https://m2.mtmt.hu/ hun 2026-05-25 09:29 BookChapter 34448276 APPROVED true Conference code: 194796 Export Date: 22 December 2023 Correspondence Address: D vid De k, E.; Budapest University of Technology and Economics, Hungary; email: kaed.david@edu.bme.hu Funding Agency and Grant Number: Ministry of Culture and Innovation of Hungary from the National Research, Development and Innovation Fund [TKP2021-NVA-02]; Infineon Technologies Austria AG through the Important Project of Common European Interest (IPCEI) on Microelectronics program [TKP2021-NVA] Funding text: This research is party founded by TKP2021-NVA-02 project implemented with the support provided by the Ministry of Culture and Innovation of Hungary from the National Research, Development and Innovation Fund, financed under the TKP2021-NVA funding scheme.; The work is sponsored by the PhD scholarship program of Infineon Technologies Austria AG through the Important Project of Common European Interest (IPCEI) on Microelectronics program. 0 false 2026-05-23T11:04:21.532+0000 2024-03-14T14:51:27.482+0000 2023-12-22T09:21:13.234+0000 true 10071696 Andódy Katalin /api/admin/10071696 Admin Andódy Katalin (BME admin5) true 2024-03-14T14:51:38.378+0000 2024-03-14T14:51:38.378+0000 true false true 25 25 /api/publicationtype/25 PublicationType Könyvrészlet 2 true 25 BookChapter true 10000312 Conference paper true 25 25 /api/publicationtype/25 PublicationType Könyvrészlet 2 true 25 BookChapter /api/subtype/10000312 Konferenciaközlemény SubType Konferenciaközlemény (Könyvrészlet) 228 true 10000312 true 1 /api/category/1 Category Tudományos true 1 Deák, E. Dávid 10325870 10325870 4 2023 As the application of micro-electromechanical systems (MEMS) in today's sensors and actuators have become common, there are still many open questions in terms of analytical analysis, which is related to their operation in multiple physical domains. Beside the numerical analysis it is essential to have a precise view of their behaviour which is required to derive system level models in the later phases of the design process to perform design of experiment (DoE) analysis as well. In this paper the out of plane displacement of bimaterial microbeams is investigated which are the parts of a larger MEMS, designed to use for Kelvin probe measurements. The analytical formula for maximal displacement is derived from the well-known expression using the different coefficients of thermal expansions (CTEs) when a beam composed of two materials is heated. The derived formula is compared to numerical simulation, where an empirical scaling factor is introduced to compensate the inaccuracies. The material and geometry dependence of this scale factor were also investigated and presented in this article. © 2023 IEEE. 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Gad-El-Hak, M., (2001) The MEMS Handbook, , CRC Press Sep 27 1 false true Reference 48208879 /api/reference/48208879 2. Geng, H., Internet of Things and Data Analytics Handbook", John, , Wiley & Sons23 December 2016 2 false true Reference 48208880 /api/reference/48208880 3. Singamaneni, S., Lemieux, M., Lang, H., Gerber, C., Lam, Y., Zauscher, S., Datskos, P., Tsukruk, V., Bimaterial Microcantilevers as a Hybrid Sensing Platform Advanced Materials John, 20, pp. 653-680. , https://doi.org/10.1002/adma.200701667, Wiley & Sons 2008 3 false true Reference 48208881 /api/reference/48208881 4. Alodhayb, A., (2019) Modeling of An Optically Heated MEMS-Based Micromechanical Bimaterial Sensor for Heat Capacitance Measurements of Single Biological Cells. Sensors", Sensors, MDPI, 30 (201), p. 215. , Dec 4 false true Reference 48208882 /api/reference/48208882 5. Wei, L., You, Z., Kuai, X., MEMS thermal-piezoresistive resonators, thermal-piezoresistive oscillators, and sensors Microsyst Technologies, 29 (1-17), p. 2023. , https://doi.org/10.1007/s00542-022-05391-9 5 false true Reference 48208883 /api/reference/48208883 6. Torres, D., Dooley, S., Starman, L.A., Large Out-of-Plane Deflection