Advancing the thermal stability of 3D ICs using logi-thermal simulation

https://m2.mtmt.hu/ hun 2026-06-27 17:35 JournalArticle 2908301 ADMIN_APPROVED true Megjegyzés-25412368 Megjegyzés-26505942 PN A Issue: 12, Part: A WoS:hiba:000367859500003 2020-08-29 08:48 füzet nem egyezik 0 2018-10-02T08:54:25.000+0000 false 2908301 2026-05-16T20:56:55.995+0000 2021-01-18T16:40:36.908+0000 2015-06-17T13:17:32.000+0000 true 10042323 Horváth Péter /api/author/10042323 Author Horváth Péter (Elektronikus eszközök) true 10042323 2026-02-23T14:57:24.490+0000 2026-02-23T14:57:24.490+0000 2021-01-18T16:40:36.918+0000 true 10060654 Sövény Emese /api/admin/10060654 Admin Sövény Emese (BME admin 5) true 10060654 true false true 24 24 /api/publicationtype/24 PublicationType Folyóiratcikk 1 true 24 JournalArticle true 10000059 Article true 24 24 /api/publicationtype/24 PublicationType Folyóiratcikk 1 true 24 JournalArticle /api/subtype/10000059 Szakcikk SubType Szakcikk (Folyóiratcikk) 101 true 10000059 true 1 /api/category/1 Category Tudományos true 1 Gergely, Nagy Advancing the thermal stability of 3D ICs using logi-thermal simulation true true /api/journal/1313645 REVIEWED MICROELECTRONICS JOURNAL 0959-8324 1879-2391 true false 1313645 false 1313645 true 0959-8324 1879-2391 Journal FOREIGN 46 12, Part: A 1114 1120 1114 7 2015 true true 2015 true true true false true false PAY 2026-05-16 false 19 0 19 1 18 18 19 18 19 19 19 1 1 1 18 0 19 1 19 1 0 7 7 Folyóiratcikk Journal Article 24 11 Könyvrészlet Chapter in Book 25 8 Könyv Book 23 0 Egyéb konferenciaközlemény Conference paper 31 0 Egyéb konferenciakötet Conference proceedings 32 0 Oltalmi formák Protection forms 26 0 Disszertáció Thesis 28 0 Egyéb Miscellaneous 29 0 Alkotás Achievement 22 0 Kutatási adat Research data 33 0 Folyóiratcikk Journal Article 24 0 0 0 Könyvrészlet Chapter in Book 25 0 0 0 Könyv Book 23 0 0 0 Egyéb konferenciaközlemény Conference paper 31 0 0 0 Egyéb konferenciakötet Conference proceedings 32 0 0 0 Oltalmi formák Protection forms 26 0 0 0 Disszertáció Thesis 28 0 0 0 Egyéb Miscellaneous 29 0 0 0 Alkotás Achievement 22 0 0 0 Kutatási adat Research data 33 0 0 0 2015 0 3 0 3 0 2016 0 6 0 6 0 2017 0 4 0 4 0 2018 0 2 0 2 0 2019 0 1 0 1 0 2020 0 1 0 1 0 2021 0 2 1 2 1 Q2 false false false false 2017-10-30T14:23:09.000+0000 2015-06-22T09:08:58.000+0000 Elektronikus Eszközök Tanszéke (BME / VIK) 4 4 1 4 0 true Language 10002 /api/language/10002 Angol Angol English true 2 true PersonAuthorship 6368847 /api/authorship/6368847 Gergely, Nagy [Nagy, Gergely (Mikroelektronika), szerző] Elektronikus Eszközök Tanszéke (BME / VIK) 1 0.25 true false Author 10041090 /api/author/10041090 Nagy Gergely (Mikroelektronika) Nagy Gergely true 10041090 true Gergely Nagy true false false AuthorshipType 1 /api/authorshiptype/1 Szerző 0 true 0 true false 21724389 true PersonAuthorship 6368848 /api/authorship/6368848 Peter, Horvath [Horváth, Péter (Elektronikus eszk...), szerző] Elektronikus Eszközök Tanszéke (BME / VIK) 2 0.25 false false Author 10042323 /api/author/10042323 Horváth Péter (Elektronikus eszközök) Horváth Péter true 10042323 true Peter Horvath true false false AuthorshipType 1 /api/authorshiptype/1 Szerző 0 true 0 true false 21724388 true PersonAuthorship 6368849 /api/authorship/6368849 Laszlo, Pohl [Pohl, László (mikroelektronika), szerző] Elektronikus Eszközök Tanszéke (BME / VIK) 3 0.25 false false Author 10041061 /api/author/10041061 Pohl László (mikroelektronika) Pohl László true 10041061 true Laszlo Pohl true false false AuthorshipType 1 /api/authorshiptype/1 Szerző 0 true 0 true false 21724387 true PersonAuthorship 6368850 /api/authorship/6368850 Andras, Poppe [Poppe, András (Mikroelektronika), szerző] Elektronikus Eszközök Tanszéke (BME / VIK) 4 0.25 false true Author 10001242 /api/author/10001242 Poppe András (Mikroelektronika) Poppe András true 10001242 true