mtmtThe Hungarian Scientific Bibliography

XML JSON Public search Magyarul

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

IEEE [ed.]

English Conference proceedings (Book) Scientific

Published: IEEE, New York City, United States of America 2017

Conference: 19th IEEE Electronics Packaging Technology Conference, EPTC 2017 2017-12-06 [Singapore, Singapore]

Identifiers

MTMT: 3285478
ISBN: 9781538630426

Chapters

Chen Bo-Syun et al. Thermal Characterization for Dual Side SiP Module Technology. (2017) In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
Cheng Ming-Yuan et al. Hybrid Hermetic Housings for Active Implantable Neural Device. (2017) In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
G Hantos et al. Measurement issues in LED characterization for Delphi4LED style combined electrical-optical-thermal LED modeling. (2017) In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
Z Sarkany et al. The influence of the cycling parameters on the reliability test results of IGBTs. (2017) In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

Citation styles: IEEE ACM APA Chicago Harvard CSLCopyPrint

2026-02-11 10:37

×

Export list as bibliography

Citation styles: IEEE ACM APA Chicago HarvardPrintCopy