MEMS Actuators for Optical Applications (2018) EUROSENSORS 2018, 2 (13), p. 1072. , https://doi.org/10.3390/proceedings2131072 6 false true Reference 48208884 /api/reference/48208884 7. Mizsei, J., (2000) Surface Potential Mapping: Comparison of the Vibrating Capacitor and the SPV Method", Solid-State Electronics, 44:(3), Pp, pp. 509-513. , https://doi.org/10.1016/S0038-1101(99)00264-6 7 false true Reference 48208885 /api/reference/48208885 8. Kiss, G., Varhegyi, E.B., Mizsei, J., Krafcsik, O.H., Kovacs, K., Negyesi, G., Ostrick, B., Reti, F., Examination of the CO/Pt/Cu layer structure with Kelvin probe and XPS analysis (2000) Sensors and Actuators B: Chemical, 68:(1-3), pp. 240-243. , https://doi.org/10.1016/S0925-4005(00)00435-4 8 false true Reference 48208886 /api/reference/48208886 9. Lavrennko, T., Marzinzig, K., Walter, T., Plesz, B., Ress, S., On the application of the vibrating Kelvin probe method for quality control of Cu(In, Ga)(Se, S)2 thin-film solar modules (2016) Progress in Photovoltaics: Research and Applications, 24 (12), pp. 1554-1565 9 false true Reference 48208887 /api/reference/48208887 10. David Deak, E., Plesz, B., Szabo, P.G., Design and simulation of a resonant thermomechanic actuator for large displacements (2023) DTIP?2023, Valetta, Malta, pp. 1-4. , in press 10 false true Reference 48208888 /api/reference/48208888 11. Timoshenko, S., Analysis of Bi-Metal Thermostats Journal of the Optical Society of America, 11 (3), p. 233. , https://doi.org/10.1364/josa.11.000233, The Optical Society 1925 11 false true Reference 48208889 /api/reference/48208889 12. www.comsol.com, COMSOL Multiphysics® v. 5.5. COMSOL AB, Stockholm, SwedenUR:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85179623832&doi=10.1109%2fTHERMINIC60375.2023.10325870&partnerID=40&md5=4deb97fbae367032440250ea5083907e 12 false true /api/publication/34448276 Deák E. Dávid et al. Investigation of Thermal Design Issues of a Bimaterial MEMS. (2023) Megjelent: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)<div class="BookChapter Publication long-list"> <div class="authors"> <img title="Forrásközlemény" style="float: left" src="/frontend/resources/grid/publication-core-icon.png"> <img title="Idézőközlemény" style="float: left" src="/frontend/resources/grid/publication-citation-icon.png"> <div class="autype autype0"> <span class="author-name" mtid="10085051"><a href="/gui2/?type=authors&mode=browse&sel=10085051" target="_blank">Deák E. Dávid (<span class="authorship-author-name">Deák Elemér Dávid</span> <span class="authorAux-mtmt"> Elektronikus eszközök és MEMS tervezés</span>) </a> </span> <span class="author-affil"><span title="Budapesti Műszaki és Gazdaságtudományi Egyetem">BME</span>/<span title="Villamosmérnöki és Informatikai Kar">VIK</span>/Elektronikus Eszközök Tanszéke</span> ;&nbsp;&nbsp;&nbsp; <span class="author-name" mtid="10041205"><a href="/gui2/?type=authors&mode=browse&sel=10041205" target="_blank">Plesz Balázs (<span class="authorship-author-name">Plesz Balázs</span> <span class="authorAux-mtmt"> Mikroelektronika, napelemek</span>) </a> </span> <span class="author-affil"><span title="Budapesti Műszaki és Gazdaságtudományi Egyetem">BME</span>/<span title="Villamosmérnöki és Informatikai Kar">VIK</span>/Elektronikus Eszközök Tanszéke</span> ;&nbsp;&nbsp;&nbsp; <span class="author-name" mtid="10041842"><a href="/gui2/?type=authors&mode=browse&sel=10041842" target="_blank">Szabó Péter G. (<span class="authorship-author-name">Szabó Péter Gábor</span> <span class="authorAux-mtmt"> Elektronikus eszközök</span>) </a> </span> <span class="author-affil"><span title="Budapesti Műszaki és Gazdaságtudományi Egyetem">BME</span>/<span title="Villamosmérnöki és Informatikai Kar">VIK</span>/Elektronikus Eszközök Tanszéke</span> </div> </div> <div class="title"><a href="/gui2/?mode=browse&params=publication;34448276" target="_blank">Investigation of Thermal Design Issues of a Bimaterial MEMS</a></div> <div class="InBook"><div class="chapter-in">In:</div> <div