https://m2.mtmt.hu/ eng 2026-06-24 05:31 BookChapter 31576618 APPROVED VALIDATION_ERROR true 0 false 2023-08-17T17:18:03.687+0000 2023-01-17T15:03:51.271+0000 2020-09-04T20:35:50.732+0000 true 565 WoS import /api/admin/565 Admin import WoS (admin) true 2020-09-04T20:35:50.624+0000 2020-09-04T20:35:50.624+0000 false false true 25 25 /api/publicationtype/25 PublicationType Chapter in Book 2 true 25 BookChapter true 10000312 Conference paper true 25 25 /api/publicationtype/25 PublicationType Chapter in Book 2 true 25 BookChapter /api/subtype/10000312 Konferenciaközlemény SubType Conference paper (Chapter in Book) 228 true 10000312 true 1 /api/category/1 Category Scientific true 1 Schmid, Maximilian 6 2019 Transient thermal analysis (TTA) with the measurement of the single pulse thermal impedance (Z(th)(t)) is a standard method to verify the thermal integrity of power semiconductors modules. For best evaluation of measured data, the signal to noise ratio (SNR) should be as high as possible. Especially in the early time domain, it is difficult to achieve high SNR because of the required high bandwidth. Most common way to increase SNR is averaging over several TTA measurement repetitions. Since the semiconductor module therefore has to reach thermal equilibrium, this solution is very time consuming. This paper introduces a new averaging algorithm for TTA, wherein several short deterministic pulses are applied to the semiconductor before standard TTA. Over superposition, the influence of the previous pulses is removed from all short pulses and averaging is possible without reaching thermal equilibrium. Result is a standard single pulse Z(th)(t) and not a duty cycle form of it. The algorithm is tested by simulations and experimentally using automotive LEDs to verify feasibility and demonstrate benefit. Thereby a SNR increase equivalent to 33 repetitions in standard TTA was reached. 2020 true true true true false NONE 2023-08-17 false 0 0 0 0 0 0 0 0 0 0 0 0 1 1 false false false false 2023-04-17T14:03:51.213+0000 1 8 0 4 0 true true 10002 English /api/language/10002 Angol Language English true 2 false true 10367 true 10017 /api/country/10017 Country United States of America true 13 /api/city/10367 City New York City, United States of America true 870 true 17789426 /api/publicationidentifier/17789426 https://www.worldcat.org/search?q=isbn%3A9781728120782 9781728120782 PublicationIdentifier ISBN: 9781728120782 true 122 ISBN https://www.worldcat.org/search?q=isbn%3A@@@ /api/publicationsource/122 ISBN PlainSource ISBN true true 10002 /api/publicationsourcetype/10002 PublicationSourceType Egyéb true false 122 true true true 16218625 /api/publicationidentifier/16218625 https://ieeexplore.ieee.org/xpl/conhome/8911538/proceeding https://ieeexplore.ieee.org/xpl/conhome/8911538/proceeding PublicationIdentifier Egyéb URL: https://ieeexplore.ieee.org/xpl/conhome/8911538/proceeding true 40 Other URL @@@ /api/publicationsource/40 Egyéb URL PlainSource Other URL true true 10006 /api/publicationsourcetype/10006 PublicationSourceType Link true true 40 true false /api/publication/31577640 2019 25TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2019). (2019) ISBN:9781728120782 true true 23 23 /api/publicationtype/23 PublicationType Book 3 true 23 Book false false 31577640 false true true true true 10000144 Conference proceedings true 23 23 /api/publicationtype/23 PublicationType Book 3 true 23 Book /api/subtype/10000144 Konferenciakötet SubType Conference proceedings (Book) 345 true 10000144 false Book 2019 true 1 /api/category/1 Category Scientific true 1 false Language 10002 /api/language/10002 English Angol English true 2 true PersonAuthorship 93458684 /api/authorship/93458684 Schmid, Maximilian ✉ 1 0.0 true false true Schmid Maximilian true false false AuthorshipType 1 /api/authorshiptype/1 Author 0 true 0 true false true PersonAuthorship 93458685 /api/authorship/93458685 Hanss, Alexander 2 0.0 false false false Hanss Alexander true false