1.
Farkas, Csaba ; Gál, László ; Gyenizse, Lívia ; Harsányi, Gábor ; Rigler, Dániel ; Sáfár, Balázs ; Gere, Dániel ; Csiszár, András ; Géczy, Attila
Soil Degradation of Sustainable PCB Substrates in Natural and Controlled Environments
In: IEEE - IEEE (eds.) 2025 International Spring Seminar on Electronics Technology (ISSE)
Piscataway (NJ), United States of America : IEEE (2025) Paper: 11121032 , 5 p.
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Centrally managed Publication:36298161 Validated Core Citing Chapter in Book (Conference paper ) Scientific
Conference paper (Chapter in Book) | Scientific[36298161] [Validated]
2.
Farkas, Csaba ✉ ; Gál, László ; Csiszár, András ; Grennerat, Vincent ; Jeannin, Pierre-Olivier ; Xavier, Pascal ; Rigler, Dániel ; Krammer, Olivér ; Plachy, Zbynek ; Dusek, Karel et al.
Sustainable printed circuit board substrates based on flame-retarded PLA/flax composites to reduce environmental load of electronics: Quality, reliability, degradation and application tests
SUSTAINABLE MATERIALS AND TECHNOLOGIES 40 Paper: e00902 , 15 p. (2024)
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Citing papers: 44 | Independent citation: 32 | Self citation: 12 | Unknown citation: 0 | Number of citations in WoS: 31 | Number of citations in Scopus: 21 | WoS/Scopus assigned: 32 | Number of citations with DOI: 42
Article (Journal Article) | Scientific[34746761] [Validated]
All citations+mentions: 44, External citations: 32, Self citations: 12, Unhandled citations: 0
3.
Farkas, Csaba ; Csiszár, András ; Gál, László ; Czaun, Réka ; Géczy, Attila
Soil Degradation of Sustainable PLA/Flax Substrates and Printed Circuit Board Assemblies
In: IEEE - IEEE (eds.) 2024 47th International Spring Seminar on Electronics Technology (ISSE)
New York City, United States of America : IEEE (2024) Paper: 10604191 , 6 p.
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Citing papers: 1 | Independent citation: 0 | Self citation: 1 | Unknown citation: 0 | Number of citations in WoS: 1 | Number of citations in Scopus: 1 | WoS/Scopus assigned: 1 | Number of citations with DOI: 1
Conference paper (Chapter in Book) | Scientific[35150919] [Validated]
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4.
Farkas, Csaba ; Krammer, Olivér ; Csiszár, András ; Hajdu, István ; Gál, László ; Géczy, Attila
Decomposition study of sustainable biodegradable Printed Circuit Boards
In: IEEE Staff (eds.) 2023 46th International Spring Seminar on Electronics Technology (ISSE)
Piscataway (NJ), United States of America : IEEE (2023) pp. 1-6. , 6 p.
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Centrally managed Publication:34058716 Admin approved Core Citing Chapter in Book (Conference paper ) Scientific
Citing papers: 3 | Independent citation: 3 | Self citation: 0 | Unknown citation: 0 | Number of citations in WoS: 2 | Number of citations in Scopus: 3 | WoS/Scopus assigned: 3 | Number of citations with DOI: 3
Conference paper (Chapter in Book) | Scientific[34058716] [Admin approved]
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5.
Geczy, Attila ; Csiszar, Andras ; Rozs, Egon ; Hajdu, Istvan ; Medgyes, Balint ; Krammer, Oliver ; Straubinger, Daniel ; Gal, Laszlo
Novel PLA/Flax Based Biodegradable Printed Circuit Boards
In: IEEE (eds.) 2022 45th International Spring Seminar on Electronics Technology (ISSE)
Piscataway (NJ), United States of America : IEEE (2022) Paper: 9812827 , 6 p.
