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Proceedings of The 18th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'19)
English Scientific
Published: IEEE, Las Vegas, United States of America
2019
Conference:
18th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM 2019) 2019-05-28 [Las Vegas, United States of America]
Identifiers
MTMT: 30932113
DOI:
10.1109/ITherm45331.2019
ISBN:
9781728124612
Chapters
Bein Marton C. et al. Measurement-Based Multi-Domain Modeling of LEDs for “Industry 4.0”. (2019) In: Proceedings of The 18th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'19) pp. 23-30
T. Torzewicz et al. Parametric Compact Thermal Modeling of Power LEDs. (2019) In: Proceedings of The 18th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'19) pp. 131-136
Toure Mamadou Kabirou et al. Accurate Modeling of Forced Convection Cooling for Microelectronic Packages: Numerical and Experimental Thermal Studies. (2019) In: Proceedings of The 18th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'19) pp. 525-530
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2026-02-10 06:18
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