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            Export Date: 22 December 2023            
            Correspondence Address: Pohl, L.; Budapest University of Technology and Economics Megyetem, Hungary; email: pohl.laszlo@vik.bme.hu</comment>
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          <label>3. Pohl, L., Kollar, E., Extension of the SUNRED algorithm for electrothermal simulation and its application in failure analysis of large area (organic) semiconductor devices (2011) Proc. THERMINIC11, pp. 195-200. , ISBN:978-1-4577-0778-0</label>
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          <label>4. Pohl, L., Ur, S., Mizsei, J., Thermoelectrical modelling and simulation of devices based on VO2 (2017) MICROEL. RELIAB, 79, pp. 387-394</label>
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          <label>5. Nemeth, M., Poppe, A., Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment (2018) Periodica Polytechnica EE, 62 (1), pp. 1-15</label>
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          <label>6. Codecasa, L., Dalessandro, V., Magnani, A., Rinaldi, N., Zampardi, P.J., FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC) (2014) Proc IEEE THERMINIC</label>
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          <published>false</published>
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          <label>7. C++ Source Code of the HexMG Simulator, , https://github.com/LaszloPohl/HexMG-Core/, Accessed on 30.07.2023</label>
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          <label>8. The Spice Page, , http://bwrcs.eecs.berkeley.edu/Classes/IcBook/SPICE/, Accessed on 30.07.2023</label>
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          <label>9. Szekely, V., Accurate calculation of device heat dynamics: A special feature of the TRANZ-TRAN circuit analysis program (1973) Electronics Letters, 9 (6), pp. 132-134</label>
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          <label>10. Elwakil, A.S., Explaining hysteresis in electronic circuits (2006) International Journal of Electrical Engineering &amp; Education, 43 (3), pp. 252-260</label>
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          <label>11. Sivanandam, S.N., Janaki Meena, M., (2009) Theory of Computation, , I.K. International Publishing House Pvt. Limited, ISBN: 9789380026206</label>
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          <label>12. Trottenberg, U., Oosterlee, C.W., Schöller, A., (2001) Multigrid, , Academic Press London, ISBN: 9780127010700</label>
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          <label>13. Szekely, V., Poppe, A., Rencz, M., Algorithmic extension of thermal field solvers: Time constant analysis (2000) Proc. 16th IEEE SemiTherm, pp. 99-106. , San Jose, CA, USA Mar. 23</label>
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          <label>14. Abdulrazzaq, A.K., Bognar, Gy., Plesz, B., Combined electro-Thermal model for PV panels (2021) Pollack Periodica, 16 (1), pp. 7-13</label>
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&lt;div class=&quot;lastModified&quot;&gt;Last Modified: 2024.01.02. 15:12 Balázs Plesz (Mikroelektronika, napelemek)
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	&lt;pre class=&quot;comment&quot; style=&quot;margin-top: 0; margin-bottom: 0;&quot;&gt;&lt;u&gt;Comments&lt;/u&gt;: Conference code: 194796            
            Export Date: 22 December 2023            
            Correspondence Address: Pohl, L.; Budapest University of Technology and Economics Megyetem, Hungary; email: pohl.laszlo@vik.bme.hu&lt;/pre&gt;
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