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without knowledge about the parameters in \none of these domains the other characteristics cannot be \nmeasured correctly. The reliability, useful operating life \ntime and luminous flux are determined by the junction \ntemperature of the LED device. This temperature is directly \nproportional to the total junction-to-ambient thermal \nresistance of the heat-flow path of the LED application. A \ndominant component of this overall thermal resistance is the \njunction-to-case thermal resistance of the LED package which \nis oneof the key data sheet entries among the electrical and \nlight output properties of the device. Unfortunately, until \nrecently, there has been no widely accepted standard or \nrecommendation regarding the correct measurement of this \nthermal resistance. The article describes the most recent LED \nthermal testing standards published by JEDEC in 2012 together \nwith the new transient method for the measurement of the \njunction-to-case thermal resistance of power semiconductor \ndevice packages with an exposed cooling surface – aimed at \nthe correct measurement of LEDs’ thermal metrics for \npublication in a data sheet.", "digital" : null, "printed" : null, "sourceYear" : 2013, "packet" : "bme-pa-migracio-20014-06-20-v01", "foreignEdition" : true, "foreignLanguage" : true, "fullPublication" : true, "conferencePublication" : false, "nationalOrigin" : true, "missingAuthor" : false, "oaType" : "NONE", "oaCheckDate" : "2023-07-19", "oaFree" : false, "oaByAuthor" : { "otype" : "Admin", "mtid" : 10025544, "link" : "/api/admin/10025544", "label" : "Lévayné Deseő Katalin (MTMT Központi admin)", "familyName" : "Lévayné Deseő", "givenName" : "Katalin", "published" : true, "oldId" : 10025544, "snippet" : true }, "citationCount" : 8, 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