Andras Poppe true false false AuthorshipType 1 /api/authorshiptype/1 Szerző 0 true 0 true false 21724386 true PublicationIdentifier 988656 /api/publicationidentifier/988656 DOI: 10.1016/j.mejo.2015.06.025 PlainSource 6 /api/publicationsource/6 DOI PublicationSourceType 10001 /api/publicationsourcetype/10001 DOI true true true DOI DOI https://doi.org/@@@ true true 6 true PAY false IDENTICAL 10.1016/j.mejo.2015.06.025 https://doi.org/10.1016/j.mejo.2015.06.025 false 1222067 true PublicationIdentifier 988657 /api/publicationidentifier/988657 ScienceDirect: S0026269215001664 PlainSource 27 /api/publicationsource/27 ScienceDirect PublicationSourceType 10004 /api/publicationsourcetype/10004 Kiadói adatbázis false true true ScienceDirect ScienceDirect http://www.sciencedirect.com/science/article/pii/@@@ true true 27 true false NO S0026269215001664 http://www.sciencedirect.com/science/article/pii/S0026269215001664 false 1222068 true PublicationIdentifier 988654 /api/publicationidentifier/988654 WoS: 000367859500003 PlainSource 1 /api/publicationsource/1 WoS PublicationSourceType 10003 /api/publicationsourcetype/10003 Indexelő adatbázis false true true WoS WoS https://www.webofscience.com/wos/woscc/full-record/@@@ true true 1 true false IDENTICAL 000367859500003 https://www.webofscience.com/wos/woscc/full-record/000367859500003 false 1317786 true PublicationIdentifier 988655 /api/publicationidentifier/988655 Scopus: 84939481874 PlainSource 3 /api/publicationsource/3 Scopus PublicationSourceType 10003 /api/publicationsourcetype/10003 Indexelő adatbázis false true true Scopus Scopus http://www.scopus.com/record/display.url?origin=inward&eid=2-s2.0-@@@ true true 3 true false IDENTICAL 84939481874 http://www.scopus.com/record/display.url?origin=inward&eid=2-s2.0-84939481874 false 1260821 true Classification 10154 /api/classification/10154 Fizika true true SjrRating 11021321 /api/sjrrating/11021321 sjr:Q2 (2015) Scopus - Electrical and Electronic Engineering MICROELECTRONICS JOURNAL 0026-2692 0959-8324 302 0.49 journal RatingType 10002 /api/ratingtype/10002 sjr sjr true true ClassificationExternal 2208 /api/classificationexternal/2208 Scopus - Electrical and Electronic Engineering true 2208 true Q2 DIRECT true true Reference 1996963 /api/reference/1996963 1. 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Leduca, P., De Crecy, F., Fayolle, M., Charlet, B., Enot, T., Zussy, M., Jones, B., Louisa, D., Challenges for 3D IC integration: Bonding quality and thermal management Proceedings of the IEEE International Interconnect Technology Conference, pp. 210-212. , http://dx.doi.org/ June 2007 Burlingame, CA, DOI: 10.1109/IITC.2007.382392, 5 10.1109/IITC.2007.382392, false true Reference 1996968 /api/reference/1996968 6. Der Plas, G.V., Limaye, P., Loi, I., Mercha, A., Oprins, H., Design issues and considerations for low-cost 3-D TSV IC technology (2011) IEEE J. Solid-State Circuits, 46 (1), pp. 293-307 6 false true Reference 1996969 /api/reference/1996969 7. Cheng, H.C., Yang, C.Y., Cheng, A., Cheng, K., Micro bridge technology for 3D IC interconnection could benefit the 3D IC test strategy Proceedings of the 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), pp. 370-372. , http://dx.doi.org/ October 2012 Taipei, Taiwan, DOI: 10.1109/IMPACT.2012.6420271, 7 10.1109/IMPACT.2012.6420271, false true Reference 1996970 /api/reference/1996970 8. John, H., Lau, Evolution, challenge, and outlook of TSV, 3D IC integration and 3D silicon integration Proceedings of the International Symposium on Advanced Packaging Materials, pp. 462-488. , http://dx.doi.org/ October 2011 Xiamen, China, DOI: 10.1109/ISAPM.2011.6105753, 8 10.1109/ISAPM.2011.6105753, false true Reference 1996971 /api/reference/1996971 9. Li, Z., Thermal-aware P/G TSV planning for IR drop reduction in 3D ICs (2012) Integr. VLSI J., 46 (1), pp. 1-9 9 false true Reference 1996972 /api/reference/1996972 10. Szekely, V., Poppe, A., Pahi, A., Csendes, A., Hajas, G., Rencz, M., Electro-thermal and logi-thermal simulation of VLSI designs (1997) IEEE Trans. Very Large Scale Integr. (VLSI) Syst., 5 (3), pp. 258-269 10 false true Reference 1996973 /api/reference/1996973 11. Kumar, R., Kursun, V., Reversed temperature-dependent propagation delay characteristics in nanometer CMOS circuits (2006) IEEE Trans. Circuits Syst. II: Express Briefs, 53 (10), pp. 1078-1082 11 false true Reference 1996974 /api/reference/1996974 12. Dasdan, A., Hom, I., Handling inverted temperature dependence in static timing analysis (2006) ACM Trans. Des. Autom. Electron. Syst., 11 (2), pp. 306-324 12 false true Reference 1996975 /api/reference/1996975 13. Poppe, A., Electrothermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits (2008) Proceeding of the 24th IEEE SEMI-THERM Symposium 13 false true Reference 1996976 /api/reference/1996976 14. Timar, A., Rencz, M., Real-time heating and power characterization of cells in standard cell designs (2013) Microelectron. J., 44 (11), pp. 977-985 14 false true Reference 1996977 /api/reference/1996977 15. Székely, V., SUNRED a new thermal simulator and typical applications Proceedings of 3rd International Workshop on Thermal Investigation of ICs and Systems (THERMINIC), pp. 84-90. , September 1997 Cannes, France 15 false true Reference 1996978 /api/reference/1996978 16. Pohl, L., Kohári, Z.S., Székely, V., Fast field solver for the simulation of large-area OLEDs (2010) Microelectron. J., 41 (9), pp. 566-573 16 false true Reference 1996979 /api/reference/1996979 17. Demidovich, B.P., Maron, I.A., (1973) Computational Mathematics, Editorial Mir, pp. 459-487. , Moscow 17 false true Reference 1996980 /api/reference/1996980 18. Horváth, P., Hosszú, G., Kovács, F., A proposed synthesis method for application-specific instruction set processors (2015) Microelectron. 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(2015) MICROELECTRONICS JOURNAL 0959-8324 1879-2391 46 12, Part: A 1114-1120<div class="JournalArticle Publication long-list"> <div class="authors"> <img title="Forrásközlemény" style="float: left" src="/frontend/resources/grid/publication-core-icon.png"> <img title="Idézőközlemény" style="float: left" src="/frontend/resources/grid/publication-citation-icon.png"> <div class="autype autype0"> <span class="author-name" mtid="10041090"><a href="/gui2/?type=authors&mode=browse&sel=10041090" target="_blank">Gergely Nagy (<span class="authorship-author-name">Nagy Gergely</span> <span class="authorAux-mtmt"> Mikroelektronika</span>) </a> </span> <span class="author-affil"><span title="Budapesti Műszaki és Gazdaságtudományi Egyetem">BME</span>/<span title="Villamosmérnöki és Informatikai Kar">VIK</span>/Elektronikus Eszközök Tanszéke</span> ;    <span class="author-name" mtid="10042323"><a href="/gui2/?type=authors&mode=browse&sel=10042323" target="_blank">Peter Horvath (<span class="authorship-author-name">Horváth Péter</span> <span class="authorAux-mtmt"> Elektronikus eszközök</span>) </a> </span> <span class="author-affil"><span title="Budapesti Műszaki és Gazdaságtudományi Egyetem">BME</span>/<span title="Villamosmérnöki és Informatikai Kar">VIK</span>/Elektronikus Eszközök Tanszéke</span> ;    <span class="author-name" mtid="10041061"><a href="/gui2/?type=authors&mode=browse&sel=10041061" target="_blank">Laszlo Pohl (<span class="authorship-author-name">Pohl László</span> <span class="authorAux-mtmt"> mikroelektronika</span>) </a> </span> <span class="author-affil"><span title="Budapesti Műszaki és Gazdaságtudományi Egyetem">BME</span>/<span title="Villamosmérnöki és Informatikai Kar">VIK</span>/Elektronikus Eszközök Tanszéke</span> ;    <span class="author-name" mtid="10001242"><a href="/gui2/?type=authors&mode=browse&sel=10001242" target="_blank">Andras Poppe (<span