Testing of power LEDs: The latest thermal testing standards from JEDEC

András, Poppe ✉ [Poppe, András (Mikroelektronika), szerző] Elektronikus Eszközök Tanszéke (BME / VIK)

Angol nyelvű Tudományos Szakcikk (Folyóiratcikk)
Megjelent: ELECTRONICS COOLING 19 (9) pp. 20-28 2013
    The electrical, thermal and optical parameters determining light emitting didoes (LEDs) operation are in a strong, mutual dependence; without knowledge about the parameters in one of these domains the other characteristics cannot be measured correctly. The reliability, useful operating life time and luminous flux are determined by the junction temperature of the LED device. This temperature is directly proportional to the total junction-to-ambient thermal resistance of the heat-flow path of the LED application. A dominant component of this overall thermal resistance is the junction-to-case thermal resistance of the LED package which is oneof the key data sheet entries among the electrical and light output properties of the device. Unfortunately, until recently, there has been no widely accepted standard or recommendation regarding the correct measurement of this thermal resistance. The article describes the most recent LED thermal testing standards published by JEDEC in 2012 together with the new transient method for the measurement of the junction-to-case thermal resistance of power semiconductor device packages with an exposed cooling surface – aimed at the correct measurement of LEDs’ thermal metrics for publication in a data sheet.
    Hivatkozás stílusok: IEEEACMAPAChicagoHarvardCSLMásolásNyomtatás
    2021-03-05 05:56