2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)

Chindris, Gabriel [szerk.]

Angol nyelvű Konferenciakötet (Könyv) Tudományos

Megjelent: Institute of Electrical and Electronics Engineers (IEEE), Piscataway (NJ), Amerikai Egyesült Államok 2019

Konferencia: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2019-10-23 [Cluj-Napoca, Románia]

Azonosítók

MTMT: 31177218
DOI: 10.1109/SIITME47687.2019
ISBN: 9781728133300

Fejezetek

Szurdan Szabolcs et al. Reliability Tests on SAC-xMn Solder Alloys. (2019) Megjelent: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) pp. 34-37
Krammer Oliver et al. Investigating the Component Shift during Reflow Soldering at Large Scale Capacitors. (2019) Megjelent: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) pp. 38-42
Straubinger Daniel et al. Scaling of Components for Explicit Modelling of Heat Transfer during Vapour Phase Reflow Soldering. (2019) Megjelent: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) pp. 155-159
Branzei Mihai et al. Electrically Conductive Paste Printed Volume Influence on Bonds Properties. (2019) Megjelent: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) pp. 198-201
Grama Alin et al. Personal Assistant Based on Internet of Things. (2019) Megjelent: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) pp. 248-251
Alexan Anca et al. Analysis of activity detection data pre-processing. (2019) Megjelent: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) pp. 282-286
Andronescu A. D. et al. Skin Anomaly Detection Using Classification Algorithms. (2019) Megjelent: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) pp. 299-303
Geczy Attila et al. Investigating shadowing and possible tombstoning caused by large SMD components during vapour phase reflow soldering. (2019) Megjelent: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) pp. 343-346

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2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)

Chindris, Gabriel [szerk.]

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