With the continuous scale down and integration, more and more sophisticated packaging
technologies are being developed to overcome the technology barriers in order to increase
efficiency and computational power. However, with new packaging technologies, the
same thermal-related problems still occur, but novel concepts can be examined to increase
the heat transfer efficiency. In our paper, we present an idea to enhance the heat
transfer in heterogeneous packages by integrating microscale channels into the silicon
interposer, using them as a fluid cooling vehicles. As an introduction to the concept,
a test vehicle is modelled in a CFD simulation tool to investigate the heat transfer
efficiency under different fluid flow rates. In addition, a comparison is also made
with a conventional heat sink cooling assembly.
