2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

IEEE [szerk.]

Angol nyelvű Konferenciakötet (Könyv) Tudományos

Megjelent: Institute of Electrical and Electronics Engineers (IEEE), Piscataway (NJ), Amerikai Egyesült Államok 2024

Konferencia: 10th IEEE Electronics System-Integration Technology Conference, ESTC 2024 2024-09-11 [Berlin, Németország]

Sorozatok: Electronics System Integration Technology Conference 2687-9700 2687-9727

Azonosítók

MTMT: 35517034
DOI: 10.1109/ESTC60143.2024.10712063
ISBN: 9798350390360
WoS: 001340802800067
Egyéb URL: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85208091538&doi=10.1109%2FESTC60143.2024.10712063&partnerID=40&md5=da9375056bf8c5aa85399ec751d4150c

Fejezetek

Géczy Attila et al. Biodegradable PCBs with PLA/Flax Substrate: FTIR and SEM Analysis of Soil Degradation. (2024) Megjelent: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)
Kuttler Simon et al. Investigation of the influence of shear height in the wire bond shear test. (2024) Megjelent: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)
Nguyen Hoang-Vu et al. Feasibility of Micro-grass on Silicon Cap as An Alternative Antireflective Layer in Vacuum Packaging of Microbolometer Arrays. (2024) Megjelent: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)
Suto Attila et al. Monitoring Cu VIA structures and surrounding dielectric stack after CMP process. (2024) Megjelent: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)
Werft Lukas et al. Comparison of Electrical and Mechanical Properties of Stretchable Circuit Boards. (2024) Megjelent: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)
Wu Yongbo et al. Simulation Analysis on Thermal Performance of a Lidless Fan-out Package. (2024) Megjelent: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)
Bakonyi Antal et al. Energy-Based Approach on Calculating Stand-Off Height of Different Solder Joints. (2024) Megjelent: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) pp. 1-5
Burcea I.M. et al. Reliable Fabrication Methodology for Consistent Supercapacitor Performance. (2024) Megjelent: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) pp. 1-5
Rimbock Johanna et al. Advanced Ultrathin Spray Coating Process Technology for Heterogeneous Integration Applications. (2024) Megjelent: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) pp. 1-9
Straubinger Daniel et al. Additively Manufactured Flexible Electronics with Selectively Soldered Surface-mounted Devices Utilising StarJet Technology. (2024) Megjelent: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) pp. 1-5

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2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

IEEE [szerk.]

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