https://m2.mtmt.hu/ eng 2026-05-30 13:55 BookChapter 36740820 ADMIN_APPROVED true 0 false 2026-03-31T13:11:30.903+0000 2026-03-31T12:24:14.468+0000 2025-12-30T18:44:37.034+0000 true 10098563 Tafferner Zoltán /api/author/10098563 Author true 2026-03-31T12:24:14.475+0000 2026-03-31T12:24:14.475+0000 2026-03-24T16:15:17.521+0000 true 10072271 Andódy Katalin /api/admin/10072271 Admin true Admin 10003141 /api/admin/10003141 Aggod Zsuzsa true 10003141 true 2026-03-25T08:22:37.424+0000 true false true 25 25 /api/publicationtype/25 PublicationType 2 true 25 BookChapter true 10000312 Conference paper true 25 25 /api/publicationtype/25 PublicationType 2 true 25 BookChapter /api/subtype/10000312 Konferenciaközlemény SubType 228 true 10000312 true 1 /api/category/1 Category true 1 Tafferner, Zoltán Effect of Electromigration in Tin-Bismuth and SAC Lead-Free Solder Joints of 0402 and 0201 Chip Resistors 292 297 292 6 2025 Miniaturization of devices leads to the appearance of high current densities inside solder joints. These current densities may induce electromigration, which can lead to the formation of thicker IMC layers, voids and Cu dissolution. In the case of Sn-Bi solders it may lead to phase segregation as well. Test vehicles for the study of solder joints of 0402 and 0201 chip resistors have been designed and realised on RO4350B high performance PCB dielectric material. The PCBs have been populated with zero ohm (jumper) 0402 and 0201 surface mounted chip-size resistors, using Sn-Bi and SAC solder, allowing for a direct comparison of the electromigration behaviour of the two solder types in the case of common component types. A test environment for high-current stressing was prepared. The samples were examined after reflowing and after 500 h of current stress, by shear testing and SEM crosssectional images. The microstructure of the samples was analysed to inspect void growth, IMC growth and Bi-layer aggregation behaviour. Besides the test samples taken out at 500 h aging, the test will continue until 4000 h total stress time, with additional analysis at the 1000h and 2000 h mark. true NATIONAL 2025 true true true true true false NONE 2026-03-31 false 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 false 10098563 false false false 2026-03-23T16:15:17.321+0000 Elektronikai Technológia Tanszék (BME / VIK) 6 5 1 6 0 true true 10002 English /api/language/10002 Angol Language true 2 false true 10939 true 10017 /api/country/10017 Country true 13 /api/city/10939 City true 2054246 true 31479998 /api/publicationidentifier/31479998 https://doi.org/10.1109/SIITME67657.2025 10.1109/SIITME67657.2025 PublicationIdentifier true 6 DOI https://doi.org/@@@ /api/publicationsource/6 DOI PlainSource true true 10001 /api/publicationsourcetype/10001 PublicationSourceType true true 6 true false true 30603847 /api/publicationidentifier/30603847 https://www.worldcat.org/search?q=isbn%3A9798331568696 9798331568696 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10.3390/met11020364 false true Reference 71079608 /api/reference/71079608 21 10.1063/1.1861151 false true Reference 71079609 /api/reference/71079609 22 10.1016/j.matdes.2020.108726 false true Reference 71079610 /api/reference/71079610 23 10.1063/1.2890412 false true Reference 71079611 /api/reference/71079611 24 10.1016/j.msea.2016.05.092 false true /api/publication/36740820 <div class="BookChapter Publication long-list"> <div class="authors"> <img title="Forrásközlemény" style="float: left" src="/frontend/resources/grid/publication-core-icon.png"> <div class="autype autype0"> <span class="author-name" mtid="10098563"><a href="/gui2/?type=authors&mode=browse&sel=10098563" target="_blank">Tafferner Zoltán (<span class="authorship-author-name">Tafferner Zoltán</span> <span class="authorAux-mtmt"> elektronika és elektronikai technológia</span>) </a> </span> <span class="author-affil"><span title="Budapest University of Technology and Economics">BUTE</span>/<span title="Faculty of Electrical Engineering and Informatics">FEEI</span>/Department of Electronics Technology</span> ;&nbsp;&nbsp;&nbsp; <span class="author-name" mtid="10089202"><a href="/gui2/?type=authors&mode=browse&sel=10089202" target="_blank">Havellant Gergő (<span class="authorship-author-name">Havellant Gergő</span> <span class="authorAux-mtmt"> SMT, Gőzfázisú forrasztás</span>) </a> </span> <span class="author-affil"><span title="Budapest University of Technology and Economics">BUTE</span>/<span title="Faculty of Electrical Engineering and Informatics">FEEI</span>/Department of Electronics Technology</span> ;&nbsp;&nbsp;&nbsp; <span class="author-name" mtid="10019053"><a href="/gui2/?type=authors&mode=browse&sel=10019053" target="_blank">Krammer Olivér (<span