In this paper we review the history of the static (continuous)
and dynamic (pulsed) test methods described in JEDEC JESD51-1.
Written in 1995, there has not been, to date and to the
knowledge of the authors, any systematic review to these
different approaches to the transient thermal testing of
packaged ICs and LEDs. Commercially available and in-house test
equipment perform either transient thermal testing according to
one approach or the other, but not both.