20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)

Chris, Bailey [szerk.]; Marta, Rencz [Kerecsen Istvánné Rencz, Márta (Mikroelektronika), szerk.] Elektronikus Eszközök Tanszéke (BME / VIK); Bernhard, Wunderle [szerk.]

Angol nyelvű Konferenciakötet (Könyv) Tudományos

Megjelent: Institute of Electrical and Electronics Engineers (IEEE), New York (NY), Amerikai Egyesült Államok 2014

Konferencia: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14) 2014-09-24 [London, Egyesült Királyság / Anglia]

Azonosítók

MTMT: 2699429
ISBN: 9781479954155

Fejezetek

Codecasa Lorenzo et al. Multi-Port Dynamic Compact Thermal Models of Nonlinear Heat Conduction. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)
Elger G et al. Detection of solder joint cracking of high power leds on AI-IMS during temperature shock test by transient thermal analysis. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)
Ender Ferenc et al. In-situ Thermal Conductivity Measurement of Magnetic Nanoparticle Layers in Lab-on-a-Chip Devices. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)
G Farkas et al. Thermal transient measurement of insulated gate devices using the thermal properties of the channel resistance and parasitic elements. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)
Gusztáv Hantos et al. In Situ Thermal Reliability Testing Methodology for Novel Thermal Interface Materials. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)
János Mizsei et al. Scaling of Thermal-Electronic Logic Circuits. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)
Luiten W. Thermal characterization of a multi-heat source component with and without an external heat sink. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)
Nagy Gergely et al. Advancing the thermal stability of 3D-IC's using logi-thermal simulation. (2014) Megjelent: 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)
Poppe A et al. Characterization of heat-sinks of socketable LED modules using thermal transient testing. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)
Sarkany Zoltán et al. Separation of failure modes in short cycle time power cycling experiments. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)
Shahjalal Mohammad et al. A Review of the Computer Based Simulation of Electro-Thermal Design of Power Electronics Devices. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)
Zoltan Sarkany et al. Extracting model parameters from thermal transient measurements for thermal stress simulation. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)
B. Plesz et al. Issues of Thermal Transient Testing on Photovoltaic Modules. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14) pp. 1-4
Lorenzo Codecasa et al. FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC). (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14) pp. 1-6
Lorenzo Codecasa et al. Parametric Compact Thermal Models by Moment Matching for Variable Geometry. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14) pp. 1-6
P Anithambigai et al. A Comparison Study on Thermal Characterization of High Power LEDs with Different Ceramic Attach Adhesives for Automotive Lighting Applications. (2014) Megjelent: Proceedings of the 20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14) pp. 1-6

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20th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'14)

Chris, Bailey [szerk.]; Marta, Rencz [Kerecsen Istvánné Rencz, Márta (Mikroelektronika), szerk.] Elektronikus Eszközök Tanszéke (BME / VIK); Bernhard, Wunderle [szerk.]

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