Due to severe thermal problems of today's VLSI integrated circuits the need for reliable
and quick thermal, electro-thermal and logi-thermal simulation tools is increasing,
In this paper, we discuss the latest advances in the SISSI package (simulator for
integrated structures by simultaneous iteration) which is a tool developed originally
for analog VLSI design, The improvements include electro-thermal ac and transient
simulation and the consideration of the thermal voltage of Si-Al contacts, Furthermore,
we introduce a new module of SISSI, LOGITHERM, which is aimed at the self-consistent
logic and thermal simulation of large digital VLSI designs, The features of our simulator
package are highlighted by simulation examples that are compared in most cases with
measurement results.