class="authors"> <div class="autype autype-1"> <span class="author-name" mtid="10001242"><a href="/gui2/?type=authors&mode=browse&sel=10001242" target="_blank">Poppe András (<span class="authorship-author-name">Poppe András</span> <span class="authorAux-mtmt"> Mikroelektronika</span>) </a> </span> <span class="author-affil"><span title="Budapesti Műszaki és Gazdaságtudományi Egyetem">BME</span>/<span title="Villamosmérnöki és Informatikai Kar">VIK</span>/Elektronikus Eszközök Tanszéke</span> (szerk.) </div> </div> <div class="booktitle"><a href="/gui2/?mode=browse&params=publication;34401813" target="_blank">Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23) </a></div> <div class="conference"> Konferencia helye, ideje: <span class="location">Budapest, Magyarország <span class="conference-date">2023.09.27. - 2023.09.29.</span> </div> <span class="publishedAt">Budapest: <span class="publishers">Institute of Electrical and Electronics Engineers (IEEE)</span>, <span class="page"> Paper 10325870. 4 p. </span> <span class="year">(2023)</span> </div> <div class="pub-footer"> <span class="language" xmlns="http://www.w3.org/1999/html">Nyelv: Angol | </span> <span class="identifiers"> <span class="id identifier oa_none" title="none"> <a style="color:black" title="10.1109/THERMINIC60375.2023.10325870" target="_blank" href="https://doi.org/10.1109/THERMINIC60375.2023.10325870"> DOI </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="10325870" target="_blank" href="http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=10325870"> IEEE Xplore </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="001108606800013" target="_blank" href="https://www.webofscience.com/wos/woscc/full-record/001108606800013"> WoS </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:black" title="85179623832" target="_blank" href="http://www.scopus.com/record/display.url?origin=inward&eid=2-s2.0-85179623832"> Scopus </a> </span> </span> <span class="bookchapter-ids">Befoglaló link(ek):</span> <span class="identifiers"> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="10.1109/THERMINIC60375.2023.10325898" target="_blank" href="https://doi.org/10.1109/THERMINIC60375.2023.10325898"> DOI </a> </span> <span class="id identifier oa_none" title="none"> <span class="isbnOrIssn"> ISBN: </span> <a style="color:black" title="9798350318623" target="_blank" href="https://www.worldcat.org/search?q=isbn%3A9798350318623"> 9798350318623 </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="10325898" target="_blank" href="http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=10325898"> IEEE Xplore </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:black" title="https://ieeexplore.ieee.org/document/10325898" target="_blank" href="https://ieeexplore.ieee.org/document/10325898"> Egyéb URL </a> </span> </span> <div class="publication-citation"> <a target="_blank" href="/api/publication?cond=citations.related;eq;34448276&sort=publishedYear,desc&sort=title"> Idézett közlemények száma: 3 </a> </div> <div class="mtid"><span class="long-pub-mtid">Közlemény: 34448276</span> | <span class="status-data status-APPROVED"> Nyilvános </span> <span class="long-book-mtid">Befoglaló: 34401813</span> Forrás Idéző | <span class="type-subtype">Könyvrészlet ( Konferenciaközlemény ) </span> | <span class="pub-category">Tudományos</span> | <span class="publication-sourceOfData">Scopus</span> </div> <div class="funder"> (TKP2021-NVA-02) Támogató: NKFIH </div> <div class="lastModified">Utolsó módosítás: 2024.03.14. 15:51 Szatmári Erika (BME admin4) </div> <pre class="comment" style="margin-top: 0; margin-bottom: 0;"><u>Megjegyzés</u>: Conference code: 194796 Export Date: 22 December 2023 Correspondence Address: D vid De k, E.; Budapest University of Technology and Economics, Hungary; email: kaed.david@edu.bme.hu Funding Agency and Grant Number: Ministry of Culture and Innovation of Hungary from the National Research, Development and Innovation Fund [TKP2021-NVA-02]; Infineon Te...</pre> </div> </div>