SPICE Modeling of Insulator-Metal Transition Devices with Hysteresis

https://m2.mtmt.hu/ eng 2026-05-25 00:59 BookChapter 34448274 VALIDATED true Conference code: 194796 Export Date: 22 December 2023 Correspondence Address: Darwish, M.; Budapest University of Technology and Economics, Hungary; email: darwishm@edu.bme.hu 0 false 2026-05-23T11:04:36.695+0000 2024-01-02T18:10:47.078+0000 2023-12-22T09:21:06.199+0000 true 10071696 Andódy Katalin /api/admin/10071696 Admin Katalin Andódy (BME admin5) true 2024-03-14T14:42:52.462+0000 2023-12-22T12:32:39.676+0000 true 10071696 Andódy Katalin /api/admin/10071696 Admin Katalin Andódy (BME admin5) true 2024-02-20T05:34:41.559+0000 true 521 Szuper Admin /api/admin/521 Admin Admin Szuper (admin) true true false true 25 25 /api/publicationtype/25 PublicationType Chapter in Book 2 true 25 BookChapter true 10000312 Conference paper true 25 25 /api/publicationtype/25 PublicationType Chapter in Book 2 true 25 BookChapter /api/subtype/10000312 Konferenciaközlemény SubType Conference paper (Chapter in Book) 228 true 10000312 true 1 /api/category/1 Category Scientific true 1 Darwish, M. SPICE Modeling of Insulator-Metal Transition Devices with Hysteresis 10325868 10325868 5 2023 A New SPICE model for insulator-metal transition (IMT) devices is presented in this paper. The combined influences of the electric field and Joule heating are considered, allowing a transition from the high-resistance monoclinic phase to the low-resistance metallic one. Hysteresis, observed in specific IMT materials such as vanadium dioxide, is effectively addressed. The model's accuracy was validated using experimental results and electro-thermal FVM simulations. It has been implemented in VHDL-AMS, ensuring its compatibility with SPICE simulators like Xpedition AMS and PartQuest Explore, which were employed in this research. The model characterizes three specific device states, heating, cooling, and equilibrium. Transition dynamics between these states are tied to historical temperature data, represented as the device's temperature time derivative. To our knowledge, this model is the first IMT compact model that addresses hysteresis and is the first VHDL-AMS for IMT devices. With this development, circuit designers are provided with tools to fully explore the potential of VO2 and similar IMT devices to design and realize next-generation electrical circuits. © 2023 IEEE. true false 2023 false true true true true false NONE 2026-05-23 false 2 0 2 2 1 2 2 1 1 1 1 1 1 2 0 0 2 2 2 2 0 2 2 Folyóiratcikk Journal Article 24 2 Könyvrészlet Chapter in Book 25 0 Könyv Book 23 0 Egyéb konferenciaközlemény Conference paper 31 0 Egyéb konferenciakötet Conference proceedings 32 0 Oltalmi formák Protection forms 26 0 Disszertáció Thesis 28 0 Egyéb Miscellaneous 29 0 Alkotás Achievement 22 0 Kutatási adat Research data 33 0 Folyóiratcikk Journal Article 24 0 0 0 Könyvrészlet Chapter in Book 25 0 0 0 Könyv Book 23 0 0 0 Egyéb konferenciaközlemény Conference paper 31 0 0 0 Egyéb konferenciakötet Conference proceedings 32 0 0 0 Oltalmi formák Protection forms 26 0 0 0 Disszertáció Thesis 28 0 0 0 Egyéb Miscellaneous 29 0 0 0 Alkotás Achievement 22 0 0 0 Kutatási adat Research data 33 0 0 0 2024 0 1 1 1 1 2025 0 1 1 1 1 false false false false 2023-12-21T12:32:39.430+0000 Elektronikus Eszközök Tanszéke (BME / VIK) 2 4 1 2 0 true true 10002 English /api/language/10002 Angol Language English true 2 false true 10003 true 10001 /api/country/10001 Country Hungary true 1 /api/city/10003 City Bp, Hungary true 10005024 true 25009370 DIFFERENT /api/publicationidentifier/25009370 https://doi.org/10.1109/THERMINIC60375.2023.10325898 10.1109/THERMINIC60375.2023.10325898 PublicationIdentifier DOI: 10.1109/THERMINIC60375.2023.10325898 true 6 DOI https://doi.org/@@@ /api/publicationsource/6 DOI PlainSource DOI true true 10001 /api/publicationsourcetype/10001 PublicationSourceType DOI true true 6 true false true 25011880 /api/publicationidentifier/25011880 https://www.worldcat.org/search?q=isbn%3A9798350318623 9798350318623 PublicationIdentifier ISBN: 9798350318623 true 122 ISBN https://www.worldcat.org/search?q=isbn%3A@@@ /api/publicationsource/122 ISBN PlainSource ISBN true true 10002 /api/publicationsourcetype/10002 PublicationSourceType Egyéb true false 122 true false true 25009369 DIFFERENT /api/publicationidentifier/25009369 http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=10325898 10325898 PublicationIdentifier IEEE Xplore: 10325898 true 22 http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=@@@ /api/publicationsource/22 IEEE Xplore PlainSource IEEE Xplore true true 10004 /api/publicationsourcetype/10004 PublicationSourceType Kiadói adatbázis true false 22 true false true 25136202 /api/publicationidentifier/25136202 https://ieeexplore.ieee.org/document/10325898 https://ieeexplore.ieee.org/document/10325898 PublicationIdentifier Other URL: https://ieeexplore.ieee.org/document/10325898 true 40 Other URL @@@ /api/publicationsource/40 Egyéb URL PlainSource Other URL true true 10006 /api/publicationsourcetype/10006 PublicationSourceType Link true true 40 true false /api/publication/34401813 Poppe András. Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23). (2023) ISBN:9798350318623 true true 23 23 /api/publicationtype/23 PublicationType Book 3 true 23 Book Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23) false true 34401813 true SUSPECT false true true true 10000144 Conference proceedings true 23 23 /api/publicationtype/23 PublicationType Book 3 true 23 Book /api/subtype/10000144 Konferenciakötet SubType Conference proceedings (Book) 345 true 10000144 false Book 2023 true 1 /api/category/1 Category Scientific true 1 false Language 10002 /api/language/10002 English Angol English true 2 true PersonAuthorship 113402319 /api/authorship/113402319 Darwish, M. ✉ [Darwish, Mahmoud Ibrahim Azmi (villamosmérnöki t...), author] Department of Electron Devices (BUTE / FEEI) 1 0.5 true false true Author 10065089 /api/author/10065089 Mahmoud Ibrahim Azmi Darwish (villamosmérnöki tudományok) Darwish Mahmoud Ibrahim Azmi true 10065089 true Darwish M. true false false AuthorshipType 1 /api/authorshiptype/1 Author 0 true 0 true false true PersonAuthorship 113402320 /api/authorship/113402320 Pohl, L. [Pohl, László (mikroelektronika), author] Department of Electron Devices (BUTE / FEEI) 2 0.5 false true false Author 10041061 /api/author/10041061 László Pohl (mikroelektronika) Pohl László true 10041061 true Pohl L. true false false AuthorshipType 1 /api/authorshiptype/1 Author 0 true 0 true false true PublicationIdentifier 25135795 /api/publicationidentifier/25135795 DOI: 10.1109/THERMINIC60375.2023.10325868 PlainSource 6 /api/publicationsource/6 DOI PublicationSourceType 10001 /api/publicationsourcetype/10001 DOI true true true DOI DOI https://doi.org/@@@ true true 6 true IDENTICAL 10.1109/THERMINIC60375.2023.10325868 https://doi.org/10.1109/THERMINIC60375.2023.10325868 false true PublicationIdentifier 25009386 /api/publicationidentifier/25009386 IEEE Xplore: 10325868 PlainSource 22 /api/publicationsource/22 IEEE Xplore PublicationSourceType 10004 /api/publicationsourcetype/10004 Kiadói adatbázis false true true IEEE Xplore http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=@@@ true true 22 true DIFFERENT 10325868 http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=10325868 false true PublicationIdentifier 25204287 /api/publicationidentifier/25204287 WoS: 001108606800011 PlainSource 1 /api/publicationsource/1 WoS PublicationSourceType 10003 /api/publicationsourcetype/10003 Indexelő adatbázis false true true WoS WoS https://www.webofscience.com/wos/woscc/full-record/@@@ true true 1 true IDENTICAL 001108606800011 