AU - Kerecsen Istvánné Rencz, Márta ED - Kerecsen Istvánné Rencz, Márta ED - Farkas, Gábor ED - Poppe, András TI - Theoretical Background of Thermal Transient Measurements T2 - Theory and Practice of Thermal Transient Testing of Electronic Components PB - Springer Netherlands CY - Cham SN - 9783030861742 PY - 2022 SP - 7 EP - 96 PG - 90 DO - 10.1007/978-3-030-86174-2_2 UR - https://m2.mtmt.hu/api/publication/33589207 ID - 33589207 N1 - Siemens Digital Industry Software STS, Budapest, Hungary Budapest University of Technology and Economics, Budapest, Hungary Export Date: 1 June 2023 Correspondence Address: Poppe, A.; Siemens Digital Industry Software STSHungary; email: Poppe.Andras@vik.bme.hu LA - English DB - MTMT ER - TY - CHAP AU - Kerecsen Istvánné Rencz, Márta AU - Farkas, Gábor ED - Kerecsen Istvánné Rencz, Márta ED - Farkas, Gábor ED - Poppe, András TI - Why Was Written and How to Read This Book T2 - Theory and Practice of Thermal Transient Testing of Electronic Components PB - Springer Netherlands CY - Cham SN - 9783030861742 PY - 2022 SP - 1 EP - 5 PG - 5 DO - 10.1007/978-3-030-86174-2_1 UR - https://m2.mtmt.hu/api/publication/33589178 ID - 33589178 N1 - Export Date: 1 June 2023 Correspondence Address: Rencz, M.; Siemens Digital Industry Software STSHungary; email: rencz.marta@vik.bme.hu LA - English DB - MTMT ER - TY - BOOK ED - Kerecsen Istvánné Rencz, Márta ED - Farkas, Gábor ED - Poppe, András TI - Theory and Practice of Thermal Transient Testing of Electronic Components PB - Springer Netherlands CY - Cham PY - 2022 SN - 9783030861742 DO - 10.1007/978-3-030-86174-2 UR - https://m2.mtmt.hu/api/publication/33589137 ID - 33589137 N1 - Siemens Digital Industry Software STS, Budapest, Hungary Budapest University of Technology and Economics, Budapest, Hungary Export Date: 1 June 2023 Correspondence Address: Rencz, M.; Siemens Digital Industry Software STSHungary LA - English DB - MTMT ER - TY - CHAP AU - Poppe, András AU - Hantos, Gusztáv AU - Hegedüs, János AU - Csuti, Péter AU - Kerecsen Istvánné Rencz, Márta TI - Concepts for high throughput LED testing using high-speed optical transients of LEDs T2 - Proceedings of the 28th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'22) PB - IEEE CY - Dublin SN - 9781665492294 PY - 2022 DO - 10.1109/THERMINIC57263.2022.9950671 UR - https://m2.mtmt.hu/api/publication/33339115 ID - 33339115 N1 - Budapest University of Technology and Economics, Siemens Digital Industry Software, Budapest, Hungary Budapest University of Technology and Economics, Budapest, Hungary LightingLab Calibration Laboratory Ltd., Veszprem, Hungary Export Date: 15 December 2022 AB - To extract parameter sets for Spice-like multidomain models of LEDs needs appropriate set of input data, including forward current - flux, and forward current -forward voltage characteristics of LED packages, performed under isothermal conditions at known values of the junction temperature also known as isothermal IVL characterization, along with the dynamic thermal properties of the LED package in question. The optical and thermal laboratory test procedures, if properly combined, may provide the right set of test data, if both the forward current and the junction temperature are swept over the foreseen operating domain of the LED package to be modelled. The major bottleneck however is, that the industry standard laboratory test procedures (both the optical and thermal ones) require reaching the operating steady state before the actual data acquisition can start, resulting in an impedingly long measurement time. The goal of the present work is to provide an overview of the options of speeding up the overall measurement procedure or the average throughput of the tests for a LED population that provides a representative set of data for multi-domain modelling. LA - English DB - MTMT ER - TY - CHAP AU - Sárkány, Zoltán AU - Musolino, Mattia AU - Sitta, Alessandro AU - Calabretta, Michele AU - Farkas, Gábor AU - Németh, Márk AU - Kerecsen Istvánné Rencz, Márta TI - Thermal Transient Testing Alternatives for the Characterisation of GaN HEMT Power Devices T2 - Proceedings of the 28th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'22) PB - IEEE CY - Dublin SN - 9781665492294 PY - 2022 PG - 5 UR - https://m2.mtmt.hu/api/publication/33085919 ID - 33085919 AB - Despite all the advancements, thermal characterization of GaN HEMT devices is still a challenging task today. In this paper we present a new transient measurement approach utilizing the gate current as temperature sensitive electric parameter (TSEP) and compare the results to the data captured using the channel resistance (Vds). The experienced differences are small, but repeatable. We examine