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Centrally managed Publication:32930305 Validated Core Citing Chapter in Book (Conference paper ) Scientific
Citing papers: 18 | Independent citation: 14 | Self citation: 4 | Unknown citation: 0 | Number of citations in WoS: 12 | Number of citations in Scopus: 8 | WoS/Scopus assigned: 14 | Number of citations with DOI: 16
Conference paper (Chapter in Book) | Scientific[32930305] [Validated]
All citations+mentions: 18, External citations: 14, Self citations: 4, Unhandled citations: 0
6.
Geczy, Attila ✉ ; Csiszar, Andras ; Xavier, Pascal ; Corrao, Nicolas ; Rauly, Dominique ; Kovacs, Robert ; Feher, Anna Eva ; Rozs, Egon ; Gal, Laszlo
Thermal and RF Characterization of Novel PLA/Flax Based Biodegradable Printed Circuit Boards
In: Bhesetti, CR; Lianto, P; Toh, CH (eds.) Proceedings of the 24th Electronics Packaging Technology Conference (EPTC 2022), 07 – 09 December 2022, Singapore
Piscataway (NJ), United States of America : IEEE (2022) pp. 329-333. , 5 p.
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Centrally managed Publication:33591198 Admin approved Core Citing Chapter in Book (Conference paper ) Scientific
Citing papers: 7 | Independent citation: 3 | Self citation: 4 | Unknown citation: 0 | Number of citations in WoS: 5 | Number of citations in Scopus: 4 | WoS/Scopus assigned: 6 | Number of citations with DOI: 7
Conference paper (Chapter in Book) | Scientific[33591198] [Admin approved]
All citations+mentions: 7, External citations: 3, Self citations: 4, Unhandled citations: 0
7.
Alaya, Mohamed Amine ; Gal, Laszlo ; Geczy, Attila
Applicability of gage type pressure sensors in vapour phase soldering for process evaluation
In: IEEE (eds.) 2020 43rd International Spring Seminar on Electronics Technology (ISSE)
Piscataway (NJ), United States of America : IEEE (2020) Paper: 9120994 , 6 p.
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Centrally managed Publication:31357342 Admin approved Core Citing Chapter in Book (Conference paper ) Scientific
Conference paper (Chapter in Book) | Scientific[31357342] [Admin approved]
8.
Alaya, Mohamed Amine ; Gal, Laszlo ; Hurtony, Tamas ; Medgyes, Balint ; Straubinger, Daniel ; Tareq I, Al-Maaiteh ; Illes, Balazs ; Geczy, Attila
Wetting of Different Lead Free Solder Alloys During Vapour Phase Soldering
In: IEEE (eds.) 2019 42ND INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE)
New York City, United States of America : IEEE (2019) Paper: 8810204 , 6 p.
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Conference paper (Chapter in Book) | Scientific[30774630] [Validated]
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9.
Szurdan, Szabolcs ; Medgyes, Balint ; Mende, Tamas ; Berenyi, Richard ; Gal, Laszlo ; Harsanyi, Gabor
Reliability Tests on SAC-xMn Solder Alloys
In: Chindris, Gabriel (eds.) 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Piscataway (NJ), United States of America : IEEE (2019) pp. 34-37. Paper: 8990729 , 4 p.
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Conference paper (Chapter in Book) | Scientific[31177406] [Validated]
All citations+mentions: 1, External citations: 0, Self citations: 1, Unhandled citations: 0
10.
Straubinger, Daniel ; Bozsoki, Istvan ; Gal, Laszlo ; Geczy, Attila
Scaling of Components for Explicit Modelling of Heat Transfer during Vapour Phase Reflow Soldering
In: Chindris, Gabriel (eds.) 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Piscataway (NJ), United States of America : IEEE (2019) pp. 155-159. Paper: 8990884 , 5 p.
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Centrally managed Publication:31177463 Admin approved Core Citing Chapter in Book (Conference paper ) Scientific
Conference paper (Chapter in Book) | Scientific[31177463] [Admin approved]
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