https://www.webofscience.com/wos/woscc/full-record/001108606800011 true true PublicationIdentifier 25135794 /api/publicationidentifier/25135794 Scopus: 85179625163 PlainSource 3 /api/publicationsource/3 Scopus PublicationSourceType 10003 /api/publicationsourcetype/10003 Indexelő adatbázis false true true Scopus Scopus http://www.scopus.com/record/display.url?origin=inward&eid=2-s2.0-@@@ true true 3 true IDENTICAL 85179625163 http://www.scopus.com/record/display.url?origin=inward&eid=2-s2.0-85179625163 false true Classification 10807 /api/classification/10807 ENGINEERING AND TECHNOLOGY true true Keyword 1035520 /api/keyword/1035520 hysteresis true 1035520 true Keyword 1054375 /api/keyword/1054375 Electric fields true 1054375 true Keyword 1124182 /api/keyword/1124182 Semiconductor insulator boundaries true 1124182 true Keyword 1124184 /api/keyword/1124184 Metal insulator boundaries true 1124184 true Keyword 1136477 /api/keyword/1136477 Metal insulator transition true 1136477 true Keyword 1161282 /api/keyword/1161282 IMT true 1161282 true Keyword 1180644 /api/keyword/1180644 spice true 1180644 true Keyword 1180644 /api/keyword/1180644 spice true 1180644 true Keyword 1317705 /api/keyword/1317705 Compact model true 1317705 true Keyword 1317705 /api/keyword/1317705 Compact model true 1317705 true Keyword 1415078 /api/keyword/1415078 VO2 true 1415078 true Keyword 1662206 /api/keyword/1662206 insulator-metal transition true true Keyword 1740454 /api/keyword/1740454 monoclinic phase true true Keyword 1810682 /api/keyword/1810682 vanadium dioxide true true Keyword 2303844 /api/keyword/2303844 'spice' true true Keyword 2593078 /api/keyword/2593078 Low resistance true true Keyword 2604267 /api/keyword/2604267 Joules heating true true Keyword 2659535 /api/keyword/2659535 High resistance true true Keyword 3127145 /api/keyword/3127145 Insulator metal transition true true Keyword 3266576 /api/keyword/3266576 VHDL-AMS true true Keyword 3266576 /api/keyword/3266576 VHDL-AMS true true Keyword 3266577 /api/keyword/3266577 SPICE modeling true true Reference 48208840 /api/reference/48208840 1. 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(2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)<div class="BookChapter Publication long-list"> <div class="authors"> <img title="Forrásközlemény" style="float: left" src="/frontend/resources/grid/publication-core-icon.png"> <img title="Idézőközlemény" style="float: left" src="/frontend/resources/grid/publication-citation-icon.png"> <div class="autype autype0"> <span class="author-name" mtid="10065089"><a href="/gui2/?type=authors&mode=browse&sel=10065089" target="_blank">Darwish M. ✉ (<span class="authorship-author-name">Darwish Mahmoud Ibrahim Azmi</span> <span class="authorAux-mtmt"> villamosmérnöki tudományok</span>) </a> </span> <span class="author-affil"><span title="Budapest University of Technology and Economics">BUTE</span>/<span title="Faculty of Electrical Engineering and Informatics">FEEI</span>/Department of Electron Devices</span> ;    <span class="author-name" mtid="10041061"><a href="/gui2/?type=authors&mode=browse&sel=10041061" target="_blank">Pohl L. (<span class="authorship-author-name">Pohl László</span> <span class="authorAux-mtmt"> mikroelektronika</span>) </a> </span> <span class="author-affil"><span title="Budapest University of Technology and Economics">BUTE</span>/<span title="Faculty of Electrical Engineering and Informatics">FEEI</span>/Department of Electron Devices</span> </div> </div> <div class="title"><a href="/gui2/?mode=browse&params=publication;34448274" target="_blank">SPICE Modeling of Insulator-Metal Transition Devices with Hysteresis</a></div> <div class="InBook"><div class="chapter-in">In:</div> <div class="authors"> <div class="autype autype-1"> <span class="author-name" mtid="10001242"><a href="/gui2/?type=authors&mode=browse&sel=10001242" target="_blank">Poppe