the various factors that could cause artifacts in each method, but no evidence of measurement error was found. LA - English DB - MTMT ER - TY - JOUR AU - Pálovics, Péter AU - Kerecsen Istvánné Rencz, Márta TI - Investigation of the motion of magnetic nanoparticles in microfluidics with a micro domain model JF - MICROSYSTEM TECHNOLOGIES J2 - MICROSYST TECHNOL VL - 28 PY - 2022 IS - 6 SP - 1545 EP - 1559 PG - 15 SN - 0946-7076 DO - 10.1007/s00542-020-05077-0 UR - https://m2.mtmt.hu/api/publication/31665383 ID - 31665383 N1 - Export Date: 4 February 2021 Correspondence Address: Pálovics, P.; Department of Electron Devices, Magyar tudósok krt. 2, Bld. Q, Hungary; email: palovics.peter@vik.bme.hu Funding details: Nemzeti Kutatási Fejlesztési és Innovációs Hivatal, NKFIH Funding details: Ministry for Innovation and Technology Funding text 1: This work has been supported by the ÚNKP-18-3 New National Excellence Program of the Ministry of Human Capacities of Hungary. The research reported in this paper and carried out at the Budapest University of Technology and Economics has been supported by the National Research Development and Innovation Fund based on the charter of bolster issued by the National Research Development and Innovation Office under the auspices of the Ministry for Innovation and Technology. Open access funding provided by Budapest University of Technology and Economics. Funding Agency and Grant Number: New National Excellence Program of the Ministry of Human Capacities of Hungary [UNKP-18-3]; National Research Development and Innovation Fund by the National Research Development and Innovation Office under Ministry for Innovation and Technology; Budapest University of Technology and Economics Funding text: This work has been supported by the UNKP-18-3 New National Excellence Program of the Ministry of Human Capacities of Hungary. The research reported in this paper and carried out at the Budapest University of Technology and Economics has been supported by the National Research Development and Innovation Fund based on the charter of bolster issued by the National Research Development and Innovation Office under the auspices of the Ministry for Innovation and Technology. Open access funding provided by Budapest University of Technology and Economics. Export Date: 13 May 2021 Correspondence Address: Pálovics, P.; Department of Electron Devices, Magyar tudósok krt. 2, Bld. Q, Hungary; email: palovics.peter@vik.bme.hu Funding details: Nemzeti Kutatási Fejlesztési és Innovációs Hivatal, NKFIH Funding details: Ministry for Innovation and Technology Funding text 1: This work has been supported by the ÚNKP-18-3 New National Excellence Program of the Ministry of Human Capacities of Hungary. The research reported in this paper and carried out at the Budapest University of Technology and Economics has been supported by the National Research Development and Innovation Fund based on the charter of bolster issued by the National Research Development and Innovation Office under the auspices of the Ministry for Innovation and Technology. Open access funding provided by Budapest University of Technology and Economics. AB - In this paper the magnetic nanoparticle (MNP) dynamics in a microfluidic device is investigated in the presence of an external magnetic field. The nanoparticles are used for enzyme-substrate reaction measurements, where the enzyme is immobilized to the surface of the nanoparticles. During the measurements the microreactors, called microchambers are filled up with the MNPs where the distribution of the nanoparticles significantly influences the results of the further reaction measurements. In this paper the procedure of the nanoparticle aggregation is investigated numerically in the microchamber in a micro domain simulation space. First the acting forces on the MNPs are examined from the different phenomena. An in-house numerical model is presented where the dynamics of several MNPs are simulated in the micro-size domain. This model is also embedded in the open source CFD software OpenFOAM. The theoretical calculations and the simulations show that the particle-particle interaction due to magnetization plays an important role during the aggregation procedure. The particles in the magnetic field cluster over the time into chains, which phenomenon is in good agreement with the literature. A theoretical model of the chain dynamics is also established, which is compared to the simulation results. The presented micro domain model was later used to improve an Eulerian-Eulerian based two-phase CFD model and solver, which is able to model the complete MNP aggregation procedure in the magnetic field in macroscopic domains. LA - English DB - MTMT ER -