class="authorship-author-name">Krammer Olivér</span> <span class="authorAux-mtmt"> Elektronikai technológia</span>) </a> </span> <span class="author-affil"><span title="Budapest University of Technology and Economics">BUTE</span>/<span title="Faculty of Electrical Engineering and Informatics">FEEI</span>/Department of Electronics Technology</span> ;&nbsp;&nbsp;&nbsp; <span class="author-name" mtid="10013791"><a href="/gui2/?type=authors&mode=browse&sel=10013791" target="_blank">Illés Balázs (<span class="authorship-author-name">Illés Balázs György</span> <span class="authorAux-mtmt"> Forrasztás, termikus méréstechnika és modellezés</span>) </a> </span> <span class="author-affil"><span title="Budapest University of Technology and Economics">BUTE</span>/<span title="Faculty of Electrical Engineering and Informatics">FEEI</span>/Department of Electronics Technology</span> ;&nbsp;&nbsp;&nbsp; <span class="author-name" mtid="10042045"><a href="/gui2/?type=authors&mode=browse&sel=10042045" target="_blank">Hurtony Tamás (<span class="authorship-author-name">Hurtony Tamás József</span> <span class="authorAux-mtmt"> Elektronikai technológia</span>) </a> </span> <span class="author-affil"><span title="Budapest University of Technology and Economics">BUTE</span>/<span title="Faculty of Electrical Engineering and Informatics">FEEI</span>/Department of Electronics Technology</span> ;&nbsp;&nbsp;&nbsp; <span class="author-name" mtid="10042053"><a href="/gui2/?type=authors&mode=browse&sel=10042053" target="_blank">Géczy Attila (<span class="authorship-author-name">Géczy Attila</span> <span class="authorAux-mtmt"> Elektronikai technológia</span>) </a> </span> <span class="author-affil"><span title="Budapest University of Technology and Economics">BUTE</span>/<span title="Faculty of Electrical Engineering and Informatics">FEEI</span>/Department of Electronics Technology</span> </div> </div> <div class="title"><a href="/gui2/?mode=browse&params=publication;36740820" target="_blank">Effect of Electromigration in Tin-Bismuth and SAC Lead-Free Solder Joints of 0402 and 0201 Chip Resistors</a></div> <div class="InBook"><div class="chapter-in">In:</div> <div class="authors"> <div class="autype autype0"> <span class="author-name" >Chindris Gabriel </span> </div> </div> <div class="booktitle"><a href="/gui2/?mode=browse&params=publication;36609954" target="_blank">2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME) </a></div> <div class="conference"> Conference: <span class="location">Brassó, Romania <span class="conference-date">2025.10.22. - 2025.10.25.</span> </div> <span class="publishedAt">Piscataway (NJ): <span class="publishers">IEEE</span>, <span class="page"> pp 292-297 </span> <span class="year">(2025)</span> ( <span class="seriesTitle">IEEE International Symposium for Design and Technology in Electronic Packaging</span> <span class="issn">2641-287X</span> <span class="issn">2642-7036</span> ) </div> <div class="pub-footer"> <span class="language" xmlns="http://www.w3.org/1999/html">Language: English | </span> <span class="identifiers"> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="10.1109/SIITME67657.2025.11293661" target="_blank" href="https://doi.org/10.1109/SIITME67657.2025.11293661"> DOI </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:black" title="105031638636" target="_blank" href="http://www.scopus.com/record/display.url?origin=inward&eid=2-s2.0-105031638636"> Scopus </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="https://ieeexplore.ieee.org/document/11293661/" target="_blank" href="https://ieeexplore.ieee.org/document/11293661/"> Other URL </a> </span> </span> <span class="bookchapter-ids">Book link(s):</span> <span class="identifiers"> <span class="id identifier oa_none" title="none"> <a style="color:black" title="10.1109/SIITME67657.2025" target="_blank" href="https://doi.org/10.1109/SIITME67657.2025"> DOI </a> </span> <span class="id identifier oa_none" title="none"> <span class="isbnOrIssn"> ISBN: </span> <a style="color:black" title="9798331568696" target="_blank" href="https://www.worldcat.org/search?q=isbn%3A9798331568696"> 9798331568696 </a> </span> </span> <div class="mtid"><span class="long-pub-mtid">Publication: 36740820</span> | <span class="status-data status-ADMIN_APPROVED"> Admin approved </span> <span class="long-book-mtid">Book: 36609954</span> Core | <span class="type-subtype">Chapter in Book ( Conference paper ) </span> | <span class="pub-category">Scientific</span> | <span class="publication-sourceOfData">DOI XML</span> </div> <div class="lastModified">Last Modified: 2026.03.31. 14:24 András Balázs (MTMT Központ, admin) </div> <div class="lockedBy">Centrally managed 2026.03.25. 09:22 Zsuzsa Aggod (MTMT 2-3, admin) </div> </div> </div>