false AuthorshipType 1 /api/authorshiptype/1 Author 0 true 0 true false true PersonAuthorship 93458686 /api/authorship/93458686 Bhogaraju, Sri Krishna 3 0.0 false false false Bhogaraju Sri Krishna true false false AuthorshipType 1 /api/authorshiptype/1 Author 0 true 0 true false true PersonAuthorship 93458687 /api/authorship/93458687 Elger, Gordon 4 0.0 false true false Elger Gordon true false false AuthorshipType 1 /api/authorshiptype/1 Author 0 true 0 true false true PublicationIdentifier 17684429 /api/publicationidentifier/17684429 WoS: 000534514800021 PlainSource 1 /api/publicationsource/1 WoS PublicationSourceType 10003 /api/publicationsourcetype/10003 Indexelő adatbázis false true true WoS WoS https://www.webofscience.com/wos/woscc/full-record/@@@ true true 1 true 000534514800021 https://www.webofscience.com/wos/woscc/full-record/000534514800021 false true /api/publication/31576618 Schmid Maximilian et al. Time Saving Averaging Algorithm for Transient Thermal Analyses over Deterministic Pulse Superposition. (2019) In: 2019 25TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2019)<div class="BookChapter Publication long-list"> <div class="authors"> <img title="Idézőközlemény" style="float: left" src="/frontend/resources/grid/publication-citation-icon.png"> <div class="autype autype0"> <span class="author-name" >Schmid Maximilian ✉ </span> ;&nbsp;&nbsp;&nbsp; <span class="author-name" >Hanss Alexander </span> ;&nbsp;&nbsp;&nbsp; <span class="author-name" >Bhogaraju Sri Krishna </span> ;&nbsp;&nbsp;&nbsp; <span class="author-name" >Elger Gordon </span> </div> </div> <div class="title"><a href="/gui2/?mode=browse&params=publication;31576618" target="_blank">Time Saving Averaging Algorithm for Transient Thermal Analyses over Deterministic Pulse Superposition</a></div> <div class="InBook"><div class="chapter-in">In:</div> <div class="authors"> </div> <div class="booktitle"><a href="/gui2/?mode=browse&params=publication;31577640" target="_blank">2019 25TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2019) </a></div> <div class="conference"> Conference: <span class="location">Lecco, Italy <span class="conference-date">2019.09.25. - 2019.09.27.</span> </div> <span class="publishedAt">New York City: <span class="publishers">IEEE</span>, <span class="page"> 6 p. </span> <span class="year">(2019)</span> </div> <div class="pub-footer"> <span class="language" xmlns="http://www.w3.org/1999/html">Language: English | </span> <span class="identifiers"> <span class="id identifier oa_none" title="none"> <a style="color:black" title="000534514800021" target="_blank" href="https://www.webofscience.com/wos/woscc/full-record/000534514800021"> WoS </a> </span> </span> <span class="bookchapter-ids">Book link(s):</span> <span class="identifiers"> <span class="id identifier oa_none" title="none"> <span class="isbnOrIssn"> ISBN: </span> <a style="color:black" title="9781728120782" target="_blank" href="https://www.worldcat.org/search?q=isbn%3A9781728120782"> 9781728120782 </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:black" title="https://ieeexplore.ieee.org/xpl/conhome/8911538/proceeding" target="_blank" href="https://ieeexplore.ieee.org/xpl/conhome/8911538/proceeding"> Other URL </a> </span> </span> <div class="publication-citation"> <a target="_blank" href="/api/publication?cond=citations.related;eq;31576618&sort=publishedYear,desc&sort=title"> Number of cited publications: 1 </a> </div> <div class="mtid"><span class="long-pub-mtid">Publication: 31576618</span> | <span class="status-data status-APPROVED"> Published </span> <span class="long-book-mtid">Book: 31577640</span> Citing | <span class="type-subtype">Chapter in Book ( Conference paper ) </span> | <span class="pub-category">Scientific</span> | <span class="errorStatus"> Validation error </span> | <span class="publication-sourceOfData">WoS-XML</span> </div> <div class="lastModified">Last Modified: 2023.01.17. 16:03 Éva Pécsi (MTMT Közp 3, admin) </div> </div> </div>