TY - CHAP AU - Ress, Sándor László AU - Sárkány, Zoltán AU - Kerecsen Istvánné Rencz, Márta AU - Farkas, Gábor ED - Poppe, András TI - Thermal Transient Tests with Programmed Powering on Wide Bandgap Power Devices of Non-Monotonous and Time-Variant Characteristics T2 - 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) PB - IEEE CY - Budapest SN - 9798350318623 PY - 2023 PG - 8 DO - 10.1109/THERMINIC60375.2023.10325869 UR - https://m2.mtmt.hu/api/publication/34448273 ID - 34448273 N1 - Budapest University of Technology and Economics, Hungary Siemens Digital Industry Software, Budapest, Hungary Conference code: 194796 Export Date: 22 December 2023 Correspondence Address: Ress, S.; Budapest University of Technology and EconomicsHungary; email: sandor.ress@vik.bme.hu AB - Thermal transient testing of semiconductor devices needs a well-defined power level for heating and proper data acquisition for recording the change of a thermally sensitive device parameter. While the latter is fully solved by up-to-date thermal testers, power level setting is typically limited to forcing varying current levels on two pin devices, such as diodes. Other proposed methods need trials for setting the power and have poor stability.The paper presents a methodology for applying power in various test arrangements, on devices with three pins such as MOSFETs, IGBTs, BJTs and HEMTs. A simple analog circuitry is proposed which ensures thermally and electrically stable powering and an exact operating voltage and current.Several simulation and measurement experiments prove that a novel solution based on fast drain-source voltage change at constant current ensures optimal powering in reliability tests and short electric distortion in transient tests. © 2023 IEEE. LA - English DB - MTMT ER - TY - CHAP AU - Kerecsen Istvánné Rencz, Márta AU - Farkas, Gábor AU - Sárkány, Zoltán AU - Vass-Várnai, András ED - Kerecsen Istvánné Rencz, Márta ED - Farkas, Gábor ED - Poppe, András TI - The Use of Thermal Transient Testing T2 - Theory and Practice of Thermal Transient Testing of Electronic Components PB - Springer Netherlands CY - Cham SN - 9783030861742 PY - 2022 SP - 319 EP - 352 PG - 34 DO - 10.1007/978-3-030-86174-2_7 UR - https://m2.mtmt.hu/api/publication/33589490 ID - 33589490 N1 - Siemens Digital Industry Software STS, Budapest, Hungary Budapest University of Technology and Economics, Budapest, Hungary Siemens Digital Industry Software, Plano, TX, United States Export Date: 1 June 2023 Correspondence Address: Rencz, M.; Siemens Digital Industry Software STSHungary; email: rencz.marta@vik.bme.hu LA - English DB - MTMT ER - TY - CHAP AU - Farkas, Gábor AU - Poppe, András AU - Sárkány, Zoltán AU - Vass-Várnai, András ED - Kerecsen Istvánné Rencz, Márta ED - Farkas, Gábor ED - Poppe, András TI - Thermal Transient Measurements on Various Electronic Components T2 - Theory and Practice of Thermal Transient Testing of Electronic Components PB - Springer Netherlands CY - Cham SN - 9783030861742 PY - 2022 SP - 209 EP - 318 PG - 110 DO - 10.1007/978-3-030-86174-2_6 UR - https://m2.mtmt.hu/api/publication/33589441 ID - 33589441 N1 - Siemens Digital Industry Software STS, Budapest, Hungary Budapest University of Technology and Economics, Budapest, Hungary Siemens Digital Industry Software, Plano, TX, United States Export Date: 1 June 2023 Correspondence Address: Farkas, G.; Siemens Digital Industry Software STSHungary; email: Gabor.Farkas@siemens.com LA - English DB - MTMT ER - TY - CHAP AU - Farkas, Gábor ED - Kerecsen Istvánné Rencz, Márta ED - Farkas, Gábor ED - Poppe, András TI - Fundamentals of Thermal Transient Measurements T2 - Theory and Practice of Thermal Transient Testing of Electronic Components PB - Springer Netherlands CY - Cham SN - 9783030861742 PY - 2022 SP - 171 EP - 208 PG - 38 DO - 10.1007/978-3-030-86174-2_5 UR - https://m2.mtmt.hu/api/publication/33589426 ID - 33589426 LA - English DB - MTMT ER - TY - CHAP AU - Farkas, Gábor ED - Kerecsen Istvánné