DESIGN, CHARACTERIZATION, AND PACKAGING FOR MEMS AND MICROELECTRONICS

English Conference proceedings (Book) Scientific
Published: International Society for Optics and Photonics (SPIE), Washington D.C., United States of America, Bellingham (WA), United States of America 1999
Conference: Design, Characterization, and Packaging for MEMS and Microelectronics 1999-10-27 [Gold Coast, Australia]
Series: Proceedings of SPIE 0277-786X 1996-756X, 3893
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    2025-04-25 14:21