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Performance Analysis of Stacked Photovoltaic-Thermoelectric Generator Using Mathematical Thermal-Electrical Model. 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Boundary Condition Independent Compact Thermal Models Enhanced by Contour Elements. 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Structure Curve Representation of Dynamic Thermal Multi-Ports. 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SPICE Modeling of Insulator-Metal Transition Devices with Hysteresis. 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Dávid et al. Investigation of Thermal Design Issues of a Bimaterial MEMS. 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Automated peak detection for analysis of error propagations and validation of structure functions in reliability tests of LED systems. 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Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO2composite solder paste. 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Thermal Behavior of Crystalline Silicon Bottom Cell in a Monolithic Perovskite/Si Tandem Solar Cells. 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Design of power cycling for reliability testing of LED systems: Numerical and analytical approach. 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The Minimal Set of IVL Measurements to Characterize Power LED Chips. 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CFD Modelling of the Heat Transfer of Photovoltaic Modules. 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HexMG: A Circuit-Model Based Finite Multi-Domain Simulator. 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An Automated Method for Creating Compact Dynamic Thermal Models for In-situ Prognostics of Power Electronics and Power LED Packages. 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Thermal Transient Tests with Programmed Powering on Wide Bandgap Power Devices of Non-Monotonous and Time-Variant Characteristics. 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Impact of LED Temperature on the Performance of LiFi Optical Wireless Communication Links. 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Transient thermal analysis for VCSEL Diodes. 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Thermal Test Vehicle for HPC – System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution. 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Applicability of JESD51-14 to clip-bonded, discrete power devices. 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On the importance of Fast and Accurate LED Optical and Thermal Characterization: from visible use cases to UV technologies. 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Accuracy Comparison of T3ster-Master and Optimization-based Network Identification. 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Tridiagonal Approaches for Network Identification by Deconvolution. 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Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23). (2023) ISBN:9798350318623<div class="Book Publication long-list"> <div class="authors"> <img title="Forrásközlemény" style="float: left" src="/frontend/resources/grid/publication-core-icon.png"> <div class="autype autype-1"> Editor: <span class="author-name" mtid="10001242"><a href="/gui2/?type=authors&mode=browse&sel=10001242" target="_blank">Poppe András (<span class="authorship-author-name">Poppe András</span> <span class="authorAux-mtmt"> Mikroelektronika</span>) </a> </span> <span class="author-affil"><span title="Budapest University of Technology and Economics">BUTE</span>/<span title="Faculty of Electrical Engineering and Informatics">FEEI</span>/Department of Electron Devices</span> </div> </div> <div class="title"><a href="/gui2/?mode=browse&params=publication;34401813" target="_blank">Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)</a></div><div class="conference"> Conference: <span class="location">Bp, Hungary <span class="conference-date">2023.09.27. - 2023.09.29.</span> </div><div class="publish-data"> <span class="published-at"> Bp</span>: <span class="publishers">IEEE</span>, <span class="year">(2023)</span> </div> <span class="volume"> <span class="volumeTitle"></span> </span> <div class="pub-footer"> <span class="language" xmlns="http://www.w3.org/1999/html">Language: English | </span> <span class="identifiers"> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="10.1109/THERMINIC60375.2023.10325898" target="_blank" href="https://doi.org/10.1109/THERMINIC60375.2023.10325898"> DOI </a> </span> <span class="id identifier oa_none" title="none"> <span class="isbnOrIssn"> ISBN: </span> <a style="color:black" title="9798350318623" target="_blank" href="https://www.worldcat.org/search?q=isbn%3A9798350318623"> 9798350318623 </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="10325898" target="_blank" href="http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=10325898"> IEEE Xplore </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:black" title="https://ieeexplore.ieee.org/document/10325898" target="_blank" href="https://ieeexplore.ieee.org/document/10325898"> Other URL </a> </span> </span> <div class="mtid"><span class="long-pub-mtid">Publication: 34401813</span> | <span class="status-data status-APPROVED"> Published </span> Core | <span class="type-subtype">Book ( Conference proceedings ) </span> | <span class="pub-category">Scientific</span> | <span class="publication-sourceOfData">Scopus</span> </div> <div class="lastModified">Last Modified: 2024.06.05. 08:40 Zsuzsa Aggod (MTMT 2-3, admin) </div> <div class="chapters"> <b><a target="_blank" href="/api/publication?from=BookChapter&cond=book.mtid;eq;34401813">Chapters: 22</a></b> </div> </div></div>