https://m2.mtmt.hu/ hun 2026-07-28 13:52 BookChapter 36307724 VALIDATED true 0 false 2026-05-25T00:40:50.191+0000 2026-02-23T10:07:56.312+0000 2025-08-29T11:39:38.298+0000 true 10042094 Medgyes Bálint /api/author/10042094 Author true 10042094 2026-04-21T23:24:00.047+0000 2026-04-21T23:24:00.047+0000 2025-09-01T07:59:47.357+0000 true 10072271 Andódy Katalin /api/admin/10072271 Admin true 2025-12-23T12:04:55.379+0000 true 521 Szuper Admin /api/admin/521 Admin true Admin 10063514 /api/admin/10063514 Mikola Katalin true 10063514 true 2026-02-12T16:02:40.758+0000 true false true 25 25 /api/publicationtype/25 PublicationType 2 true 25 BookChapter true 10000312 Conference paper true 25 25 /api/publicationtype/25 PublicationType 2 true 25 BookChapter /api/subtype/10000312 Konferenciaközlemény SubType 228 true 10000312 true 1 /api/category/1 Category true 1 Rous, Pavel Mechanical Strength of Aged Solder Joints: Impact of Plasma Treatment 11120910 11120910 6 2025 The reliability of solder joints, crucial for electronic assemblies, is influenced by factors including intermetallic compound (IMC) growth during aging and surface properties. This study investigated the impact of atmospheric plasma pre-treatment on the shear strength and IMC formation of aged (thermal aging and thermal shock) SAC305 solder joints on various PCB finishes (Cu, ImT, HASL, ENIG). Shear testing revealed that plasma treatment had a limited effect on mechanical strength under the applied test conditions. Fracture mode analysis indicated that failures predominantly occurred at the component’s lead metallization, suggesting that component quality was the limiting factor, masking potential effects of the plasma treatment applied to the PCB pads. Thermal shock aging was observed to be more detrimental to joint strength than thermal aging, particularly affecting the component-level integrity. IMC analysis showed expected growth with thermal aging. Plasma treatment had negligible impact on IMC thickness for ENIG finish, while an unexpected trend of reduced IMC thickness was observed for HASL finish, warranting further investigation. The study highlights the critical role of component robustness in reliability testing and suggests its potential to overshadow the influence of PCB surface treatments. true INTERNATIONAL 2025 true true true true true false NONE 2026-05-25 false 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 false false false false 2025-08-31T07:55:26.176+0000 Elektronikai Technológia Tanszék (BME / VIK) 2 3 1 4 0 true true 10002 English /api/language/10002 Angol Language true 2 false true 10939 true 10017 /api/country/10017 Country true 13 /api/city/10939 City true 2054246 true 31289922 IDENTICAL /api/publicationidentifier/31289922 https://doi.org/10.1109/ISSE65583.2025 10.1109/ISSE65583.2025 PublicationIdentifier true 6 DOI https://doi.org/@@@ /api/publicationsource/6 DOI PlainSource true true 10001 /api/publicationsourcetype/10001 PublicationSourceType true true 6 true true true 29726224 IDENTICAL /api/publicationidentifier/29726224 https://www.worldcat.org/search?q=isbn%3A9798331512163 9798331512163 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false 10063514 Language 10002 /api/language/10002 Angol English true 2 true PersonAuthorship 127632829 /api/authorship/127632829 1 0.25 true false false Rous Pavel true false false AuthorshipType 1 /api/authorshiptype/1 0 true 0 true false true PersonAuthorship 127632830 /api/authorship/127632830 2 0.25 false false false Author 10019053 /api/author/10019053 Krammer Olivér true 10019053 true Krammer Olivér true false false AuthorshipType 1 /api/authorshiptype/1 0 true 0 true false true PersonAuthorship 127632831 /api/authorship/127632831 3 0.25 false false false Author 10042094 /api/author/10042094 Medgyes Bálint true 10042094 true Medgyes Bálint true false false AuthorshipType 1 /api/authorshiptype/1 0 true 0 true false true PersonAuthorship 127632832 /api/authorship/127632832 4 0.25 false true false Steiner František true false false AuthorshipType 1 /api/authorshiptype/1 0 true 0 true false true PublicationIdentifier 29767548 /api/publicationidentifier/29767548 PlainSource 6 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false true PublicationIdentifier 29767549 /api/publicationidentifier/29767549 PlainSource 40 /api/publicationsource/40 PublicationSourceType 10006 /api/publicationsourcetype/10006 true true true Egyéb URL Other URL @@@ true true 40 true https://ieeexplore.ieee.org/document/11120910/ https://ieeexplore.ieee.org/document/11120910/ false true Reference 67727079 /api/reference/67727079 1 10.1108/ssmt-09-2013-0023 false true Reference 67727080 /api/reference/67727080 2 10.1109/isse54558.2022.9812788 false true Reference 67727081 /api/reference/67727081 3 10.1109/tps.2024.3507074 false true Reference 67727082 /api/reference/67727082 4 10.1109/diagnostika61830.2024.10693921 