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      <abstractText>Standard accelerated degradation tests provide benchmarks of power semiconductors performance, availability and reliability in terms of design loops. To fasten up such design loops, as well as product release, accompanying tracking of temperature sensitive electrical parameters (TSEPs) are in great demand. In this paper, a real-time tracking concept is presented, based on the periodically measured TSEP of a power device. A time-resolved temperature dependent voltage signal is used as a tracking parameter. This is measured using a portable setup: a multifunction lab instrument board -Red Pitaya v1.1- senses and analyses the voltage while a daughter board -TT Frontend- increases the sensitivity to the sensor signal. The combination of continuously measured TSEP and the determined changes in the time constant spectra allows early failure detection and accelerated reliability predication in addition to analysing the performance of different design loops under service.</abstractText>
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      <label>Magnien Julien et al. Temperature Sensitive Electrical Parameter Sensing Unit for Early Failure Detection. (2019) In: 2019 25TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2019) pp. 1-5</label><template>&lt;div class=&quot;BookChapter Publication short-list&quot;&gt; &lt;div class=&quot;authors&quot;&gt; &lt;span class=&quot;author-name&quot; &gt; Magnien, Julien &lt;/span&gt; &lt;span class=&quot;author-type&quot;&gt; &lt;/span&gt; ; &lt;span class=&quot;author-name&quot; &gt; Mitterhuber, Lisa &lt;/span&gt; &lt;span class=&quot;author-type&quot;&gt; &lt;/span&gt; ; &lt;span class=&quot;author-name&quot; &gt; Kraker, Elke &lt;/span&gt; &lt;span class=&quot;author-type&quot;&gt; &lt;/span&gt; &lt;/div &gt;&lt;div class=&quot;title&quot;&gt;&lt;a href=&quot;/gui2/?mode=browse&amp;params=publication;31322194&quot; mtid=&quot;31322194&quot; target=&quot;_blank&quot;&gt;Temperature Sensitive Electrical Parameter Sensing Unit for Early Failure Detection&lt;/a&gt;&lt;/div&gt; &lt;div class=&quot;InBook&quot;&gt;In: &lt;span class=&quot;booktitle&quot;&gt;&lt;a href=&quot;/gui2/?mode=browse&amp;params=publication;31577640&quot; target=&quot;_blank&quot;&gt;2019 25TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2019) &lt;/a&gt;&lt;/span &gt; &lt;/div&gt;&lt;div class=&quot;pub-info&quot;&gt; &lt;span class=&quot;publishedAt&quot;&gt;New York City, United States of America : &lt;span class=&quot;publisher&quot;&gt;IEEE&lt;/span&gt; &lt;span class=&quot;year&quot;&gt;(2019)&lt;/span&gt; &lt;span class=&quot;page&quot;&gt; pp. 1-5. , 5 p. &lt;/span&gt; &lt;/div&gt; &lt;div class=&quot;pub-end&quot;&gt;&lt;div class=&quot;identifier-list&quot;&gt; &lt;span class=&quot;identifiers&quot;&gt; &lt;span class=&quot;id identifier oa_none&quot; title=&quot;none&quot;&gt; &lt;a style=&quot;color:black&quot; title=&quot;10.1109/THERMINIC.2019.8923688&quot; target=&quot;_blank&quot; href=&quot;https://doi.org/10.1109/THERMINIC.2019.8923688&quot;&gt; DOI &lt;/a&gt; &lt;/span&gt; &lt;span class=&quot;id identifier oa_none&quot; title=&quot;none&quot;&gt; &lt;a style=&quot;color:blue&quot; title=&quot;000534514800043&quot; target=&quot;_blank&quot; href=&quot;https://www.webofscience.com/wos/woscc/full-record/000534514800043&quot;&gt; WoS &lt;/a&gt; &lt;/span&gt; &lt;span class=&quot;id identifier oa_none&quot; title=&quot;none&quot;&gt; &lt;a style=&quot;color:black&quot; title=&quot;https://ieeexplore.ieee.org/document/8923688/&quot; target=&quot;_blank&quot; href=&quot;https://ieeexplore.ieee.org/document/8923688/&quot;&gt; Other URL &lt;/a&gt; &lt;/span&gt; &lt;/span&gt; &lt;/div&gt; &lt;div class=&quot;short-pub-prop-list&quot;&gt; &lt;span class=&quot;short-pub-mtid&quot;&gt; Publication:31322194 &lt;/span&gt; &lt;span class=&quot;status-holder&quot;&gt;&lt;span class=&quot;status-data status-APPROVED&quot;&gt; Published &lt;/span&gt;&lt;/span&gt; &lt;span class=&quot;pub-core&quot;&gt; Citing &lt;/span&gt; &lt;span class=&quot;pub-type&quot;&gt;Chapter in Book (Conference paper ) &lt;/span&gt; &lt;!