It is a long-standing practice for printed circuit boards (PCBs) to monitor the temperature
at significant points such as the casing or at a p-n-junction. Measurements are usually
done via thermocouples or through monitoring temperature sensitive parameters such
as the forward voltage of a p-n-junction. While these techniques have many advantages
and are well-established, they are limited in certain regards such as spatial and
temporal resolution or accessibility of the individual components. The aim of this
work is to explore the possibilities on how to advance the measurement procedure using
infrared thermography. To this end, the temperature of a single LED measured via the
forward voltage is compared to the corresponding infrared thermography results. Next,
this method is used to analyse an array comprised of 4 x 4 LEDs and to analyse the
transient behaviour of each individual LED. Finally, the spatially resolved time constant
spectra are calculated.
