Proceedings of International Conference on Electronics Packaging

IEEE [ed.]

English Conference proceedings (Book) Scientific

Published: IEEE, New York City, United States of America 2015

Conference: International Conference on Electronics Packaging 2015-04-14 [Kiotó, Japan]

Identifiers

MTMT: 2911925
ISBN: 9784904090121

Chapters

Attila Szel et al. Mission profile driven component design for adjusting product lifetime on system level. (2015) In: Proceedings of International Conference on Electronics Packaging pp. 385-389

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2026-02-15 12:26