38th International Spring Seminar on Electronics Technology (ISSE)

Franz, M [szerk.]; Krammer, O [szerk.]; Nicolics, J [szerk.]; Wohlrabe, H [szerk.]

Angol nyelvű Konferenciakötet (Könyv) Tudományos

Megjelent: Institute of Electrical and Electronics Engineers (IEEE), Piscataway (NJ), Amerikai Egyesült Államok 2015

Konferencia: 38th International Spring Seminar on Electronics Technology, ISSE 2015 2015-05-06 [Eger, Magyarország]

Sorozatok: International Spring Seminar on Electronics Technology ISSE 2161-2528 2161-2536

Azonosítók

MTMT: 32794836
DOI: 10.1109/ISSE36273.2015
ISBN: 9781479988600

Fejezetek

Attila Géczy et al. Experimental 13.56 MHz RFID cards on biodegradable substrates. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 52-56
Csarnovics István et al. Patterning photosensitive layers for optoelectronic applications. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 57-60
Mizsei J et al. Thermal-electronic devices and thermal-electronic logic circuits (TELC). (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 61-65
Hurtony Tamás et al. The correlation between the mechanical and electrochemical properties of solder joints. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 70-74
B Illés et al. Relation between Tin Whiskering Ability Sn/Ag/Cu Solder Alloys and Current Load. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 173-178
A Neiser et al. Placement of Embedded Temperature Sensors in a Printed Circuit Board for a Manufacturing Process. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 213-217
M Branzei et al. Shear Strength Function of Temperature for Lead/Lead-Free Alloys Samples Obtained with Different Cooling Rate. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 255-260
Medgyes Bálint et al. Corrosion investigations on Lead-Free Micro-alloyed Solder Alloys used in Electronics. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 296-299
D Bušek et al. Determination of BGA solder joint detachment cause – warpage effect. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 306-309
Gordon Péter et al. Investigation of the wetting properties of Cu6Sn5 intermetallic compound. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 315-319
Bátorfi Réka. Examination of Soldering Defect Formation at QFN Components. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 320-323
Garami T et al. Investigation of the pre-heating process during thermosonic wire bonding by FEM simulation. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 333-338
O Krammer. Investigating the Effect of Squeegee Attack Angle on the Solder Paste Pressure during Stencil Printing. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 343-348
Attila Géczy et al. Analysing current density in the solder joints of chip-size Surface Mounted resistors. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 376-380
Berenyi Richard et al. FEM Based 3D Simulation of Nanosecond UV Laser Ablation. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 385-389
Attila Bonyár. Enhancing plasmonic biosensors with nanotechnology. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 418-424
Judit Kámán et al. Investigation of Surface Mechanical Properties of the Copper-Solder Interface by Atomic Force Microscopy. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 425-430
Péter Martinek et al. Supporting the Education of CAD Tools with Hardware Virtualization. (2015) Megjelent: 38th International Spring Seminar on Electronics Technology (ISSE) pp. 516-521

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38th International Spring Seminar on Electronics Technology (ISSE)

Franz, M [szerk.]; Krammer, O [szerk.]; Nicolics, J [szerk.]; Wohlrabe, H [szerk.]

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