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2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME)

Chindris, Gabriel

English Conference proceedings (Book) Scientific

Published: IEEE, Piscataway (NJ), United States of America 2025

Conference: IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME 2025) 2025-10-22 [Brassó, Romania]

Series: IEEE International Symposium for Design and Technology in Electronic Packaging 2641-287X 2642-7036

Identifiers

MTMT: 36609954
DOI: 10.1109/SIITME67657.2025
ISBN: 9798331568696

Chapters

AlHousrya Obaida et al. IoT-Enabled Driver Health Monitoring System Using Multi-Modal Sensors and Cloud Integration. (2025) In: 2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME) pp. 107-114
Gharaibeh Ali et al. Electrochemical Migration: A Short State-of-the-Art Overview. (2025) In: 2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME) pp. 152-159
Medgyes Bálint et al. A Futuring Training in Trireme: Quality, Reliability and Testing of Electronics in the E-Transportation. (2025) In: 2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME) pp. 201-204
Tafferner Zoltán et al. Effect of Electromigration in Tin-Bismuth and SAC Lead-Free Solder Joints of 0402 and 0201 Chip Resistors. (2025) In: 2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME) pp. 292-297

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2026-05-16 11:14

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