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Proceedings of The 17th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'18)

Jeffrey, C Suhling [ed.]

English Conference proceedings (Book) Scientific

Published: IEEE, San Diego (CA), United States of America, 1410 p. 2018

Conference: 17th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems, ITHERM'18 2018-05-29 [San Diego (CA), United States of America]

Identifiers

MTMT: 3378561
DOI: 10.1109/ITherm43040.2018
ISBN: 9781538612729

Chapters

Gábor Farkas et al. LED Characterization within the Delphi4LED Project. (2018) In: Proceedings of The 17th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'18) p. 262
Parida Pritish R. et al. Sim2Cool: A Two-Phase Cooling System Simulator and Design Tool. (2018) In: Proceedings of The 17th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'18) pp. 271-280
Hao You et al. 2D Design of Channels in Vapor Chamber with Topological Optimization. (2018) In: Proceedings of The 17th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'18) pp. 296-301
Torzewicz Tomasz et al. Experimental Determination of Junction-to-Case Thermal Resistance in LED Compact Thermal Models. (2018) In: Proceedings of The 17th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'18) pp. 768-772
Sood Aditya et al. The Heat Conduction Renaissance. (2018) In: Proceedings of The 17th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'18) pp. 1396-1402

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2026-02-07 08:10

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