Thanks to the System-on-Package technology (SoP) the integration of different elements
into a single package was enabled. However, from the thermal point of view the heat
removal path in modern packaging technologies (FCBGA) goes through several layers
of thermal interface material (TIM) that together with the package material create
a relatively high thermal resistance which may lead to elevated chip temperature which
causes functional error or other malfunctions. In our concept, we overcome this problem
by creating integrated microfluidic channel based heat sink structures that can be
used for cooling the high heat dissipation semiconductor devices (e.g.: processors,
high power transistor or concentrated solar cells). These microchannel cooling assemblies
can be integrated into the backside of the substrate of the semiconductor devices
or into the system assemblies in SoP technology. In addition to the realization of
the novel CMOS compatible microscale cooling device we have developed precise and
valid measurement methodology, simulation cases studies and a unique compact model
that can be added to numerical simulators as an external node. In this paper the achievements
of a larger research are summarized as it required the cooperation of several experts
in their fields to fulfil the goal of creating a state-of-the-art demonstrator.
