Thermal Characterization for Dual Side SiP Module Technology

Chen, Bo-Syun; Chen, Tang-Yuan; Yang, Jin-Feng; Chin-Li-Kao; Chen, Yu-Chang; Yeh, Chan-Lin; Shih, Meng-Kai

English Conference paper (Chapter in Book) Scientific
Published: IEEE. 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). (2017) ISBN:9781538630426 , 4 p.
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    2026-03-14 03:38