András (<span class="authorship-author-name">Poppe András</span> <span class="authorAux-mtmt"> Mikroelektronika</span>) </a> </span> <span class="author-affil"><span title="Budapest University of Technology and Economics">BUTE</span>/<span title="Faculty of Electrical Engineering and Informatics">FEEI</span>/Department of Electron Devices</span> (eds.) </div> </div> <div class="booktitle"><a href="/gui2/?mode=browse&params=publication;34401813" target="_blank">Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23) </a></div> <div class="conference"> Conference: <span class="location">Bp, Hungary <span class="conference-date">2023.09.27. - 2023.09.29.</span> </div> <span class="publishedAt">Bp: <span class="publishers">IEEE</span>, <span class="page"> Paper 10325868. 5 p. </span> <span class="year">(2023)</span> </div> <div class="pub-footer"> <span class="language" xmlns="http://www.w3.org/1999/html">Language: English | </span> <span class="identifiers"> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="10.1109/THERMINIC60375.2023.10325868" target="_blank" href="https://doi.org/10.1109/THERMINIC60375.2023.10325868"> DOI </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="10325868" target="_blank" href="http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=10325868"> IEEE Xplore </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="001108606800011" target="_blank" href="https://www.webofscience.com/wos/woscc/full-record/001108606800011"> WoS </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="85179625163" target="_blank" href="http://www.scopus.com/record/display.url?origin=inward&eid=2-s2.0-85179625163"> Scopus </a> </span> </span> <span class="bookchapter-ids">Book link(s):</span> <span class="identifiers"> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="10.1109/THERMINIC60375.2023.10325898" target="_blank" href="https://doi.org/10.1109/THERMINIC60375.2023.10325898"> DOI </a> </span> <span class="id identifier oa_none" title="none"> <span class="isbnOrIssn"> ISBN: </span> <a style="color:black" title="9798350318623" target="_blank" href="https://www.worldcat.org/search?q=isbn%3A9798350318623"> 9798350318623 </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="10325898" target="_blank" href="http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=10325898"> IEEE Xplore </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:black" title="https://ieeexplore.ieee.org/document/10325898" target="_blank" href="https://ieeexplore.ieee.org/document/10325898"> Other URL </a> </span> </span> <div class="publication-citation" style="margin-left: 0.5cm;"> <span title="" class="citingPub-count">Citing papers: 2</span> | Independent citation: 2 | Self citation: 0 | Unknown citation: 0 | Number of citations in WoS: 1 | Number of citations in Scopus: 1 | WoS/Scopus assigned: 1 | Number of citations with DOI: 2 </div> <div class="publication-citation"> <a target="_blank" href="/api/publication?cond=citations.related;eq;34448274&sort=publishedYear,desc&sort=title"> Number of cited publications: 2 </a> </div> <div class="mtid"><span class="long-pub-mtid">Publication: 34448274</span> | <span class="status-data status-VALIDATED"> Validated </span> <span class="long-book-mtid">Book: 34401813</span> Core Citing | <span class="type-subtype">Chapter in Book ( Conference paper ) </span> | <span class="pub-category">Scientific</span> | <span class="publication-sourceOfData">Scopus</span> </div> <div class="lastModified">Last Modified: 2024.01.02. 19:10 László Pohl (mikroelektronika) </div> <pre class="comment" style="margin-top: 0; margin-bottom: 0;"><u>Comments</u>: Conference code: 194796 Export Date: 22 December 2023 Correspondence Address: Darwish, M.; Budapest University of Technology and Economics, Hungary; email: darwishm@edu.bme.hu</pre> </div> </div>