false true /api/publication/36307724 <div class="BookChapter Publication long-list"> <div class="authors"> <img title="Forrásközlemény" style="float: left" src="/frontend/resources/grid/publication-core-icon.png"> <img title="Idézőközlemény" style="float: left" src="/frontend/resources/grid/publication-citation-icon.png"> <div class="autype autype0"> <span class="author-name" >Rous Pavel </span> ;&nbsp;&nbsp;&nbsp; <span class="author-name" mtid="10019053"><a href="/gui2/?type=authors&mode=browse&sel=10019053" target="_blank">Krammer Olivér (<span class="authorship-author-name">Krammer Olivér</span> <span class="authorAux-mtmt"> Elektronikai technológia</span>) </a> </span> <span class="author-affil"><span title="Budapesti Műszaki és Gazdaságtudományi Egyetem">BME</span>/<span title="Villamosmérnöki és Informatikai Kar">VIK</span>/Elektronikai Technológia Tanszék</span> ;&nbsp;&nbsp;&nbsp; <span class="author-name" mtid="10042094"><a href="/gui2/?type=authors&mode=browse&sel=10042094" target="_blank">Medgyes Bálint (<span class="authorship-author-name">Medgyes Bálint</span> <span class="authorAux-mtmt"> Elektrokémiai migráció, korrózió</span>) </a> </span> <span class="author-affil"><span title="Budapesti Műszaki és Gazdaságtudományi Egyetem">BME</span>/<span title="Villamosmérnöki és Informatikai Kar">VIK</span>/Elektronikai Technológia Tanszék</span> ;&nbsp;&nbsp;&nbsp; <span class="author-name" >Steiner František </span> </div> </div> <div class="title"><a href="/gui2/?mode=browse&params=publication;36307724" target="_blank">Mechanical Strength of Aged Solder Joints: Impact of Plasma Treatment</a></div> <div class="InBook"><div class="chapter-in">In:</div> <div class="authors"> <div class="autype autype-1"> <span class="author-affil">IEEE</span> (szerk.) </div> </div> <div class="booktitle"><a href="/gui2/?mode=browse&params=publication;36293175" target="_blank">2025 International Spring Seminar on Electronics Technology (ISSE) </a></div> <div class="conference"> Konferencia helye, ideje: <span class="location">Budapest, Magyarország <span class="conference-date">2025.05.14. - 2025.05.18.</span> </div> <span class="publishedAt">Piscataway (NJ): <span class="publishers">IEEE</span>, <span class="page"> Paper 11120910. 6 p. </span> <span class="year">(2025)</span> ( <span class="seriesTitle">International Spring Seminar on Electronics Technology ISSE</span> <span class="issn">2161-2528</span> <span class="issn">2161-2536</span> ) </div> <div class="pub-footer"> <span class="language" xmlns="http://www.w3.org/1999/html">Nyelv: Angol | </span> <span class="identifiers"> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="10.1109/ISSE65583.2025.11120910" target="_blank" href="https://doi.org/10.1109/ISSE65583.2025.11120910"> DOI </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="001585293500009" target="_blank" href="https://www.webofscience.com/wos/woscc/full-record/001585293500009"> WoS </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="105015747290" target="_blank" href="http://www.scopus.com/record/display.url?origin=inward&eid=2-s2.0-105015747290"> Scopus </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:black" title="https://ieeexplore.ieee.org/document/11120910/" target="_blank" href="https://ieeexplore.ieee.org/document/11120910/"> Egyéb URL </a> </span> </span> <span class="bookchapter-ids">Befoglaló link(ek):</span> <span class="identifiers"> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="10.1109/ISSE65583.2025" target="_blank" href="https://doi.org/10.1109/ISSE65583.2025"> DOI </a> </span> <span class="id identifier oa_none" title="none"> <span class="isbnOrIssn"> ISBN: </span> <a style="color:blue" title="9798331512163" target="_blank" href="https://www.worldcat.org/search?q=isbn%3A9798331512163"> 9798331512163 </a> </span> <span class="id identifier oa_none" title="none"> <span class="isbnOrIssn"> ISBN: </span> <a style="color:blue" title="9798331512170" target="_blank" href="https://www.worldcat.org/search?q=isbn%3A9798331512170"> 9798331512170 </a> </span> </span> <div class="publication-citation"> <a target="_blank" href="/api/publication?cond=citations.related;eq;36307724&sort=publishedYear,desc&sort=title"> Idézett közlemények száma: 1 </a> </div> <div class="mtid"><span class="long-pub-mtid">Közlemény: 36307724</span> | <span class="status-data status-VALIDATED"> Egyeztetett </span> <span class="long-book-mtid">Befoglaló: 36293175</span> Forrás Idéző | <span class="type-subtype">Könyvrészlet ( Konferenciaközlemény ) </span> | <span class="pub-category">Tudományos</span> | <span class="publication-sourceOfData">WoS-XML</span> </div> <div class="lastModified">Utolsó módosítás: 2026.02.23. 11:07 Balázs András (MTMT Központ, admin) </div> <div class="lockedBy">Központi kezelésű 2026.02.12. 17:02 Mikola Katalin (MTMT 3, admin) </div> </div> </div>