-- &amp;&amp; !record.category.scientific --&gt; &lt;span class=&quot;pub-category&quot;&gt;Scientific&lt;/span&gt; &lt;/div&gt; &lt;/div&gt; &lt;/div&gt;</template><template2>&lt;div class=&quot;BookChapter Publication long-list&quot;&gt; &lt;div class=&quot;authors&quot;&gt; &lt;img title=&quot;Idézőközlemény&quot; style=&quot;float: left&quot; src=&quot;/frontend/resources/grid/publication-citation-icon.png&quot;&gt; &lt;div class=&quot;autype autype0&quot;&gt; &lt;span class=&quot;author-name&quot; &gt;Magnien Julien &lt;/span&gt; ;&amp;nbsp;&amp;nbsp;&amp;nbsp; &lt;span class=&quot;author-name&quot; &gt;Mitterhuber Lisa &lt;/span&gt; ;&amp;nbsp;&amp;nbsp;&amp;nbsp; &lt;span class=&quot;author-name&quot; &gt;Kraker Elke &lt;/span&gt; &lt;/div&gt; &lt;/div&gt; &lt;div class=&quot;title&quot;&gt;&lt;a href=&quot;/gui2/?mode=browse&amp;params=publication;31322194&quot; target=&quot;_blank&quot;&gt;Temperature Sensitive Electrical Parameter Sensing Unit for Early Failure Detection&lt;/a&gt;&lt;/div&gt; &lt;div class=&quot;InBook&quot;&gt;&lt;div class=&quot;chapter-in&quot;&gt;In:&lt;/div&gt; &lt;div class=&quot;authors&quot;&gt; &lt;/div&gt; &lt;div class=&quot;booktitle&quot;&gt;&lt;a href=&quot;/gui2/?mode=browse&amp;params=publication;31577640&quot; target=&quot;_blank&quot;&gt;2019 25TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2019) &lt;/a&gt;&lt;/div&gt; &lt;div class=&quot;conference&quot;&gt; Conference: &lt;span class=&quot;location&quot;&gt;Lecco, Italy &lt;span class=&quot;conference-date&quot;&gt;2019.09.25. - 2019.09.27.&lt;/span&gt; &lt;/div&gt; &lt;span class=&quot;publishedAt&quot;&gt;New York City: &lt;span class=&quot;publishers&quot;&gt;IEEE&lt;/span&gt;, &lt;span class=&quot;page&quot;&gt; pp 1-5 &lt;/span&gt; &lt;span class=&quot;year&quot;&gt;(2019)&lt;/span&gt; &lt;/div&gt; &lt;div class=&quot;pub-footer&quot;&gt; &lt;span class=&quot;language&quot; xmlns=&quot;http://www.w3.org/1999/html&quot;&gt;Language: English | &lt;/span&gt; &lt;span class=&quot;identifiers&quot;&gt; &lt;span class=&quot;id identifier oa_none&quot; title=&quot;none&quot;&gt; &lt;a style=&quot;color:black&quot; title=&quot;10.1109/THERMINIC.2019.8923688&quot; target=&quot;_blank&quot; href=&quot;https://doi.org/10.1109/THERMINIC.2019.8923688&quot;&gt; DOI &lt;/a&gt; &lt;/span&gt; &lt;span class=&quot;id identifier oa_none&quot; title=&quot;none&quot;&gt; &lt;a style=&quot;color:blue&quot; title=&quot;000534514800043&quot; target=&quot;_blank&quot; href=&quot;https://www.webofscience.com/wos/woscc/full-record/000534514800043&quot;&gt; WoS &lt;/a&gt; &lt;/span&gt; &lt;span class=&quot;id identifier oa_none&quot; title=&quot;none&quot;&gt; &lt;a style=&quot;color:black&quot; title=&quot;https://ieeexplore.ieee.org/document/8923688/&quot; target=&quot;_blank&quot; href=&quot;https://ieeexplore.ieee.org/document/8923688/&quot;&gt; Other URL &lt;/a&gt; &lt;/span&gt; &lt;/span&gt; &lt;span class=&quot;bookchapter-ids&quot;&gt;Book link(s):&lt;/span&gt; &lt;span class=&quot;identifiers&quot;&gt; &lt;span class=&quot;id identifier oa_none&quot; title=&quot;none&quot;&gt; &lt;span class=&quot;isbnOrIssn&quot;&gt; ISBN: &lt;/span&gt; &lt;a style=&quot;color:black&quot; title=&quot;9781728120782&quot; target=&quot;_blank&quot; href=&quot;https://www.worldcat.org/search?q=isbn%3A9781728120782&quot;&gt; 9781728120782 &lt;/a&gt; &lt;/span&gt; &lt;span class=&quot;id identifier oa_none&quot; title=&quot;none&quot;&gt; &lt;a style=&quot;color:black&quot; title=&quot;https://ieeexplore.ieee.org/xpl/conhome/8911538/proceeding&quot; target=&quot;_blank&quot; href=&quot;https://ieeexplore.ieee.org/xpl/conhome/8911538/proceeding&quot;&gt; Other URL &lt;/a&gt; &lt;/span&gt; &lt;/span&gt; &lt;div class=&quot;publication-citation&quot;&gt; &lt;a target=&quot;_blank&quot; href=&quot;/api/publication?cond=citations.related;eq;31322194&amp;sort=publishedYear,desc&amp;sort=title&quot;&gt; Number of cited publications: 3 &lt;/a&gt; &lt;/div&gt; &lt;div class=&quot;mtid&quot;&gt;&lt;span class=&quot;long-pub-mtid&quot;&gt;Publication: 31322194&lt;/span&gt; | &lt;span class=&quot;status-data status-APPROVED&quot;&gt; Published &lt;/span&gt; &lt;span class=&quot;long-book-mtid&quot;&gt;Book: 31577640&lt;/span&gt; Citing | &lt;span class=&quot;type-subtype&quot;&gt;Chapter in Book ( Conference paper ) &lt;/span&gt; | &lt;span class=&quot;pub-category&quot;&gt;Scientific&lt;/span&gt; | &lt;span class=&quot;publication-sourceOfData&quot;&gt;kézi felvitel&lt;/span&gt; &lt;/div&gt; &lt;div class=&quot;lastModified&quot;&gt;Last Modified: 2023.08.17. 19:13 Éva Pécsi (MTMT Közp 3, admin) &lt;/div&gt; &lt;/div&gt; &lt;/div&gt;</template2>
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