Process and Measurement of Electroplated Back-Contact Integrated Microchannel Cooling Devices for CPV Cells

Rózsás, Gábor ✉ [Rózsás, Gábor (Elektronikus eszk...), szerző] Elektronikus Eszközök Tanszéke (BME / VIK); Bognár, György [Bognár, György (Elektronikus Eszk...), szerző] Elektronikus Eszközök Tanszéke (BME / VIK); Takács, Gábor [Takács, Gábor (elektronikus eszk...), szerző] Elektronikus Eszközök Tanszéke (BME / VIK); Szabó, Péter Gábor [Szabó, Péter Gábor (Elektronikus eszk...), szerző] Elektronikus Eszközök Tanszéke (BME / VIK); Plesz, Balázs [Plesz, Balázs (Mikroelektronika,...), szerző] Elektronikus Eszközök Tanszéke (BME / VIK)

Angol nyelvű Konferenciaközlemény (Könyvrészlet) Tudományos
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    • Műszaki és technológiai tudományok
    Concentrator photovoltaics (CPV) is one of the promising solutions in the fields of green energy production. Their main advantage is that the concentration of incident light significantly increases their efficiency compared to traditional photovoltaics. Unfortunately, light concentration also increases the temperature, which has a negative effect on the efficiency so, the cooling of CPVs is an essential issue to fully utilize their potentials. The idea presented by our team is to use microchannels integrated into the backside metallization of the PV-devices. The proposed process is based on an evaporated titanium and copper seed layer followed by selective copper electroplating around a photoresist microchannel pattern. After removing the photoresist microchannels remain in the grown copper that also serves as the back contact of the solar cell. In this paper we present several improvements of the process to avoid the formation of photoresist residues and clogging that were identified as the main reason of unsatisfactory cooling performance in previous implementations. Cooling performance of the manufactured device was confirmed by hydrodynamic and thermal characterization procedures and compared to simulation results of the same device layout.
    Hivatkozás stílusok: IEEEACMAPAChicagoHarvardCSLMásolásNyomtatás
    2026-02-18 09:24