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      <label>Medgyes Bálint et al. A Futuring Training in Trireme: Quality, Reliability and Testing of Electronics in the E-Transportation. (2025) In: 2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME) pp. 201-204</label><template>&lt;div class=&quot;BookChapter Publication short-list&quot;&gt; &lt;div class=&quot;authors&quot;&gt; &lt;span class=&quot;author-name&quot; mtid=&quot;10042094&quot;&gt; &lt;a href=&quot;/gui2/?type=authors&amp;mode=browse&amp;sel=10042094&quot; target=&quot;_blank&quot;&gt;Medgyes, Bálint&lt;/a&gt; &lt;/span&gt; &lt;span class=&quot;author-type&quot;&gt; &lt;/span&gt; ; &lt;span class=&quot;author-name&quot; mtid=&quot;10055571&quot;&gt; &lt;a href=&quot;/gui2/?type=authors&amp;mode=browse&amp;sel=10055571&quot; target=&quot;_blank&quot;&gt;Farkas, Csaba&lt;/a&gt; &lt;/span&gt; &lt;span class=&quot;author-type&quot;&gt; &lt;/span&gt; ; &lt;span class=&quot;author-name&quot; &gt; Danieli, Stefano &lt;/span&gt; &lt;span class=&quot;author-type&quot;&gt; &lt;/span&gt; ; &lt;span class=&quot;author-name&quot; &gt; Cantiani, Elena &lt;/span&gt; &lt;span class=&quot;author-type&quot;&gt; &lt;/span&gt; ; &lt;span class=&quot;author-name&quot; &gt; Spanyik, Marek &lt;/span&gt; &lt;span class=&quot;author-type&quot;&gt; &lt;/span&gt; ; &lt;span class=&quot;author-name&quot; &gt; Stolfa, Jakub &lt;/span&gt; &lt;span class=&quot;author-type&quot;&gt; &lt;/span&gt; &lt;/div &gt;&lt;div class=&quot;title&quot;&gt;&lt;a href=&quot;/gui2/?mode=browse&amp;params=publication;36853756&quot; mtid=&quot;36853756&quot; target=&quot;_blank&quot;&gt;A Futuring Training in Trireme: Quality, Reliability and Testing of Electronics in the E-Transportation&lt;/a&gt;&lt;/div&gt; &lt;div class=&quot;InBook&quot;&gt;In: Chindris, Gabriel &lt;span class=&quot;booktitle&quot;&gt;&lt;a href=&quot;/gui2/?mode=browse&amp;params=publication;36609954&quot; target=&quot;_blank&quot;&gt;2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME) &lt;/a&gt;&lt;/span &gt; &lt;/div&gt;&lt;div class=&quot;pub-info&quot;&gt; &lt;span class=&quot;publishedAt&quot;&gt;Piscataway (NJ), United States of America : &lt;span class=&quot;publisher&quot;&gt;IEEE&lt;/span&gt; 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&lt;div class=&quot;InBook&quot;&gt;&lt;div class=&quot;chapter-in&quot;&gt;In:&lt;/div&gt; &lt;div class=&quot;authors&quot;&gt; &lt;div class=&quot;autype autype0&quot;&gt; &lt;span class=&quot;author-name&quot; &gt;Chindris Gabriel &lt;/span&gt; &lt;/div&gt; &lt;/div&gt; &lt;div class=&quot;booktitle&quot;&gt;&lt;a href=&quot;/gui2/?mode=browse&amp;params=publication;36609954&quot; target=&quot;_blank&quot;&gt;2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME) &lt;/a&gt;&lt;/div&gt; &lt;div class=&quot;conference&quot;&gt; Conference: &lt;span class=&quot;location&quot;&gt;Brassó, Romania &lt;span class=&quot;conference-date&quot;&gt;2025.10.22. - 2025.10.25.&lt;/span&gt; &lt;/div&gt; &lt;span class=&quot;publishedAt&quot;&gt;Piscataway (NJ): &lt;span class=&quot;publishers&quot;&gt;IEEE&lt;/span&gt;, &lt;span class=&quot;page&quot;&gt; pp 201-204 &lt;/span&gt; &lt;span class=&quot;year&quot;&gt;(2025)&lt;/span&gt; &lt;/div&gt; &lt;div class=&quot;pub-footer&quot;&gt; 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