Rencz, Márta ED - Farkas, Gábor ED - Poppe, András TI - Temperature-Dependent Electrical Characteristics of Semiconductor Devices T2 - Theory and Practice of Thermal Transient Testing of Electronic Components PB - Springer Netherlands CY - Cham SN - 9783030861742 PY - 2022 SP - 139 EP - 169 PG - 31 DO - 10.1007/978-3-030-86174-2_4 UR - https://m2.mtmt.hu/api/publication/33589413 ID - 33589413 LA - English DB - MTMT ER - TY - CHAP AU - Poppe, András AU - Farkas, Gábor ED - Kerecsen Istvánné Rencz, Márta ED - Farkas, Gábor ED - Poppe, András TI - Thermal Metrics T2 - Theory and Practice of Thermal Transient Testing of Electronic Components PB - Springer Netherlands CY - Cham SN - 9783030861742 PY - 2022 SP - 97 EP - 137 PG - 41 DO - 10.1007/978-3-030-86174-2_3 UR - https://m2.mtmt.hu/api/publication/33589399 ID - 33589399 N1 - Export Date: 1 June 2023 Correspondence Address: Poppe, A.; Siemens Digital Industry Software STSHungary; email: Poppe.Andras@vik.bme.hu LA - English DB - MTMT ER - TY - CHAP AU - Farkas, Gábor AU - Poppe, András AU - Kerecsen Istvánné Rencz, Márta ED - Kerecsen Istvánné Rencz, Márta ED - Farkas, Gábor ED - Poppe, András TI - Theoretical Background of Thermal Transient Measurements T2 - Theory and Practice of Thermal Transient Testing of Electronic Components PB - Springer Netherlands CY - Cham SN - 9783030861742 PY - 2022 SP - 7 EP - 96 PG - 90 DO - 10.1007/978-3-030-86174-2_2 UR - https://m2.mtmt.hu/api/publication/33589207 ID - 33589207 N1 - Siemens Digital Industry Software STS, Budapest, Hungary Budapest University of Technology and Economics, Budapest, Hungary Export Date: 1 June 2023 Correspondence Address: Poppe, A.; Siemens Digital Industry Software STSHungary; email: Poppe.Andras@vik.bme.hu LA - English DB - MTMT ER - TY - CHAP AU - Kerecsen Istvánné Rencz, Márta AU - Farkas, Gábor ED - Kerecsen Istvánné Rencz, Márta ED - Farkas, Gábor ED - Poppe, András TI - Why Was Written and How to Read This Book T2 - Theory and Practice of Thermal Transient Testing of Electronic Components PB - Springer Netherlands CY - Cham SN - 9783030861742 PY - 2022 SP - 1 EP - 5 PG - 5 DO - 10.1007/978-3-030-86174-2_1 UR - https://m2.mtmt.hu/api/publication/33589178 ID - 33589178 N1 - Export Date: 1 June 2023 Correspondence Address: Rencz, M.; Siemens Digital Industry Software STSHungary; email: rencz.marta@vik.bme.hu LA - English DB - MTMT ER - TY - BOOK ED - Kerecsen Istvánné Rencz, Márta ED - Farkas, Gábor ED - Poppe, András TI - Theory and Practice of Thermal Transient Testing of Electronic Components PB - Springer Netherlands CY - Cham PY - 2022 SN - 9783030861742 DO - 10.1007/978-3-030-86174-2 UR - https://m2.mtmt.hu/api/publication/33589137 ID - 33589137 N1 - Siemens Digital Industry Software STS, Budapest, Hungary Budapest University of Technology and Economics, Budapest, Hungary Export Date: 1 June 2023 Correspondence Address: Rencz, M.; Siemens Digital Industry Software STSHungary LA - English DB - MTMT ER - TY - CHAP AU - Sárkány, Zoltán AU - Musolino, Mattia AU - Sitta, Alessandro AU - Calabretta, Michele AU - Farkas, Gábor AU - Németh, Márk AU - Kerecsen Istvánné Rencz, Márta TI - Thermal Transient Testing Alternatives for the Characterisation of GaN HEMT Power Devices T2 - Proceedings of the 28th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'22) PB - IEEE CY - Dublin SN - 9781665492294 PY - 2022 PG - 5 UR - https://m2.mtmt.hu/api/publication/33085919 ID - 33085919 AB - Despite all the advancements, thermal characterization of GaN HEMT devices is still a challenging task today. In this paper we present a new transient measurement approach utilizing the gate current as temperature sensitive electric parameter (TSEP) and compare the results to the data captured using the channel resistance (Vds). The experienced differences are small, but repeatable. We examine the various factors that could cause artifacts in each method, but no evidence of measurement error was found. LA - English DB - MTMT ER -