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Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Poppe, András [Poppe, András (Mikroelektronika), ed.] Department of Electron Devices (BUTE / FEEI)
English Conference proceedings (Book) Scientific
Published: IEEE, Bp, Hungary
2023
Conference:
29th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2023 2023-09-27 [Bp, Hungary]
Identifiers
MTMT: 34401813
DOI:
10.1109/THERMINIC60375.2023.10325898
ISBN:
9798350318623
IEEE Xplore:
10325898
Other URL:
https://ieeexplore.ieee.org/document/10325898
Chapters
Alnahhal A.I. et al. Performance Analysis of Stacked Photovoltaic-Thermoelectric Generator Using Mathematical Thermal-Electrical Model. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Codecasa Lorenzo et al. Boundary Condition Independent Compact Thermal Models Enhanced by Contour Elements. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Codecasa Lorenzo et al. Structure Curve Representation of Dynamic Thermal Multi-Ports. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Darwish M. et al. SPICE Modeling of Insulator-Metal Transition Devices with Hysteresis. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Deák E. Dávid et al. Investigation of Thermal Design Issues of a Bimaterial MEMS. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Fischer Sandra et al. Automated peak detection for analysis of error propagations and validation of structure functions in reliability tests of LED systems. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Gorecki P. et al. Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO2composite solder paste. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Halal A. et al. Thermal Behavior of Crystalline Silicon Bottom Cell in a Monolithic Perovskite/Si Tandem Solar Cells. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Mitterhuber Lisa et al. Design of power cycling for reliability testing of LED systems: Numerical and analytical approach. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Nemeth M. et al. The Minimal Set of IVL Measurements to Characterize Power LED Chips. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Palovics P. et al. CFD Modelling of the Heat Transfer of Photovoltaic Modules. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Pohl L.. HexMG: A Circuit-Model Based Finite Multi-Domain Simulator. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Poppe A. et al. An Automated Method for Creating Compact Dynamic Thermal Models for In-situ Prognostics of Power Electronics and Power LED Packages. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Ress S. et al. Thermal Transient Tests with Programmed Powering on Wide Bandgap Power Devices of Non-Monotonous and Time-Variant Characteristics. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Romero Diego R. et al. Impact of LED Temperature on the Performance of LiFi Optical Wireless Communication Links. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Schmid Maximilian et al. Transient thermal analysis for VCSEL Diodes. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Szoke Szilard et al. Applicability of JESD51-14 to clip-bonded, discrete power devices. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Szomor Zsombor et al. 3D Finite Element Modelling of heat transfer in continuous flow two-phase droplet microfluidic systems using on-chip thermal control. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Trivellin Nicola et al. On the importance of Fast and Accurate LED Optical and Thermal Characterization: from visible use cases to UV technologies. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Ziegeler Nils J. et al. Accuracy Comparison of T3ster-Master and Optimization-based Network Identification. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Ziegeler Nils J. et al. Tridiagonal Approaches for Network Identification by Deconvolution. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23)
Sternberg Maik et al. Thermal Test Vehicle for HPC – System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution. (2023) In: Proceedings of the 29th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'23) pp. 1-7
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