class="authorship-author-name">Poppe András</span> <span class="authorAux-mtmt"> Mikroelektronika</span>) </a> </span> <span class="author-affil"><span title="Budapesti Műszaki és Gazdaságtudományi Egyetem">BME</span>/<span title="Villamosmérnöki és Informatikai Kar">VIK</span>/Elektronikus Eszközök Tanszéke</span> </div> </div> <div class="title"><a href="/gui2/?mode=browse&params=publication;2908301" target="_blank">Advancing the thermal stability of 3D ICs using logi-thermal simulation</a></div> <div> <span class="journal-title">MICROELECTRONICS JOURNAL</span> <span class="journal-issn">(<a target="_blank" href="https://portal.issn.org/resource/ISSN/0959-8324">0959-8324</a> <a target="_blank" href="https://portal.issn.org/resource/ISSN/1879-2391">1879-2391</a>)</span>: <span class="journal-volume">46</span> <span class="journal-issue">12, Part: A</span> <span class="page"> pp 1114-1120 </span> <span class="year">(2015)</span> </div> <div class="pub-footer"> <span class="language" xmlns="http://www.w3.org/1999/html">Nyelv: Angol | </span> <span class="identifiers"> <span class="id identifier oa_PAY" title=" Fizetős "> <a style="color:blue" title="10.1016/j.mejo.2015.06.025" target="_blank" href="https://doi.org/10.1016/j.mejo.2015.06.025"> DOI </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:black" title="S0026269215001664" target="_blank" href="http://www.sciencedirect.com/science/article/pii/S0026269215001664"> ScienceDirect </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="000367859500003" target="_blank" href="https://www.webofscience.com/wos/woscc/full-record/000367859500003"> WoS </a> </span> <span class="id identifier oa_none" title="none"> <a style="color:blue" title="84939481874" target="_blank" href="http://www.scopus.com/record/display.url?origin=inward&eid=2-s2.0-84939481874"> Scopus </a> </span> </span> <OnlyViewableByAuthor><div class="ratings"> <div class="journal-subject">Folyóirat szakterülete: Scopus - Electrical and Electronic Engineering   SJR indikátor: Q2</div> <div class="journal-subject">Folyóirat szakterülete: Scopus - Atomic and Molecular Physics, and Optics   SJR indikátor: Q3</div> <div class="journal-subject">Folyóirat szakterülete: Scopus - Condensed Matter Physics   SJR indikátor: Q3</div> <div class="journal-subject">Folyóirat szakterülete: Scopus - Electronic, Optical and Magnetic Materials   SJR indikátor: Q3</div> <div class="journal-subject">Folyóirat szakterülete: Scopus - Nanoscience and Nanotechnology   SJR indikátor: Q3</div> <div class="journal-subject">Folyóirat szakterülete: Scopus - Surfaces, Coatings and Films   SJR indikátor: Q3</div> </div></OnlyViewableByAuthor> <div class="publication-citation" style="margin-left: 0.5cm;"> <span title="Nyilvános idézőközlemények összesen, említések nélkül" class="citingPub-count">Nyilvános idéző összesen: 19</span> | Független: 1 | Függő: 18 | Nem jelölt: 0 | WoS jelölt: 18 | Scopus jelölt: 19 | WoS/Scopus jelölt: 19 | DOI jelölt: 19 </div> <div class="publication-citation"> <a target="_blank" href="/api/publication?cond=citations.related;eq;2908301&sort=publishedYear,desc&sort=title"> Idézett közlemények száma: 7 </a> </div> <div class="mtid"><span class="long-pub-mtid">Közlemény: 2908301</span> | <span class="status-data status-ADMIN_APPROVED"> Admin láttamozott </span> <span class="oldId">Régi azonosító: 2908301</span> | Forrás Idéző | <span class="type-subtype">Folyóiratcikk ( Szakcikk ) </span> | <span class="pub-category">Tudományos</span> | <span class="publication-sourceOfData">kézi felvitel</span> </div> <div class="lastModified">Utolsó módosítás: 2021.01.18. 17:40 Sövény Emese (BME admin 5) </div> <pre class="comment" style="margin-top: 0; margin-bottom: 0;"><u>Megjegyzés</u>: Megjegyzés-25412368 Megjegyzés-26505942 PN A Issue: 12, Part: A WoS:hiba:000367859500003 2020-08-29 08:48 füzet nem egyezik</pre> </div></div>