The core of this work is to introduce a new electro-thermal device operation principle
based on a thermally controlled temperature sensitive component. General conditions
for operation and results from practical realization are summarized for this new functional
thermal-electronic device (phonsistor) and the CMOS compatible thermal-electronic
logic circuit (TELC) formed of phonsistors. Our experimental TELC devices has been
realized in lateral form using thin VO2 layers on oxidized silicon substrate and thin
platinum layers as metallization and contact electrodes.
