Electro-thermal and logi-thermal simulation of VLSI designs

Székely, V ✉ [Székely, Vladimir (Mikroelektronika), author] Department of Electron Devices (BUTE / FEEI); Budapest University of Technology; Poppe, A ✉ [Poppe, András (Mikroelektronika), author] Department of Electron Devices (BUTE / FEEI); Budapest University of Technology; Páhi, A; Csendes, A; Hajas, G; Rencz, M [Kerecsen Istvánné Rencz, Márta (Mikroelektronika), author] Department of Electron Devices (BUTE / FEEI); Budapest University of Technology

English Scientific Article (Journal Article)
    Identifiers
    Subjects:
      Due to severe thermal problems of today's VLSI integrated circuits the need for reliable and quick thermal, electro-thermal and logi-thermal simulation tools is increasing, In this paper, we discuss the latest advances in the SISSI package (simulator for integrated structures by simultaneous iteration) which is a tool developed originally for analog VLSI design, The improvements include electro-thermal ac and transient simulation and the consideration of the thermal voltage of Si-Al contacts, Furthermore, we introduce a new module of SISSI, LOGITHERM, which is aimed at the self-consistent logic and thermal simulation of large digital VLSI designs, The features of our simulator package are highlighted by simulation examples that are compared in most cases with measurement results.
      Citation styles: IEEEACMAPAChicagoHarvardCSLCopyPrint
      2021-07-31 08:21