The microelectronics industry is moving toward smaller feature sizes. The main driving
forces are to improve performance and to lower cost. From the point of view of performance,
the small distances between chips together with the short interconnection routes have
of great importance in order to achieve faster operation. The application of polymers
for the insulating and protective layers of interconnect substrates is beneficial
to the performance and to the cost of a circuit module as well. In the article, the
application of advanced laser technology for pattern and via generation has become
an efficient tool for the fabrication of very high density interconnects substrates.
